公开(公告)号：US20120249668A1

公开(公告)日：2012-10-04

申请号：US13435473

申请日：2012-03-30

申请人： Atsushi Denda ,  Tsuyoshi Sano

发明人： Atsushi Denda ,  Tsuyoshi Sano

IPC分类号： B41J2/015

CPC分类号： B41M5/0023 ,  B41J2/01 ,  B41J2/2107 ,  B41M7/0036

摘要： An ink jet recording method includes forming a glittering image on a recording medium by ejecting a glittering ink containing silver onto the recording medium by an ink jet method, applying a protective ink containing a resin and substantially no coloring material onto the glittering image, and forming a color image by ejecting a color ink containing a coloring material to the glittering image by an ink jet method. The protective ink is applied between the glittering image and the color image.

摘要翻译： 一种喷墨记录方法，包括通过喷墨方法将含有银的闪光墨水喷射到记录介质上，在记录介质上形成闪光图像，将含有树脂的防护油墨和基本上没有着色材料施加到闪光图像上，并形成 通过喷墨法将含有着色材料的彩色油墨喷射到闪光图像上的彩色图像。 保护墨水被施加在闪光图像和彩色图像之间。

公开(公告)号：US08274142B2

公开(公告)日：2012-09-25

申请号：US12615449

申请日：2009-11-10

申请人： Atsushi Denda

发明人： Atsushi Denda

IPC分类号： H01L23/02 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L25/0657 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/05554 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/25175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06506 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes: a plurality of semiconductor substrates each having a pad-formed surface and being mutually laminated; a connection electrode pad formed on the pad-formed surface; a wire connecting the connection electrode pads of the plurality of semiconductor substrates so as to electrically connect the semiconductor substrates; a relay electrode pad that is provided on the pad-formed surface of a lower one of the laminated semiconductor substrates so as to be exposed by an upper one of the laminated semiconductor substrates, and that is connected to the connection electrode pad by a relay wire included in the wire; and a mounting electrode pad that is formed on a mounting surface on which the laminated semiconductor substrates are mounted, and that is connected to the relay electrode pad of the lower semiconductor substrate by the wire. In the device, the wire electrically connects the connection electrode pad of the upper semiconductor substrate to the relay electrode pad of the lower semiconductor substrate.

摘要翻译： 半导体器件包括：多个半导体衬底，每个半导体衬底具有衬垫形成表面并相互层压; 连接电极焊盘，形成在焊盘形成表面上; 连接多个半导体衬底的连接电极焊盘以使半导体衬底电连接的导线; 中继电极焊盘，其设置在下层的层叠半导体衬底的焊盘形成表面上，以被上层的层叠半导体衬底露出，并且通过中继线连接到连接电极焊盘 包括在电线中; 以及安装电极焊盘，其形成在其上安装有层叠半导体衬底的安装表面上，并且通过导线连接到下半导体衬底的中继电极焊盘。 在该器件中，导线将上半导体衬底的连接电极焊盘与下半导体衬底的中继电极焊盘电连接。

公开(公告)号：US20120223992A1

公开(公告)日：2012-09-06

申请号：US13409619

申请日：2012-03-01

申请人： Shiki Hirata ,  Tsuyoshi Sano ,  Atsushi Denda

发明人： Shiki Hirata ,  Tsuyoshi Sano ,  Atsushi Denda

IPC分类号： B41J2/21 ,  B41J29/38

CPC分类号： B41J2/2114 ,  C09D11/322 ,  C09D11/40

摘要： An ink jet printing apparatus prints an image using glitter ink with dispersed glitter pigment and clear ink which does not substantially include a color material. The ink jet printing apparatus has a first mode of ejecting substantially only the glitter ink to the printing medium to form the image by an ink jet method, and a second mode having a process of ejecting the glitter ink to the printing medium to form a first image by an ink jet method and a process of ejecting clear ink onto the first image by the ink jet method to form a second image, to form the image formed of the first image and the second image. A mode is selected from the first mode and the second mode to print the image on the printing medium.

摘要翻译： 喷墨打印设备使用具有基本上不包括彩色材料的分散的闪光颜料和透明油墨的闪光油墨打印图像。 喷墨打印设备具有第一模式，其基本上仅将喷墨墨水喷射到打印介质上以通过喷墨方式形成图像;以及第二模式，其具有将闪光墨水喷射到打印介质以形成第一 通过喷墨法形成图像，以及通过喷墨法将清晰油墨喷射到第一图像上以形成第二图像，以形成由第一图像和第二图像形成的图像。 从第一模式和第二模式中选择模式以在打印介质上打印图像。

公开(公告)号：US20110212823A1

公开(公告)日：2011-09-01

申请号：US13035042

申请日：2011-02-25

申请人： Kentaro TANABE ,  Atsushi DENDA ,  Toshiyuki KOBAYASHI ,  Yoshikazu HAMA ,  Naoyuki TOYODA

发明人： Kentaro TANABE ,  Atsushi DENDA ,  Toshiyuki KOBAYASHI ,  Yoshikazu HAMA ,  Naoyuki TOYODA

IPC分类号： C04B35/00

CPC分类号： H05K3/4629 ,  B32B18/00 ,  B41J2/14233 ,  C04B35/117 ,  C04B35/478 ,  C04B35/6264 ,  C04B35/6342 ,  C04B2235/3217 ,  C04B2235/3232 ,  C04B2235/36 ,  C04B2235/5436 ,  C04B2235/6025 ,  C04B2235/604 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/62 ,  H05K1/0306 ,  H05K3/125

摘要： A ceramic shaped body for producing a wiring board includes a ceramic material, a binder, and a polyalcohol, the polyalcohol being present in at least a near-surface region of the ceramic shaped body.

摘要翻译： 用于制造布线板的陶瓷成形体包括陶瓷材料，粘合剂和多元醇，多元醇存在于陶瓷体的至少近表面区域中。

公开(公告)号：US07847903B2

公开(公告)日：2010-12-07

申请号：US11420295

申请日：2006-05-25

申请人： Atsushi Denda

发明人： Atsushi Denda

IPC分类号： G02F1/1343

CPC分类号： G02F1/13439 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for forming a pixel electrode on a substrate, including: forming a bank corresponding to a region for forming the pixel electrode on a substrate; disposing, by a liquid ejection method, a first functional liquid containing transparent conductive microparticles in the region partitioned by the bank; drying the first functional liquid to produce a first layer film; disposing, by a liquid ejection method, a second functional liquid containing a silicon compound onto the first layer film; and forming a pixel electrode made of a laminate that includes: a transparent conductive layer which is formed by calcining together the first layer film and the second functional liquid and is composed of the first layer film and silicon oxide filling a pore in the first layer film; and a silicon oxide layer formed on the transparent conductive layer.

摘要翻译： 一种在基板上形成像素电极的方法，包括：在基板上形成对应于用于形成像素电极的区域的堤岸; 通过液体喷射方法将由透明导电性微粒的第一功能性液体设置在由堤分隔的区域中; 干燥第一功能液体以产生第一层膜; 通过液体喷射方法将含有硅化合物的第二功能液体设置在第一层膜上; 以及形成由层压体构成的像素电极，所述像素电极包括：透明导电层，其通过将所述第一层膜和所述第二功能液一起煅烧而形成，并且由所述第一层膜和填充所述第一层膜中的孔的氧化硅构成 ; 以及形成在所述透明导电层上的氧化硅层。

公开(公告)号：US07808606B2

公开(公告)日：2010-10-05

申请号：US12166386

申请日：2008-07-02

申请人： Atsushi Denda

发明人： Atsushi Denda

IPC分类号： G02F1/13 ,  G02F1/1343

CPC分类号： H01L27/124 ,  G02F2001/13629 ,  H01L27/1292 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing a substrate, includes: coating the substrate with a first layer including a first metallic element by a dry deposition technique; coating the first layer with a photo resist layer; forming on the photo resist layer an exposure portion, a pair of non-exposure portions being in contact with the exposure portion and having a substantially parallel stripe-like plan shape, and a half exposure portion that is a part of an inner region of the non-exposure portions and an outer region of the non-exposure portions; removing the exposure portion and an upper portion of the half exposure portion, the upper portion having been exposed; forming an electrode portion and a wiring portion by etching the first layer exposed by removing the exposure portion; exposing the electrode portion and the wiring portion by removing the half exposure portion of which the upper portion has been removed, and forming a pair of banks by the pair of non-exposure portions; applying a treatment solution including a second metallic element on a recess portion formed by the wiring portion sandwiched between the pair of banks and the pair of banks by a droplet discharge technique; and forming a second layer including the second metallic element on the wiring portion by hardening the applied treatment solution to thicken the wiring portion.

摘要翻译： 一种基板的制造方法，其特征在于，包括：通过干式沉积技术将包含第一金属元件的第一层涂布在基板上; 用抗蚀剂层涂覆第一层; 在光致抗蚀剂层上形成曝光部分，与曝光部分接触并且具有大致平行的条状平面形状的一对非曝光部分和作为该曝光部分的内部区域的一部分的半曝光部分 非曝光部分和非曝光部分的外部区域; 去除曝光部分和半曝光部分的上部，上部已经暴露; 通过蚀刻通过去除曝光部分暴露的第一层来形成电极部分和布线部分; 通过去除已经去除了上部的半曝光部分并且通过一对非曝光部分形成一对堤，使电极部分和布线部分暴露; 通过液滴喷射技术将包含第二金属元素的处理溶液施加在由夹在所述一对堤岸和所述一对堤岸之间的所述布线部分形成的凹部上; 以及通过硬化所施加的处理溶液以使所述布线部分变稠，在所述布线部分上形成包括所述第二金属元件的第二层。

公开(公告)号：US20100171718A1

公开(公告)日：2010-07-08

申请号：US12651626

申请日：2010-01-04

申请人： Atsushi DENDA

发明人： Atsushi DENDA

IPC分类号： G06F3/041 ,  B05D5/12

CPC分类号： G06F3/044 ,  G06F2203/04111

摘要： A method for manufacturing a touch panel including a substrate, a first electrode, and a second electrode, the first and second electrodes being formed on one side of the substrate in a plural numbers and extending in directions intersecting with each other, the method includes forming the first electrode and electrode films on the substrate, forming an insulating film by a printing method on at least an intersection of the first electrode with the second electrode, and forming a bridge wiring line connecting the electrode films over the insulating film by the printing method. In the method, each of the electrode films has a shape obtained by cutting off the second electrode at the intersection.

摘要翻译： 一种用于制造包括基板，第一电极和第二电极的触摸面板的方法，所述第一和第二电极在所述基板的一侧上形成多个并且在彼此相交的方向上延伸，所述方法包括形成 基板上的第一电极和电极膜，通过印刷方法在第一电极与第二电极的至少交点上形成绝缘膜，以及通过印刷方法形成连接绝缘膜上的电极膜的桥接布线 。 在该方法中，每个电极膜具有通过在交叉点处切断第二电极而获得的形状。

公开(公告)号：US20100117241A1

公开(公告)日：2010-05-13

申请号：US12615449

申请日：2009-11-10

申请人： Atsushi DENDA

发明人： Atsushi DENDA

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H01L25/0657 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/05554 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/25175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2225/06506 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes: a plurality of semiconductor substrates each having a pad-formed surface and being mutually laminated; a connection electrode pad formed on the pad-formed surface; a wire connecting the connection electrode pads of the plurality of semiconductor substrates so as to electrically connect the semiconductor substrates; a relay electrode pad that is provided on the pad-formed surface of a lower one of the laminated semiconductor substrates so as to be exposed by an upper one of the laminated semiconductor substrates, and that is connected to the connection electrode pad by a relay wire included in the wire; and a mounting electrode pad that is formed on a mounting surface on which the laminated semiconductor substrates are mounted, and that is connected to the relay electrode pad of the lower semiconductor substrate by the wire. In the device, the wire electrically connects the connection electrode pad of the upper semiconductor substrate to the relay electrode pad of the lower semiconductor substrate.

摘要翻译： 半导体器件包括：多个半导体衬底，每个半导体衬底具有衬垫形成表面并相互层压; 连接电极焊盘，形成在焊盘形成表面上; 连接多个半导体衬底的连接电极焊盘以使半导体衬底电连接的导线; 中继电极焊盘，其设置在下层的层叠半导体衬底的焊盘形成表面上，以被上层的层叠半导体衬底露出，并且通过中继线连接到连接电极焊盘 包括在电线中; 以及安装电极焊盘，其形成在其上安装有层叠半导体衬底的安装表面上，并且通过导线连接到下半导体衬底的中继电极焊盘。 在该器件中，导线将上半导体衬底的连接电极焊盘与下半导体衬底的中继电极焊盘电连接。

公开(公告)号：US20090258490A1

公开(公告)日：2009-10-15

申请号：US12420265

申请日：2009-04-08

申请人： Atsushi DENDA

发明人： Atsushi DENDA

IPC分类号： H01L21/3205

CPC分类号： H05K3/1283 ,  H01L27/124 ,  H01L27/1292 ,  H05K3/105 ,  H05K2203/087 ,  H05K2203/1131 ,  H05K2203/1157 ,  H05K2203/125

摘要： A method for forming a conductive film, includes: applying a dispersion liquid above a substrate, the dispersion liquid including a plurality of conductive fine-particles made of one conductive material selected from the group consisting of copper, nickel, and an alloy that includes copper or nickel as a main component; and forming the conductive film made from the conductive fine-particles, by heating the dispersion liquid that has been applied above the substrate in an atmosphere including formic acid, by baking the conductive fine-particles so that the conductive fine-particles are mutually fusion bonded.

摘要翻译： 一种形成导电膜的方法，包括：在基底上施加分散液，所述分散液包括由选自铜，镍和包含铜的合金的一种导电材料制成的多个导电微粒 或镍为主要成分; 并且通过在导电性微粒中焙烧导电性微粒，使导电性微粒相互融合而形成由导电性微粒构成的导电膜，通过在包含甲酸的气氛中加热涂布在基板上方的分散液， 。

公开(公告)号：US07517735B2

公开(公告)日：2009-04-14

申请号：US11206784

申请日：2005-08-19

申请人： Yoshikazu Yoshimoto ,  Yoichi Noda ,  Atsushi Denda ,  Toshimitsu Hirai ,  Shinri Sakai

发明人： Yoshikazu Yoshimoto ,  Yoichi Noda ,  Atsushi Denda ,  Toshimitsu Hirai ,  Shinri Sakai

IPC分类号： H01L21/82

CPC分类号： H01L27/12 ,  G02F1/136286 ,  G02F1/1368 ,  H01L27/124 ,  H01L27/1292

摘要： A method of manufacturing an active matrix substrate includes forming wiring lines each having a matrix pattern on a substrate such that a wiring line extending in any one of a first direction and a second direction is separated from another wiring line at an intersection; forming a laminated portion composed of an insulating layer and a semiconductor layer on a portion of the wiring line and the intersection; and forming a conductive layer electrically connecting the separated wiring line, and a pixel electrode electrically connected to the wiring line via the semiconductor layer on the laminated portion.

摘要翻译： 有源矩阵基板的制造方法包括在基板上形成各自具有矩阵图案的布线，使得沿第一方向和第二方向中的任一方向延伸的布线在交叉点处与另一布线分离; 在所述布线和所述交点的一部分上形成由绝缘层和半导体层构成的层叠部; 以及形成导电层，电连接所述分离的布线，以及通过所述层叠部分上的所述半导体层电连接到所述布线的像素电极。