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11.发明申请APPARATUS AND METHOD FOR DETAPING AN ADHESIVE LAYER FROM THE SURFACE OF ULTRA THIN WAFERS 有权用于从超薄薄膜表面去除粘合层的装置和方法公开(公告)号：US20110290415A1
公开(公告)日：2011-12-01
申请号：US13115232
申请日：2011-05-25
申请人： GREGORY GEORGE
发明人： GREGORY GEORGE
CPC分类号： H01L21/6835 , H01L21/67132 , H01L2221/68327 , H01L2221/68381
摘要： An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck is configured to support and hold a wafer that comprises an adhesive layer on its top surface. The contact roller comprises an elongated cylindrical body extending along a first axis passing through its center and is configured to rotate around the first axis and to move linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller comprises an elongated cylindrical body extending along a second axis passing through its center and is configured to rotate around the second axis. The second axis is parallel to the first axis and the pick-up roller is arranged at a first distance from the contact roller. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller comprises a 360° degrees circular surface layer rolled around and attached to its outer cylindrical surface. The contact roller further includes means for attaching the detaping tape onto the adhesive layer by rotating clock-wise around its axis and linearly moving along a first direction over the wafer and means for contacting the adhesive layer with the 360° degrees circular surface layer.
摘要翻译： 用于从晶片表面去除粘合剂层的装置包括卡盘，接触罗拉，拾取辊和装订带。 卡盘构造成在其顶表面上支撑并保持包括粘合剂层的晶片。 接触罗拉包括细长的圆柱体，其沿着穿过其中心的第一轴线延伸并且构造成围绕第一轴线旋转并沿垂直于第一轴线的方向在卡盘和被支撑的晶片上线性移动。 拾取辊包括沿着通过其中心的第二轴线延伸的细长圆柱形主体，并且构造成围绕第二轴线旋转。 第二轴线平行于第一轴线，并且拾取辊子与接触辊子相距第一距离。 拾取带卷绕接触辊和拾取辊，并且当其卷绕时附着到粘合剂层，然后与粘合剂层一起去除。 接触辊包括360°圆形表面层，其卷绕并附接到其外圆柱形表面。 接触辊还包括用于通过围绕其轴线顺时针旋转并沿着晶片上的第一方向线性移动并将粘合剂层与360°圆形表面层接触的装置，将去皮带附着到粘合剂层上的装置。
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公开(公告)号：US20110253315A1
公开(公告)日：2011-10-20
申请号：US13087137
申请日：2011-04-14
申请人： GREGORY GEORGE
发明人： GREGORY GEORGE
CPC分类号： B32B43/006 , B32B38/1858 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67103 , H01L21/67132 , H01L21/68 , H01L21/6835 , H01L21/6838 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381
摘要： A debonder apparatus for debonding a temporary bonded wafer pair includes a clam-shell type reactor, an upper chuck and a lower chuck. The reactor includes first and second isolated chambers. The upper chuck is contained within the first chamber and has a lower surface protruding into the second chamber and an edge configured to be held in fixed position via clamping means. The lower chuck is contained within the second chamber and has an upper surface oriented parallel and opposite to the lower surface of the upper chuck. The debonder apparatus also includes means for holding an unbonded surface of the first wafer of the temporary bonded wafer pair onto the lower surface of the upper chuck, and means for pressurizing the first chamber. The first chamber pressurizing means applies pressure onto an upper surface of the upper chuck while the upper chuck edge is held in fixed position via the clamping means, and thereby causes the lower surface of the upper chuck and the attached wafer pair to bow downward. The debonder apparatus also includes means for initiating a separation front at a point of the bonding interface of the temporary bonded wafer pair. The debonder apparatus also includes means for pressurizing the second chamber while the first chamber pressure is reduced thereby causing removal of the downward bowing of the upper chuck and the attached wafer pair and propagation of the separation front through the entire bond interface. The debonder apparatus also includes means for attaching the unbonded surface of the separated second wafer onto the upper surface of the lower chuck.
摘要翻译： 用于剥离临时键合晶片对的脱粘器装置包括蛤壳型反应器，上夹头和下卡盘。 反应器包括第一和第二隔离室。 上部卡盘容纳在第一腔室内，并且具有突出到第二腔室中的下表面和构造成通过夹紧装置保持在固定位置的边缘。 下卡盘包含在第二腔室内，并具有与上卡盘的下表面平行且相对的上表面。 剥离器装置还包括用于将临时粘合的晶片对的第一晶片的未结合表面保持在上卡盘的下表面上的装置，以及用于对第一腔室加压的装置。 第一室加压装置通过夹紧装置将上夹盘边缘保持在固定位置，将压力施加到上卡盘的上表面上，从而使上夹盘的下表面和附接的晶片对向下弯曲。 脱粘器装置还包括用于在临时粘合晶片对的接合界面的点处启动分离前端的装置。 脱粘器装置还包括用于在第一室压力减小的同时对第二室进行加压的装置，从而导致去除上卡盘和附接的晶片对的向下弯曲并且通过整个粘合界面传播分离前端。 脱粘器装置还包括用于将分离的第二晶片的未结合表面附接到下卡盘的上表面上的装置。
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13.发明授权公开(公告)号：US11499855B2
公开(公告)日：2022-11-15
申请号：US16702214
申请日：2019-12-03
发明人： Kader Mekias
IPC分类号： G01F1/684 , F16K31/126 , H01L21/67
摘要： Disclosed is an apparatus for measuring a fluid flow through a pipe of a semiconductor manufacturing device, in particular a coater or a bonder. The apparatus includes a sealing structure arranged in the pipe, a flow structure having a fluid inlet arranged upstream of the sealing structure and a fluid outlet arranged downstream of the sealing structure, a first chamber arranged in the pipe upstream of the sealing structure, and a second chamber arranged in the pipe downstream of the sealing structure, and a measuring device, wherein the measuring device is adapted to measure a first fluid pressure in the first chamber and a second fluid pressure in the second chamber, wherein the measuring device is configured to determine the fluid flow based on the first and second fluid pressure.
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公开(公告)号：US11049746B2
公开(公告)日：2021-06-29
申请号：US16704875
申请日：2019-12-05
发明人： Bernhard Bogner
IPC分类号： H01L21/673
摘要： A substrate cassette for housing several substrates stacked on top of each other, in particular wafers, has a housing that comprises a first side and a second side that is parallel to the first side, wherein at least an elongated first support is provided for a substrate within the housing between the sides, said support being spaced apart at least in sections from the first side, wherein the first side is closest to said at least one first support.
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公开(公告)号：US20210063863A1
公开(公告)日：2021-03-04
申请号：US17010553
申请日：2020-09-02
摘要： A method for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit is disclosed. The method comprises the following steps: At least a predefined portion of the optical projection unit is illuminated so that an image is generated by at least two channels of the predefined portion of the multi-channel optical projection unit. At least one characteristic quantity is determined based on the analysis of the image, wherein a value of the characteristic quantity is associated with a characteristic feature of the projection unit, a defect of the projection unit and/or a defect class of the projection unit. The quality of the projection unit is assessed based on the at least one characteristic quantity. Moreover, a test system for assessing the quality of a multi-channel micro- and/or subwavelength-optical projection unit and a computer program are disclosed
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公开(公告)号：US10688524B2
公开(公告)日：2020-06-23
申请号：US14861117
申请日：2015-09-22
摘要： A method for coating a substrate with a lacquer includes spraying lacquer onto the substrate and subsequently spraying the applied lacquer with solvent. In some embodiments, before the solvent is sprayed the lacquer is heated. Also disclosed is a corresponding coating device for lacquering substrates.
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17.发明授权公开(公告)号：US10580678B2
公开(公告)日：2020-03-03
申请号：US15801813
申请日：2017-11-02
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： H01L21/68 , H01L21/67 , H01L21/683
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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公开(公告)号：US10343292B2
公开(公告)日：2019-07-09
申请号：US15875708
申请日：2018-01-19
发明人： Bernhard Bogner
IPC分类号： B25J15/06 , H01L21/683 , H01L21/687 , B32B15/04 , G03F7/20 , B25J15/00
摘要： An end effector for holding substrates has a multi-layered main body and a fluid channel which is provided in the main body. The main body has a receiving end and a fastening end, and include at least two layers, wherein at least one of the layers is not inherently stable, and is formed from a synthetic material film.
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19.发明授权公开(公告)号：US10232405B2
公开(公告)日：2019-03-19
申请号：US14861105
申请日：2015-09-22
摘要： A method for coating a substrate with a lacquer is disclosed. First, the lacquer is uniformly applied to the substrate. Then, the solvent proportion of the lacquer applied to the substrate is reduced, and the coated substrate is exposed to a solvent atmosphere. In some embodiments, the lacquer is heated. The invention also relates to a device for planarizing a lacquer layer.
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20.发明授权公开(公告)号：US09837295B2
公开(公告)日：2017-12-05
申请号：US14330536
申请日：2014-07-14
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： B23B31/28 , H01L21/683 , H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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