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公开(公告)号：US12261096B2
公开(公告)日：2025-03-25
申请号：US17980890
申请日：2022-11-04
Inventor： Shinya Ito
IPC: H01L23/427
Abstract: A radiator module includes a heat pipe and a terminal. The heat pipe includes a first plate and a second plate between which a refrigerant channel is defined, and a support member extending from the first plate to the second plate. The terminal is joined to a connection body of the first plate and the support member from outside of the heat pipe. The support member is located within a range that overlaps a joint portion of the terminal and the connection body when viewed in a thickness direction of the first plate.
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公开(公告)号：US20250092569A1
公开(公告)日：2025-03-20
申请号：US18777952
申请日：2024-07-19
Inventor： Daisuke UEMATSU
Abstract: A silicon carbide single crystal manufacturing apparatus includes a pressure sensor and a computing device. The pressure sensor is configured to measure a gas pressure of a supply gas containing a silicon carbide raw material gas and introduced into a crucible through a gas introducing pipe. The computing device is configured to perform a prediction of a clogging time, which is a time until the gas introduction pipe is clogged with a solid deposit, based on the gas pressure measured by the pressure sensor a learning model created by machine learning using data calculated from results of simulations of growing the silicon carbide single crystal and results of experiments of growing the silicon carbide single crystal.
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公开(公告)号：US20250080906A1
公开(公告)日：2025-03-06
申请号：US18785539
申请日：2024-07-26
Inventor： TAKASHI TAKAZAWA , SHUHEI SHIMANOE , TOMOKI TANEMURA , MASAAKI KAWAUCHI
IPC: H04R3/00
Abstract: A microphone device has plural microphones. A distance between two of the microphones is d. A signal-to-noise ratio of each of the microphones is MicSNR. A speed of sound is c. A frequency to be processed is f. An azimuth angle of an operator's seat relative to the microphones is θ. A minimum azimuth angle to be detected is Δθ. A voltage amplitude of an output signal of the microphone, with reference to a voltage output when a sound of 94 dBA is received, is A. A differential voltage effective ratio EDER is defined by a formula where Δτ=d/c {sin(θ+Δθ)−sin θ}, and the distance d is set to a value that satisfies d 0.7.
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公开(公告)号：US20250054875A1
公开(公告)日：2025-02-13
申请号：US18680085
申请日：2024-05-31
Inventor： MASASHI UECHA , YUJI NAGUMO , TAKAYA SHIMONO
IPC: H01L23/544 , H01L21/683 , H01L21/82 , H01L29/16 , H01L29/66
Abstract: A semiconductor device includes a semiconductor substrate having first and second main surfaces, first and second side surfaces opposite to each other in a first direction, and third and fourth side surfaces opposite to each other in a second direction perpendicular to the first direction, and a pattern structure disposed on the first main surface. The pattern structure within a first predetermined distance from the first side surface along the first direction and the pattern structure within the first predetermined distance from the second side surface along the first direction are symmetrical with respect to a line extending in the second direction. The pattern structure within a second predetermined distance from the third side surface along the second direction and the pattern structure within the second predetermined distance from the fourth side surface along the second direction are symmetrical with respect to a line extending in the first direction.
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公开(公告)号：US20240413045A1
公开(公告)日：2024-12-12
申请号：US18661813
申请日：2024-05-13
Inventor： Masayuki KAMIYA
IPC: H01L23/373
Abstract: A heat dissipation plate of a semiconductor module includes a first heat dissipation portion and a second heat dissipation portion formed of a material having anisotropic thermal conductivity. The first heat dissipation portion includes a position facing a semiconductor element in a thickness direction of the heat dissipation plate, and has higher thermal conductivity in a planar direction of a first virtual plane parallel to the thickness direction than in a direction perpendicular to the planar direction of the first virtual plane. The second heat dissipation portion is connected to the first heat dissipation portion in a direction parallel to the planar direction of the first virtual plane and perpendicular to the thickness direction, and has higher thermal conductivity in a planar direction of a second virtual plane perpendicular to the thickness direction than in a direction perpendicular to the planar direction of the second virtual plane.
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Patent Agency Ranking
公开(公告)号：US20240387318A1
公开(公告)日：2024-11-21
申请号：US18631290
申请日：2024-04-10
Inventor： Ryota KOJIMA , Akihiro YAMAGUCHI
IPC: H01L23/367 , H01L23/31 , H01L23/373 , H01L23/473 , H01L25/07 , H02M3/335
Abstract: A semiconductor device includes a wiring board having a wiring pattern, a semiconductor package, and a heat dissipation member. The semiconductor package includes a heat dissipation substrate, a semiconductor chip formed with a semiconductor element and arranged on the heat dissipation substrate, and an element pad electrically connected to the semiconductor chip. The semiconductor package is mounted on the wiring board, and the element pad is connected to the wiring pattern. The heat dissipation member is disposed opposite to the wiring board with respect to the semiconductor package, and is thermally connected to the insulating heat dissipation substrate. The wiring pattern includes a heat dissipation pattern that is connected to the semiconductor element and allows a current according to an operation of the semiconductor element to flow. A heat dissipation connection member is disposed between the heat dissipation pattern and the insulating heat dissipation substrate to thermally connect therebetween.
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公开(公告)号：US20240387085A1
公开(公告)日：2024-11-21
申请号：US18631670
申请日：2024-04-10
Inventor： TAKASHI YAMADA
Abstract: A transformer includes a printed circuit board and a core. The printed circuit board includes wiring layers and an insulating layer sandwiched between the adjacent wiring layers. The core penetrates the printed circuit board. Each of the wiring layers includes a first winding pattern and a second winding pattern arranged to surround the core, and the first winding pattern and the second winding pattern in each of the wiring layers are insulated from each other. The first winding patterns of the adjacent wiring layers are connected by a first via in the insulating layer, and the first winding patterns of the wiring layers are connected in series to constitute a first coil. The second winding patterns of the adjacent wiring layers are connected by a second via in the insulating layer, and the second winding patterns of the wiring layers are connected in series to constitute a second coil.
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公开(公告)号：US12123943B2
公开(公告)日：2024-10-22
申请号：US17463072
申请日：2021-08-31
Inventor： Masato Kohtani
IPC: G01S13/931 , G01S7/03 , G01S13/02
CPC classification number: G01S13/931 , G01S7/03 , G01S2013/0245
Abstract: A radar device for a vehicle includes: two or more receiving channels, each of which includes a mixer. At least one or more of the receiving channels includes: a phased array antenna divided into at least two or more branches to provide sub-array antenna elements; and a first phase shifter and a variable gain amplifier as a high frequency unit disposed between each of the sub-array antenna elements and the mixer. A numerical number of the sub-array antenna elements is equal to or more than a numerical number of the high-frequency units.
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公开(公告)号：US12104904B2
公开(公告)日：2024-10-01
申请号：US17516821
申请日：2021-11-02
Inventor： Teruhisa Akashi , Hirofumi Funabashi , Yuuki Inagaki
IPC: B81C1/00 , G01C19/5691
CPC classification number: G01C19/5691 , B81C1/00182 , B81B2201/0242
Abstract: A support structure for a micro-vibrator includes: a micro-vibrating body having a curved surface portion and a recess recessed from the curved surface portion; and a support member having a rod and an adhesive member arranged at a tip end of the rod. The support member is adhered on a connecting surface of the recess through the adhesive member. The connecting surface of the recess is an internal bottom surface of the recess.
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公开(公告)号：US12101105B2
公开(公告)日：2024-09-24
申请号：US17967095
申请日：2022-10-17
Inventor： Kofi Afolabi Anthony Makinwa , Zhong Tang
Abstract: A delta-sigma modulation type A/D converter includes: a capacitively coupled amplifier having a sampling capacitor, a feedback capacitor, and an amplifier; a correlated double sampling type first integrator as a first-stage integrator, which is connected to the capacitively coupled amplifier without a switch; a second integrator arranged after the first integrator; a quantizer arranged after the second integrator and quantizing an output of the second integrator; and an D/A converter that D/A-converts an output of the quantizer and feeds back to any one of the capacitively coupled amplifier, the first integrator, and the second integrator.
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