Abstract:
A TFT array substrate is provided. The TFT array substrate includes a substrate, a patterned first metallic layer, a patterned semiconductor layer, a patterned transparent conductive layer, a patterned dielectric layer, and a patterned second metallic layer. Elements of each TFT of the TFT array substrate are arranged vertically, so that the TFT array substrate has relatively small fabrication area and is operable with a high conducting current. Further, the storage capacitance can be enhanced by enclosing or sandwiching the transparent electrodes with the common lines and the second metallic layer, or alternatively by enclosing or sandwiching the second metallic layer with the common lines and the transparent electrodes.
Abstract:
A liquid crystal display (LCD) array substrate and its manufacturing method are provided. Scan lines and data lines of the LCD array substrate are composed of two conductive layers to decrease their RC delay. Moreover, the dielectric layer and even the planarization layer are removed from pixel areas defined by the scan lines and the data lines to increase the light penetration percentage.
Abstract:
A non-volatile memory device includes a substrate, an insulating layer, a fin structure, a floating gate, an inter-gate dielectric and a control gate. The insulating layer is formed on the substrate and the fin structure is formed on the insulating layer. The fin structure may include a strained layer formed on a non-strained layer.
Abstract:
A pixel unit comprising a first metal layer and a second metal layer. The first metal layer comprises a gate electrode and a first electrode. The second metal layer comprises a drain electrode, a source electrode, and a second electrode. The drain electrode overlaps the gate electrode in a first overlapping region. The source electrode overlaps the gate electrode in a second overlapping region. The second electrode overlaps the first electrode in a third overlapping region. The size of the first electrode approximates that of the second electrode. The first electrode and the second electrode are staggered.
Abstract:
A computer network-based distributed presentation system and process is presented that controls the display of one or more video streams output by multiple video cameras located across multiple presentation sites on display screens located at each presentation site. The distributed presentation system and process provides the ability for a user at a site to customize the screen configuration (i.e., what video streams are display at any one time and in what format) for that site via a two-layer display director module. In the design layer of the module, a user interface is provided for a user to specify display priorities dictating what video streams are to be displayed on the screen over time. These display priorities are then provided to the execution layer of the module which translates them into probabilistic timed automata and uses the automata to control what is displayed on the display screen.
Abstract:
A non-volatile memory device includes a substrate, an insulating layer, a fin, an oxide layer, spacers and one or more control gates. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The oxide layer is formed on the fin and acts as a tunnel oxide for the memory device. The spacers are formed adjacent the side surfaces of the fin and the control gates are formed adjacent the spacers. The spacers act as floating gate electrodes for the non-volatile memory device.
Abstract:
A method of manufacturing a MOSFET type semiconductor device includes planarizing a gate material layer that is deposited over a channel. The planarization is performed in a multi-step process that includes an initial “rough” planarization and then a “fine” planarization. The slurry used for the finer planarization may include added material that tends to adhere to low areas of the gate material.
Abstract:
A method of fabricating a semiconductor device comprises forming a gate electrode over a substrate and forming deep amorphous regions within the substrate. And implanting dopants to form deep source/drain regions at a depth less than that of the deep amorphous regions, partially re-crystallizing portions of the deep amorphous regions to reduce their depth, and re-crystallizing the reduced amorphous regions to form activated final source/drain regions.
Abstract:
A method of reducing buried oxide undercut during FinFET formation includes forming a fin on a buried oxide layer and forming a source region adjacent a first end of the fin and a drain region adjacent a second end of the fin. The method further includes forming a sacrificial oxide layer over the fin and source and drain regions and forming a gate over the fin, wherein the sacrificial oxide layer reduces undercutting of the buried oxide layer during gate formation.
Abstract:
An organic light emitting diode (OLED) with a brightness enhancer. The OLED comprises a substrate having a first surface and a second surface oppositely. An anode electrode is disposed on the first surface of the substrate. An organic light emitting layer is disposed on the anode electrode. A cathode electrode is disposed on the organic light emitting layer. A brightness enhancer is disposed on the second surface of the substrate.