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    Electronic module having electromagnetic shielding structure and manufacturing method thereof
    151.
    发明授权
    Electronic module having electromagnetic shielding structure and manufacturing method thereof 有权

    公开(公告)号：US10531558B2

    公开(公告)日：2020-01-07

    申请号：US14970218

    申请日：2015-12-15

    Applicant: CYNTEC CO., LTD.

    Inventor： Ming-Che Wu

    IPC: H05K1/02 ,  H05K3/30 ,  H05K3/46

    Abstract: An electronic module having an electromagnetic shielding structure and its manufacturing method are provided. At first, a first substrate and a second substrate are separately provided. At least one electronic element and at least one connection pad are formed on a surface of the first substrate. The second substrate includes a conductive film and at least one conductive bump is formed on a surface of the conductive film. The first substrate and the second substrate are laminated together wherein the conductive bump is aligned with and connected to the connection pad to obtain the electronic module.

    Transformer
    153.
    发明授权
    Transformer 有权

    公开(公告)号：US10340074B2

    公开(公告)日：2019-07-02

    申请号：US15367194

    申请日：2016-12-02

    Applicant: CYNTEC CO., LTD.

    Inventor： Kuan-Yu Chiu ,  Chu-Keng Lin ,  Hsieh-Shen Hsieh

    IPC: H01F27/30 ,  H01F27/32 ,  H01F27/24 ,  H01F27/28

    Abstract: A transformer comprises a first core, a second core, a plurality of electrodes, an inner winding and an outer winding. The first core has a central hole. The second core is disposed in the central hole. The second core has two flanges and a pillar located between the two flanges. The inner winding is wound around the pillar. A first winding end of the inner winding is electrically connected to one of the electrodes. The inner winding comprises a first wire and a first insulating layer covering the first wire. The outer winding is wound around the inner winding. A second winding end of the outer winding is electrically connected to one of the electrodes. The outer winding comprises a second wire and a second insulating layer covering the second wire. Second thickness of the second insulating layer is larger than first thickness of the first insulating layer.

    Apparatus of coupled inductors with balanced electromotive forces
    155.
    发明授权
    Apparatus of coupled inductors with balanced electromotive forces 有权

    公开(公告)号：US10210992B2

    公开(公告)日：2019-02-19

    申请号：US15279379

    申请日：2016-09-28

    Applicant: CYNTEC CO., LTD.

    Inventor： Chia-Cheng Chuang

    IPC: H01F27/40 ,  H01F17/04 ,  H01F27/28 ,  H01F27/29 ,  H01F3/10

    Abstract: An apparatus of coupled inductors includes a first coil and a second coil arranged in a way that an inter-coil capacitance between the first coil and the second coil can keep electromotive forces induced by a first inductance of the first coil and a second inductance of the second coil about the same. As the current bypasses an unbalanced parasitic capacitor, a compensation capacitor disposed between the two coils can compensate the inter-coil capacitance of the parasitic capacitor. The apparatus of coupled inductors implemented with a specific coil arrangement or disposed with the compensation capacitor can keep the EMFs induced over the two inductances equal in amplitude, which prevents both the differential-mode and common-mode interference from being converted, improving the characteristics of mode conversion and is suitable to be utilized in a PoE system or the like.

    Filter and layout structure thereof
    156.
    发明授权
    Filter and layout structure thereof 有权

    公开(公告)号：US10158338B2

    公开(公告)日：2018-12-18

    申请号：US14549557

    申请日：2014-11-21

    Applicant: CYNTEC CO., LTD.

    Inventor： Shih-Hsien Tseng

    IPC: H03H7/01 ,  G06F17/30 ,  G11B27/031 ,  G11B27/10 ,  H03H3/007 ,  H03H1/00

    Abstract: A circuit structure is disclosed, wherein the circuit structure comprises: a substrate comprising a top surface, a bottom surface and lateral surfaces connecting the top surface and the bottom surface; a plurality of conductive layers disposed over the top surface of the substrate, wherein a dielectric layer is disposed between each two adjacent conductive layers, wherein at least one capacitor is formed by a first portion of the plurality of conductive layers with the dielectric layers therebetween, and wherein at least one first inductor is formed by a second portion of the plurality of conductive layers; and at least one conductive pattern layer disposed over at least one of the lateral surface to form at least one second inductor, wherein a third portion of the plurality of conductive layers electrically connects with said at least one capacitor, said at least one first inductor and said at least one second inductor.

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