FinFET device with multiple fin structures
    1.
    发明授权
    FinFET device with multiple fin structures 有权
    FinFET器件具有多个鳍结构

    公开(公告)号:US07679134B1

    公开(公告)日:2010-03-16

    申请号:US10754515

    申请日:2004-01-12

    IPC分类号: H01L29/94

    摘要: A semiconductor device includes a group of fin structures. The group of fin structures includes a conductive material and is formed by growing the conductive material in an opening of an oxide layer. The semiconductor device further includes a source region formed at one end of the group of fin structures, a drain region formed at an opposite end of the group of fin structures, and at least one gate.

    摘要翻译: 半导体器件包括一组翅片结构。 翅片结构的组包括导电材料,并且通过在氧化物层的开口中生长导电材料而形成。 半导体器件还包括形成在鳍片结构组的一端处的源极区域,形成在鳍片结构组的相对端处的漏极区域和至少一个栅极。

    Varying carrier mobility in semiconductor devices to achieve overall design goals
    3.
    发明授权
    Varying carrier mobility in semiconductor devices to achieve overall design goals 有权
    在半导体器件中改变载波的移动性,实现总体设计目标

    公开(公告)号:US07095065B2

    公开(公告)日:2006-08-22

    申请号:US10633504

    申请日:2003-08-05

    IPC分类号: H01L29/80

    摘要: A semiconductor device may include a substrate and an insulating layer formed on the substrate. A first device may be formed on the insulating layer, including a first fin. The first fin may be formed on the insulating layer and may have a first fin aspect ratio. A second device may be formed on the insulating layer, including a second fin. The second fin may be formed on the insulating layer and may have a second fin aspect ratio different from the first fin aspect ratio.

    摘要翻译: 半导体器件可以包括衬底和形成在衬底上的绝缘层。 第一器件可以形成在绝缘层上,包括第一鳍片。 第一翅片可以形成在绝缘层上,并且可以具有第一翅片长宽比。 第二装置可以形成在绝缘层上,包括第二鳍片。 第二翅片可以形成在绝缘层上,并且可以具有与第一翅片长宽比不同的第二翅片长宽比。

    FULLY SILICIDED GATE STRUCTURE FOR FINFET DEVICES
    4.
    发明申请
    FULLY SILICIDED GATE STRUCTURE FOR FINFET DEVICES 有权
    FINFET器件的完全硅胶结构

    公开(公告)号:US20060177998A1

    公开(公告)日:2006-08-10

    申请号:US11379435

    申请日:2006-04-20

    IPC分类号: H01L21/3205

    摘要: A method may include forming a gate electrode over a fin structure, depositing a first metal layer on a top surface of the gate electrode, performing a first silicide process to convert a portion of the gate electrode into a metal-silicide compound, depositing a second metal layer on a top surface of the metal-silicide compound, and performing a second silicide process to form a fully-silicided gate electrode.

    摘要翻译: 一种方法可以包括在鳍结构上形成栅电极,在栅电极的顶表面上沉积第一金属层,执行第一硅化工艺以将栅电极的一部分转化为金属硅化物, 在金属硅化物化合物的顶表面上的金属层,并且执行第二硅化物处理以形成全硅化物栅电极。

    Semiconductor device having a thin fin and raised source/drain areas
    5.
    发明授权
    Semiconductor device having a thin fin and raised source/drain areas 有权
    半导体器件具有薄的鳍片和升高的源极/漏极区域

    公开(公告)号:US06911697B1

    公开(公告)日:2005-06-28

    申请号:US10632965

    申请日:2003-08-04

    摘要: A double-gate semiconductor device includes a substrate, an insulating layer, a fin, source and drain regions and a gate. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The source region is formed on the insulating layer adjacent a first side of the fin and the drain region is formed on the second side of the fin opposite the first side. The source and drain regions have a greater thickness than the fin in the channel region of the semiconductor device.

    摘要翻译: 双栅极半导体器件包括衬底,绝缘层,鳍,源极和漏极区以及栅极。 绝缘层形成在基板上,并且鳍形成在绝缘层上。 源极区域形成在与鳍片的第一侧相邻的绝缘层上,并且漏极区域形成在与第一侧相对的翅片的第二侧上。 源极和漏极区域具有比半导体器件的沟道区域中的鳍片更大的厚度。

    Double spacer FinFET formation
    9.
    发明授权
    Double spacer FinFET formation 有权
    双间隔FinFET形成

    公开(公告)号:US06709982B1

    公开(公告)日:2004-03-23

    申请号:US10303702

    申请日:2002-11-26

    IPC分类号: H01L21311

    摘要: A method for forming a group of structures in a semiconductor device includes forming a conductive layer on a substrate, where the conductive layer includes a conductive material, and forming an oxide layer over the conductive layer. The method further includes etching at least one opening in the oxide layer, filling the at least one opening with the conductive material, etching the conductive material to form spacers along sidewalls of the at least one opening, and removing the oxide layer and a portion of the conductive layer to form the group of structures.

    摘要翻译: 一种在半导体器件中形成一组结构的方法包括在基底上形成导电层,其中导电层包括导电材料,并在导电层上形成氧化物层。 该方法还包括蚀刻氧化物层中的至少一个开口,用导电材料填充至少一个开口,蚀刻导电材料以在至少一个开口的侧壁上形成间隔物,并且去除氧化物层和一部分 导电层形成一组结构。

    Double and triple gate MOSFET devices and methods for making same
    10.
    发明授权
    Double and triple gate MOSFET devices and methods for making same 有权
    双栅极和三栅极MOSFET器件及其制造方法

    公开(公告)号:US08580660B2

    公开(公告)日:2013-11-12

    申请号:US13523603

    申请日:2012-06-14

    IPC分类号: H01L29/72

    摘要: A double gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin, a first gate and a second gate. The first gate is formed on top of the fin. The second gate surrounds the fin and the first gate. In another implementation, a triple gate MOSFET includes a fin, a first gate, a second gate, and a third gate. The first gate is formed on top of the fin. The second gate is formed adjacent the fin. The third gate is formed adjacent the fin and opposite the second gate.

    摘要翻译: 双栅极金属氧化物半导体场效应晶体管(MOSFET)包括鳍状物,第一栅极和第二栅极。 第一个门形成在鳍的顶部。 第二个门围绕翅片和第一个门。 在另一实施方案中,三栅极MOSFET包括鳍片,第一栅极,第二栅极和第三栅极。 第一个门形成在鳍的顶部。 第二个门形成在翅片附近。 第三栅极形成在翅片附近并与第二栅极相对。