VIA STUB ELIMINATION BY DISRUPTING PLATING
    168.
    发明申请

    公开(公告)号:US20190182967A1

    公开(公告)日:2019-06-13

    申请号:US16273923

    申请日:2019-02-12

    Abstract: A stubless via in printed wiring board may comprise one or more core layers. At least one core layer may be circuitized by including a copper trace and at least two other core layers may include copper laminations. The stubless via may further comprise one or more prepreg layers. The prepreg layers may be alternatively stacked between the core layers. the stubless via may further comprise a via. the via may be drilled through each of the alternatively stacked prepreg layers and core layers, exposing internal portions of the prepreg layers and core layers drilled through.

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