Compact manufacturing device, and inter-device transport system for production line

    公开(公告)号:US10332768B2

    公开(公告)日:2019-06-25

    申请号:US15531962

    申请日:2015-12-01

    Abstract: A compact manufacturing device to automatically transport a wafer transport container. The compact manufacturing device comprises a processing chamber and a device front chamber provided inside a housing, a container mounting table provided in the housing to mount a substrate transport container accommodating a processing substrate, and a container transport mechanism. The container transport mechanism delivers the substrate transport container to the adjacent compact manufacturing device along a container transport path and/or receives the substrate transport container from adjacent compact manufacturing device along the container transport path when a plurality of the compact manufacturing devices are provided in parallel.

    MALIGNANT TUMOR TARGET PEPTIDE
    173.
    发明申请

    公开(公告)号:US20190175684A1

    公开(公告)日:2019-06-13

    申请号:US16326120

    申请日:2017-08-16

    Abstract: The present invention provides a peptide comprising the amino acid sequence of any of the formulas (I-(III) below: (I) an amino acid sequence of (X1)[D]P[D](X2)[D] wherein X1 is W or F, X2 is S or T, and each amino acid symbol immediately followed by symbol [D] is a D form of the amino acid, (II) an amino acid sequence of P[D]T[D](X)n F[D] wherein (X)n is any amino acid in the number of n selected independently of each other, n is an integer of 0-4, and the symbol [D] is as defined above, (III) an amino acid sequence that is a Retro-inverso of the amino acid sequence of any of the aforementioned (I) and the aforementioned (II); and a conjugate containing the peptide and a functional part.

    TRANSPORT CONTAINER AUTOMATIC CLAMPING MECHANISM

    公开(公告)号:US20190164797A1

    公开(公告)日:2019-05-30

    申请号:US16182891

    申请日:2018-11-07

    Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.

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