公开(公告)号：US20220368100A1

公开(公告)日：2022-11-17

申请号：US17712932

申请日：2022-04-04

Applicant: STMicroelectronics PTE LTD

Inventor： Loic Pierre Louis RENARD

IPC: H01S5/026 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0239 ,  G02F1/01 ,  H01S5/183

Abstract: An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

公开(公告)号：US11245273B2

公开(公告)日：2022-02-08

申请号：US16282097

申请日：2019-02-21

Applicant: STMicroelectronics Pte Ltd

Inventor： Prabhu Jyoti ,  Cho Seng Dominic Tay

IPC: H02J7/00 ,  H01M50/10 ,  H01M50/20 ,  H01M50/204 ,  H01M50/207 ,  H01M10/46

Abstract: A battery charging system includes a first electrical connector disposed facing a first shelf, a second electrical connector disposed facing a second shelf, a first charge device coupled to the first electrical connector, and a second charge device coupled to the second electrical connector. A mobile device includes a first electrical connector, a first shelf portion and a second shelf portion, which are facing the first electrical connector, and a third shelf portion and a fourth shelf portion, which are facing the second electrical connector. Each of the electrical connectors of the battery charging system and the mobile device includes a first conductor, a second conductor, and a third conductor, with the first conductor electrically coupled to the third conductor, and the second conductor electrically isolated from and disposed between the first and third conductors, which enable the battery charging system and mobile device to easily swap batteries.

公开(公告)号：US20210305438A1

公开(公告)日：2021-09-30

申请号：US17187510

申请日：2021-02-26

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS PTE LTD

Inventor： David GANI ,  Yiying KUO

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0392

Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.

公开(公告)号：US20210193476A1

公开(公告)日：2021-06-24

申请号：US17096434

申请日：2020-11-12

Applicant: STMicroelectronics Pte Ltd

Inventor： Yuzhan WANG ,  Pradeep BASAVANAHALLI KUMARSWAMY ,  Hong Kia KOH ,  Alberto LEOTTI ,  Patrice RAMONDA

IPC: H01L21/3105 ,  H01L21/762

Abstract: A first dielectric layer made of a first dielectric material is deposited over a semiconductor substrate. A buffer layer is then deposited on an upper surface of the first dielectric layer. A trench is opened to extend through the buffer layer and the first dielectric layer. A second dielectric layer made of a second dielectric material is the deposited in a conformal manner on the buffer layer and filling the trench. Chemical mechanical polishing of the second dielectric layer is performed to remove overlying portions of the second dielectric layer with the buffer layer being used as a polish stop. After removing the buffer layer, the first dielectric layer and the second dielectric material filling the trench form a pre-metallization dielectric layer having a substantially planar upper surface.

公开(公告)号：US11009474B2

公开(公告)日：2021-05-18

申请号：US16217631

申请日：2018-12-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Malek Brahem ,  Hatem Majeri ,  Olivier Le Neel ,  Ravi Shankar

IPC: G01N7/00 ,  G01N21/00 ,  G01N27/00 ,  G01N31/00 ,  G01N33/00 ,  G01N27/12

Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.

公开(公告)号：US10768133B2

公开(公告)日：2020-09-08

申请号：US15723661

申请日：2017-10-03

Applicant: STMicroelectronics Pte Ltd

Inventor： Ravi Shankar ,  Olivier Le Neel ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: G01N27/12 ,  G01N27/22

Abstract: Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with a support material that provides structural integrity. The solid state gas sensor module can be integrated on top of an ASIC on a common substrate. With sufficient thermal insulation, such a gas detector can be provided as a low-power component of mobile electronic devices such as smart phones. A method of operating a multi-sensor array allows detection of relative concentrations of different gas species by either using dedicated sensors, or by thermally tuning the sensors to monitor different gas species.

公开(公告)号：US10684389B2

公开(公告)日：2020-06-16

申请号：US16107911

申请日：2018-08-21

Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

IPC: H01L31/167 ,  G01V8/12 ,  H01L25/16

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

公开(公告)号：US20200075475A1

公开(公告)日：2020-03-05

申请号：US16550775

申请日：2019-08-26

Applicant: STMicroelectronics Pte Ltd

Inventor： Daniel Yap ,  Hung Meng Loh

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

Abstract: A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked portion. The method includes depositing solder paste on the unmasked portions of the thermal pad and placing an exposed thermal pad of an integrated circuit package on the solder paste deposited on the thermal pad of the printed circuit board. The method includes forming a solder connection by heating the solder paste between the unmasked portions of the thermal pad on the printed circuit board and the exposed thermal pad of the integrated circuit package.

公开(公告)号：US20200033309A1

公开(公告)日：2020-01-30

申请号：US16458561

申请日：2019-07-01

Applicant: STMicroelectronics PTE LTD

Inventor： Fangxing YUAN ,  Ravi SHANKAR ,  Olivier LE NEEL

IPC: G01N33/00 ,  G01N29/22

Abstract: The present disclosure is directed to a selective multi-gas sensor device that detects when a high concentration level of a particular gas, such as methane, carbon monoxide, and/or ethanol, is present. The selective multi-gas sensor device detects and identifies a particular gas based on a ratio between a sensitivity of a gas sensitive material at a first temperature and a sensitivity of the gas sensitive material at a second temperature.

公开(公告)号：US20190363123A1

公开(公告)日：2019-11-28

申请号：US16536984

申请日：2019-08-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

IPC: H01L27/146 ,  H01L31/0203

Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.