METHOD OF DETERMINING A CORRECTION STRATEGY IN A SEMICONDUCTOR MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES

    公开(公告)号:US20230260855A1

    公开(公告)日:2023-08-17

    申请号:US18014431

    申请日:2021-06-21

    CPC classification number: H01L22/26 G03F7/7065 G03F7/70525

    Abstract: A method of determining a correction strategy in a semiconductor manufacturing process. The method can include obtaining functional indicator data relating to functional indicators associated with one or more process parameters of each of a plurality of different control regimes of the semiconductor manufacturing process and/or a tool associated with the semiconductor manufacturing process and using the functional indicator data as an input to a trained model to determine for which of the control regimes should a correction be determined so as to improve performance of the semiconductor manufacturing process according to at least one quality metric being representative of a quality of the semiconductor manufacturing process. The correction is then calculated for the determined control regime(s).

    MOUNTED HOLLOW-CORE FIBER ARRANGEMENT

    公开(公告)号:US20220317368A1

    公开(公告)日:2022-10-06

    申请号:US17836537

    申请日:2022-06-09

    Abstract: A mounted hollow-core fiber arrangement includes a hollow-core fiber having a microstructure, and a mount arrangement including a plurality of mounting contacts configured to apply a force to an outer layer of the hollow-core fiber. A portion of the hollow-core fiber is located in a receiving region of the mount arrangement. The plurality of mounting contacts are positioned around the receiving region. The mounting contacts are distributed around the receiving region, the distribution of the mounting contacts corresponding to a distribution of features of the microstructure of the hollow-core fiber. The mounted hollow core fiber can be used in a radiation source apparatus for providing broadband radiation.

    METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES

    公开(公告)号:US20210311400A1

    公开(公告)日:2021-10-07

    申请号:US17264023

    申请日:2019-07-03

    Abstract: A method for controlling a manufacturing process for manufacturing semiconductor devices, the method including: obtaining performance data indicative of the performance of the manufacturing process, the performance data including values for a performance parameter across a substrate subject to the manufacturing process; and determining a process correction for the manufacturing process based on the performance data and at least one control characteristic related to a dynamic behavior of one or more control parameters of the manufacturing process, wherein the determining is further based on an expected stability of the manufacturing process when applying the process correction.

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