公开(公告)号：US20210265300A1

公开(公告)日：2021-08-26

申请号：US17269513

申请日：2018-11-14

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: H01L23/00

Abstract: A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.

公开(公告)号：US10580752B2

公开(公告)日：2020-03-03

申请号：US15519542

申请日：2015-10-19

Applicant: BONDTECH CO., LTD.

Inventor： Akira Yamauchi

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/68 ,  B23K20/24 ,  B23K37/047 ,  H01L21/67 ,  H01L21/687 ,  H01L21/18 ,  H01L23/544 ,  B23K20/233 ,  B23K37/04 ,  B23K20/02 ,  H01L21/683 ,  B23K103/00 ,  B23K101/40

Abstract: A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

公开(公告)号：US20240174457A1

公开(公告)日：2024-05-30

申请号：US18552632

申请日：2022-03-30

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: B65G49/06

CPC classification number: B65G49/067 ,  B65G2207/28 ,  B65G2249/02

Abstract: A bonding system is a bonding system that bonds two substrates and includes: a bonder (1) that executes a positioning process of performing positioning of the two substrates under reduced pressure, and then executes a contact process of bringing the two substrates into contact under reduced pressure; and a conveying device (84) that conveys, to the bonder (1), the two substrates to be bonded to each other. Then, the bonder (1) executes the positioning process and the contact process mentioned earlier in a state where the conveying device (84) is separated from the bonder (1).

公开(公告)号：US20240079374A1

公开(公告)日：2024-03-07

申请号：US18487071

申请日：2023-10-14

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/80 ,  H01L2224/8022

Abstract: Bonding system that bonds each of a plurality of second articles to a first article, wherein each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article, the bonding system comprises: a device for supplying a second article that supplies the plurality of second articles; a bond device that bonds the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article; and a device for transporting a second article that transports, to the bond device, at least one of the plurality of second articles supplied from the device for supplying a second article, and the device for transporting a second article comprises a holder for holding a second article that holds the uneven portion of the at least one second article.

公开(公告)号：US20240009984A1

公开(公告)日：2024-01-11

申请号：US18245895

申请日：2021-09-10

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: B32B37/12 ,  B32B38/10 ,  B32B37/10

CPC classification number: B32B37/12 ,  B32B38/10 ,  B32B37/10 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2310/14 ,  B32B2310/0881

Abstract: A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activation treatment step, exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time, and a bonding step of bonding the two substrates that have the bonding surfaces activated in the activation treatment step.

公开(公告)号：US20230154770A1

公开(公告)日：2023-05-18

申请号：US18157147

申请日：2023-01-20

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L21/67 ,  B29C35/08 ,  B29C45/14 ,  H01L21/02 ,  H01L21/56 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00 ,  H05K13/04

CPC classification number: H01L21/67144 ,  B29C35/0805 ,  B29C45/14065 ,  B29C45/14655 ,  H01L21/02057 ,  H01L21/565 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67098 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/6838 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H05K13/0413 ,  B29C2035/0827 ,  B29L2031/3406

Abstract: A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.

公开(公告)号：US11587804B2

公开(公告)日：2023-02-21

申请号：US16484450

申请日：2018-01-31

Applicant: BONDTECH CO., LTD.

Inventor： Akira Yamauchi

IPC: H01L21/67 ,  B29C35/08 ,  B29C45/14 ,  H01L21/02 ,  H01L21/56 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00 ,  H05K13/04 ,  B29L31/34

Abstract: A component mounting system for mounting a component on a substrate, the mounting system comprising a component supplying unit configured to supply the component; a substrate holding unit configured to hold the substrate in an orientation such that a mounting face for mounting the component on the substrate is facing vertically downward; a head configured to hold the component from vertically below; and a head drive unit that, by causing vertically upward movement of the head holding the component, causes the head to approach the substrate holding unit to mount the component on the mounting face of the substrate.

公开(公告)号：US20230030272A1

公开(公告)日：2023-02-02

申请号：US17788957

申请日：2020-02-07

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L23/00 ,  H01L25/075

Abstract: A bonding device measures a position deviation amount of the chip with respect to the substrate in a state where the chip and the substrate are in contact, and corrects and moves the chip relatively to the substrate in such a way as to reduce the position deviation amount, based on the measured position deviation amount. Then, the bonding device fixes the chip to the substrate by irradiating a resin portion of the chip with an ultraviolet ray and curing the resin portion when the position deviation amount of the chip with respect to the substrate is equal to or less than a position deviation amount threshold value.

公开(公告)号：US20200006099A1

公开(公告)日：2020-01-02

申请号：US16484450

申请日：2018-01-31

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/677 ,  H01L23/544 ,  H01L21/68 ,  H01L23/00 ,  H01L21/02 ,  H01L21/56 ,  H01L21/66 ,  B29C45/14 ,  B29C35/08

Abstract: A chip mounting system (1) includes: a chip supplying unit (11) for supplying a chip (CP); a stage (31) for holding a substrate (WT) in an orientation in which a mounting face (WTf) for mounting the chip (CP) faces vertically downward (−Z direction); a head (33H) for holding the chip (CP) from the vertically downward direction (−Z direction); and a head drive unit (36) for, by causing vertically upward (+Z direction) movement of the head (33H) holding the chip (CP), causes the head (33H) to approach the stage (31) to mount the chip (CP) on the mounting face (WTf) of the substrate (WT).

公开(公告)号：US10204785B2

公开(公告)日：2019-02-12

申请号：US15810932

申请日：2017-11-13

Applicant: Tadatomo Suga ,  BONDTECH CO., LTD.

Inventor： Tadatomo Suga ,  Akira Yamauchi

IPC: H01L21/18 ,  B23K20/00 ,  H01L21/02 ,  H05H1/46 ,  H05H3/02 ,  H01J37/32 ,  H01L21/67 ,  H01L25/065 ,  H01L21/762

Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.