Co-packaged light engine chiplets on switch substrate

    公开(公告)号:US11178473B1

    公开(公告)日:2021-11-16

    申请号:US16894611

    申请日:2020-06-05

    Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.

    SYSTEMS AND METHODS FOR TIMING RECOVERY WITH BANDWIDTH EXTENSION

    公开(公告)号:US20210336761A1

    公开(公告)日:2021-10-28

    申请号:US16860403

    申请日:2020-04-28

    Abstract: The present invention is directed to circuits and communication. More specifically, a specific embodiment of the present invention provides a timing recovery device with two stages. The first stage generates a clock signal to sample the received waveform, and the second stage provides timing-jitter mitigation. The second stage includes a jitter mitigation circuit with coefficients a function of the instantaneous jitter estimate, in addition to a jitter estimation tracking loop consisting of an error generator, a timing error detector and a loop filter to compensate for timing jitter associated with the clock signal. There are other embodiments as well.

    METHOD AND DEVICE FOR DIGITAL COMPENSATION OF DYNAMIC DISTORTION IN HIGH-SPEED TRANSMITTERS

    公开(公告)号:US20210297294A1

    公开(公告)日:2021-09-23

    申请号:US17224835

    申请日:2021-04-07

    Abstract: A device and method of operation for digital compensation of dynamic distortion. The transmitter device includes at least a digital-to-analog converter (DAC) connected to a lookup table (LUT), a first shift register, and a second shift register. The method includes iteratively adjusting the input values via the LUT to induce changes in the DAC output that compensate for dynamic distortion, which depends on precursors, current cursors, and postcursors. More specifically, the method includes producing and capturing average output values for each possible sequence of three symbols using the shift register and LUT configuration. Then, the LUT is updated with estimated values to induce desired output values that are adjusted to eliminate clipping. These steps are performed iteratively until one or more check conditions are satisfied. This method can also be combined with techniques such as equalization, eye modulation, and amplitude scaling to introduce desirable output signal characteristics.

    Retimer data communication modules
    166.
    发明授权

    公开(公告)号:US11121955B2

    公开(公告)日:2021-09-14

    申请号:US16848597

    申请日:2020-04-14

    Abstract: A data communication device includes a host receive section for receiving incoming host data from a host device. The host receive section includes a plurality of host receive lanes. A host transmit section for transmitting outgoing host data to the host device includes a plurality of host transmit lanes and a host cross point section. A line receive section for receiving incoming line data from a line device includes a plurality of line receive lanes. A line transmit section for transmitting outing line data to the line device includes a plurality of line transmit lanes and a line cross point section. A link monitor section coupled to the host transmit section and the line receive section is configured to detect errors between the host transmit section and the line receive section.

    INDUCTORS WITH COMPENSATED ELECTROMAGNETIC COUPLING

    公开(公告)号:US20210280349A1

    公开(公告)日:2021-09-09

    申请号:US17096419

    申请日:2020-11-12

    Abstract: The present invention is directed to electrical circuits. and more specially, inductor designs that reduce on-chip electromagnetic coupling in certain applications. In a specific embodiment, the present invention provides an inductor that includes coils that are configured to generate magnetic fields of opposite polarities. The electromagnetic fields generated by the inductor coils substantially cancel out with each other, thereby minimizing parasitic inductance of the inductor and reducing interference with operations of other components in an integrated circuit. There are other embodiments as well.

    Heatsink for co-packaged optical switch rack package

    公开(公告)号:US11109515B1

    公开(公告)日:2021-08-31

    申请号:US16894639

    申请日:2020-06-05

    Abstract: An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.

    LIGHT SOURCE FOR INTEGRATED SILICON PHOTONICS

    公开(公告)号:US20210265805A1

    公开(公告)日:2021-08-26

    申请号:US17169037

    申请日:2021-02-05

    Abstract: A light source based on integrated silicon photonics includes a die of a silicon substrate having at least one chip site configured with a surface region, a trench region, and a first stopper region located separately between the surface region and the trench region. The trench region is configured to be a depth lower than the surface region. The light source includes a laser diode chip having a p-side facing the chip site and a n-side being distal to the chip site. The p-side includes a gain region bonded to the trench region, an electrode region bonded to the surface region, and an isolation region engaged with the stopper region to isolate the gain region from the electrode region. The light source also includes a conductor layer in the die configured to connect the gain region to an anode electrode and separately connect the electrode region to a cathode electrode.

    TAP STABILIZER METHOD AND STRUCTURE FOR COHERENT OPTICAL RECEIVER

    公开(公告)号:US20210152255A1

    公开(公告)日:2021-05-20

    申请号:US17162884

    申请日:2021-01-29

    Abstract: A method and structure for a coherent optical receiver device. Timing recovery (TR) is implemented after channel dispersion (i.e., chromatic dispersion (CD) and polarization mode dispersion (PMD)) compensation blocks. This architecture provides both improves performance and reduces power consumption of the device. Also, a TR loop is provided, enabling computing, by an error evaluation module, a first sampling phase error (SPE) and computing, by a timing phase information (TPI) module coupled to the error evaluation module, a second SPE from a plurality of CD equalizer taps PMD equalizer taps. The first and second SPE are combined into a total phase error (TPE) in a combining module, and the resulting TPE is filtered by a timing recovery (TR) filter coupled to an interpolated timing recovery (ITR) module and the combining module. The ITR module then synchronizes an input signal of the coherent optical receiver according to the TPE.

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