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公开(公告)号:US20190290826A1
公开(公告)日:2019-09-26
申请号:US16400395
申请日:2019-05-01
Applicant: International Business Machines Corporation
Inventor: Sarah K. Czaplewski-Campbell , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
Abstract: A process includes removing air bubbles from extracorporeal blood via chemical entrapment of nitrogen (N2) gas.
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公开(公告)号:US10405541B2
公开(公告)日:2019-09-10
申请号:US14693027
申请日:2015-04-22
Applicant: International Business Machines Corporation
Inventor: Joseph Kuczynski , Jason T. Wertz , Jing Zhang
IPC: C08J7/12 , A01N25/28 , C11B9/00 , D06M23/12 , D06M101/06
Abstract: In an example, a process for bonding a microcapsule having an encapsulating payload to a polymeric material. The process includes applying a microcapsule (having the encapsulated payload) that includes a dienophile functional group to a polymeric material that includes a diene functional group. The process further includes bonding the microcapsule having the encapsulated payload to the polymeric material via a chemical reaction of the dienophile functional group with the diene functional group.
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公开(公告)号:US10391226B2
公开(公告)日:2019-08-27
申请号:US15426549
申请日:2017-02-07
Applicant: International Business Machines Corporation
Inventor: Sarah K. Czaplewski , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
Abstract: A process includes removing air bubbles from extracorporeal blood via chemical entrapment of nitrogen (N2) gas.
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164.
公开(公告)号:US20190232335A1
公开(公告)日:2019-08-01
申请号:US16382460
申请日:2019-04-12
Applicant: International Business Machines Corporation
Inventor: Daniel J. Buvid , Eric J. Campbell , Tyler Jandt , Joseph Kuczynski
IPC: B05D7/22 , B05D5/08 , C09D183/04 , H05K7/20 , C09D5/08
CPC classification number: B05D7/22 , B05D5/08 , B05D5/083 , B05D7/222 , C08G77/16 , C09D5/086 , C09D183/04 , H01L23/473 , H05K7/20254 , H05K7/20272 , H05K7/20772
Abstract: An inside surface of a hose for use with liquid-cooled cooling plate assemblies and other applications that contain copper (Cu) components is pre-treated with a hydrophobic coating to reduce depletion of a copper corrosion inhibitor (e.g., benzotriazole (BTA)) dissolved in a liquid coolant (e.g., deionized water) that flows through the hose. Exemplary hydrophobic coatings include, but are not limited to, polydialkylsiloxanes such as polydimethylsiloxanes. In one embodiment, a multilayer hose is immersed in a solution containing hydrophobizing siloxane monomers dissolved in a solvent. The coated multilayer hose is then dried to evaporate the solvent. As the solvent evaporates, the siloxane monomers bind together to form the hydrophobic coating. In some embodiments, one or more hoses each provided with a hydrophobic coating interconnect liquid-coolant cooling system components (e.g., cold plates, headers, manifolds, pumps, reservoirs, and heat exchangers) of a cooling apparatus that removes heat from one or more electronic components.
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公开(公告)号:US10357921B2
公开(公告)日:2019-07-23
申请号:US15603686
申请日:2017-05-24
Applicant: International Business Machines Corporation
Inventor: Eric J. Campbell , Sarah K. Czaplewski , Joseph Kuczynski , Timothy J. Tofil
IPC: C08F2/50 , B29C65/00 , C08G59/18 , C08G59/68 , C09K11/07 , C09K11/02 , C08J3/12 , C08F2/48 , C09J5/02 , F16B11/00 , H01L23/00
Abstract: A process of utilizing a light generating microcapsule to cure a photo-curable material includes dispersing a microcapsule in an interface material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon generated within the microcapsule exits the microcapsule into the interface material to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.
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166.
公开(公告)号:US20190210352A1
公开(公告)日:2019-07-11
申请号:US16357037
申请日:2019-03-18
Applicant: International Business Machines Corporation
Inventor: Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer, III
IPC: B33Y10/00 , C09D11/30 , C09D11/106 , B29C64/112 , C09D133/14 , C09D4/06 , B33Y30/00 , B33Y70/00
CPC classification number: B33Y10/00 , B29C64/112 , B33Y30/00 , B33Y50/02 , B33Y70/00 , C09D4/06 , C09D11/106 , C09D11/30 , C09D133/14 , Y10T428/24802
Abstract: Thermally cross-linkable photo-hydrolyzable inkjet printable polymers are used to print microfluidic channels layer-by-layer on a substrate. In one embodiment, for each layer, an inkjet head deposits droplets of a mixture of hydrophobic polymer and cross-linking agent in a pattern lying outside a two-dimensional layout of the channels, and another inkjet head deposits droplets of a mixture of poly(tetrahydropyranyl methacrylate) PTHPMA (or another hydrophobic polymer which hydrolyzes to form a hydrophilic material), cross-linking agent, and a photoacid generator (PAG) in a pattern lying inside the two-dimensional layout of the channels. After all layers are printed, flood exposure of the entire substrate to UV radiation releases acid from the PAG which hydrolyzes PTHPMA to form hydrophilic poly(methacrylic acid) PMAA, thereby rendering the PTHPMA regions hydrophilic. The layers of these now-hydrophilic patterned regions together define the microfluidic channels. The cross-linking agent (e.g., triallyl isocyanurate TAIC) forms covalent cross-links between the two polymer phases.
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公开(公告)号:US10342122B2
公开(公告)日:2019-07-02
申请号:US16040790
申请日:2018-07-20
Applicant: International Business Machines Corporation
Inventor: Bruce J. Chamberlin , Scott B. King , Joseph Kuczynski , David J. Russell
Abstract: An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.
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公开(公告)号:US20190182967A1
公开(公告)日:2019-06-13
申请号:US16273923
申请日:2019-02-12
Applicant: International Business Machines Corporation
Inventor: Joseph Kuczynski , Bruce Chamberlin , Scott B. King , Matthew Kelly
Abstract: A stubless via in printed wiring board may comprise one or more core layers. At least one core layer may be circuitized by including a copper trace and at least two other core layers may include copper laminations. The stubless via may further comprise one or more prepreg layers. The prepreg layers may be alternatively stacked between the core layers. the stubless via may further comprise a via. the via may be drilled through each of the alternatively stacked prepreg layers and core layers, exposing internal portions of the prepreg layers and core layers drilled through.
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公开(公告)号:US10316172B2
公开(公告)日:2019-06-11
申请号:US15814049
申请日:2017-11-15
Applicant: International Business Machines Corporation
Inventor: Sarah K. Czaplewski , Joseph Kuczynski , Jason T. Wertz , Jing Zhang
IPC: C08K9/06 , B29C45/00 , B29C45/40 , B29C70/64 , B29K105/16 , B29K509/02
Abstract: A composition of matter includes a particle, a resin bonding functionality bonded to a first portion of the particle, and a lubricating functionality bonded to a second portion of the particle.
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公开(公告)号:US10316151B2
公开(公告)日:2019-06-11
申请号:US14954409
申请日:2015-11-30
Applicant: International Business Machines Corporation
Inventor: Dylan J. Boday , Joseph Kuczynski , Timothy C. Mauldin
IPC: C09K5/00 , C08G81/02 , C08F299/04 , C08G63/676 , H01L23/373 , H01L23/427 , H01L23/00
Abstract: In an example, a thermal interface material includes a polymeric phase-change material.
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