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1.发明授权公开(公告)号：US10580678B2
公开(公告)日：2020-03-03
申请号：US15801813
申请日：2017-11-02
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： H01L21/68 , H01L21/67 , H01L21/683
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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2.发明授权公开(公告)号：US09837295B2
公开(公告)日：2017-12-05
申请号：US14330536
申请日：2014-07-14
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： B23B31/28 , H01L21/683 , H01L21/68 , H01L21/67
CPC分类号： H01L21/68 , H01L21/67092 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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公开(公告)号：US10319615B2
公开(公告)日：2019-06-11
申请号：US15843628
申请日：2017-12-15
发明人： Gregory George , Hale Johnson
IPC分类号： B32B37/00 , H01L21/67 , H01L23/00 , B65G47/91 , H01L21/30 , H01L21/4763 , H01L21/683
摘要： A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.
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公开(公告)号：US09859141B2
公开(公告)日：2018-01-02
申请号：US14330497
申请日：2014-07-14
发明人： Hale Johnson , Gregory George , Michael Brennen
CPC分类号： H01L21/68 , H01L21/67092 , Y10T279/18 , Y10T279/21 , Y10T279/26
摘要： A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.
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5.发明授权公开(公告)号：US09281229B2
公开(公告)日：2016-03-08
申请号：US14556298
申请日：2014-12-01
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/683 , B32B43/00 , H01L21/67 , H01L21/673 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A method for debonding two temporary bonded wafers, includes providing a debonder comprising a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly and an X-axis drive control configured to drive horizontally the X-axis carriage drive and the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. Next, loading a wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly. Next, driving the X-axis carriage drive and the bottom chuck assembly to the process zone under the top chuck assembly. Next, placing the unbonded surface of the carrier wafer in contact with the top chuck assembly and holding the carrier wafer by the top chuck assembly. Next, initiating horizontal motion of the X-axis carriage drive while heat is applied to the carrier wafer and while the carrier wafer is held by the top chuck assembly.
摘要翻译： 一种用于剥离两个临时粘合晶片的方法，包括提供一个脱粘器，其包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动 控制器被配置为将X轴托架驱动器和底部卡盘组件从加载区域水平驱动到顶部卡盘组件下方的处理区域以及从处理区域到加载区域。 接下来，将负载区域上的通过粘合剂层将包含结合到器件晶片的载体晶片的晶片对装载在负载区域上的底部卡盘组件上，使得器件晶片的未结合表面与底部组件接触。 接下来，将X轴托架驱动器和底卡盘组件驱动到顶卡盘组件下的处理区域。 接下来，将载体晶片的未结合表面与顶部卡盘组件接触并且通过顶部卡盘组件保持载体晶片。 接下来，当向载体晶片施加热量并且当载体晶片被顶部卡盘组件保持时，启动X轴托架驱动器的水平运动。
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公开(公告)号：US11183401B2
公开(公告)日：2021-11-23
申请号：US15680706
申请日：2017-08-18
发明人： Hale Johnson , Gregory George , Aaron Loomis
IPC分类号： H01L21/70 , H01L21/687 , H01L21/67 , H01L21/677 , H01L23/00 , H01L21/683
摘要： An industrial-scale system and method for handling precisely aligned and centered semiconductor substrate (e.g., wafer) pairs for substrate-to-substrate (e.g., wafer-to-wafer) aligning and bonding applications is provided. Some embodiments include an aligned substrate transport device having a frame member and a spacer assembly. The centered semiconductor substrate pairs may be positioned within a processing system using the aligned substrate transport device, optionally under robotic control. The centered semiconductor substrate pairs may be bonded together without the presence of the aligned substrate transport device in the bonding device. The bonding device may include a second spacer assembly which operates in concert with that of the aligned substrate transport device to perform a spacer hand-off between the substrates. A pin apparatus may be used to stake the substrates during the hand-off.
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7.发明申请公开(公告)号：US20180102270A1
公开(公告)日：2018-04-12
申请号：US15801813
申请日：2017-11-02
发明人： Hale Johnson , Gregory George , Michael Brennen
IPC分类号： H01L21/68 , H01L21/67 , H01L21/683
摘要： A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact to the upper chuck, a component for adjusting the pre-load force of the upper chuck, and a component for leveling the upper chuck.
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公开(公告)号：US20170372925A1
公开(公告)日：2017-12-28
申请号：US15680706
申请日：2017-08-18
发明人： Hale Johnson , Gregory George , Aaron Loomis
IPC分类号： H01L21/67 , H01L21/687
CPC分类号： H01L21/67092 , H01L21/6719 , H01L21/67742 , H01L21/67748 , H01L21/6838 , H01L21/68707 , H01L21/68721 , H01L21/68728 , H01L21/68742 , H01L21/68771 , H01L24/08 , H01L24/75 , H01L24/80 , H01L24/94 , H01L2224/08145 , H01L2224/75101 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75305 , H01L2224/7531 , H01L2224/75312 , H01L2224/7565 , H01L2224/757 , H01L2224/75701 , H01L2224/75702 , H01L2224/75703 , H01L2224/75743 , H01L2224/75754 , H01L2224/80203 , H01L2224/80907 , H01L2224/94 , H01L2924/00012 , H01L2224/80 , H01L2924/00014
摘要： An industrial-scale system and method for handling precisely aligned and centered semiconductor substrate (e.g., wafer) pairs for substrate-to-substrate (e.g., wafer-to-wafer) aligning and bonding applications is provided. Some embodiments include an aligned substrate transport device having a frame member and a spacer assembly. The centered semiconductor substrate pairs may be positioned within a processing system using the aligned substrate transport device, optionally under robotic control. The centered semiconductor substrate pairs may be bonded together without the presence of the aligned substrate transport device in the bonding device. The bonding device may include a second spacer assembly which operates in concert with that of the aligned substrate transport device to perform a spacer hand-off between the substrates. A pin apparatus may be used to stake the substrates during the hand-off.
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公开(公告)号：US09640418B2
公开(公告)日：2017-05-02
申请号：US15150856
申请日：2016-05-10
发明人： Hale Johnson , Gregory George
IPC分类号： H01L21/67 , H01L21/677 , H01L21/687 , H01L21/683 , H01L23/00
CPC分类号： H01L21/67742 , H01L21/67092 , H01L21/6719 , H01L21/67748 , H01L21/6838 , H01L21/68707 , H01L21/68721 , H01L21/68742 , H01L24/08 , H01L24/75 , H01L24/80 , H01L24/83 , H01L24/94 , H01L2224/08145 , H01L2224/75101 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75305 , H01L2224/7531 , H01L2224/75312 , H01L2224/7565 , H01L2224/757 , H01L2224/75701 , H01L2224/75702 , H01L2224/75703 , H01L2224/75743 , H01L2224/75754 , H01L2224/80203 , H01L2224/80907 , H01L2224/94 , H01L2924/00012 , H01L2224/80 , H01L2924/00014
摘要： An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
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公开(公告)号：US20160336212A1
公开(公告)日：2016-11-17
申请号：US15150689
申请日：2016-05-10
发明人： Hale Johnson , Gregory George
IPC分类号： H01L21/683 , H01L21/687
摘要： An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.
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