摘要:
A method for fabricating semiconductor device is disclosed herein. The first step is to form a first oxide layer on a substrate. Subsequently formed are polycrystalline silicon layer, a polycide layer, optionally a second oxide layer, and a silicon nitride layer on the first oxide layer. A photoresist pattern on the silicon layer is formed thereafter, and the silicon nitride layer is etched using the photoresist pattern as a mask to expose a portion of the polycide layer. The photoresist pattern is then, the polycide layer is isotropically etched to form an under cut in the polycide layer under the etched nitride layer (optional second oxide layer). The width of the top portion of the isotropically etched polycide layer is smaller than the width of the etched nitride layer. The isotropically etched polycide layer is then anistropically etched, and the polycrystalline layer is etched to expose a portion of the first oxide layer to form a multi-layer structure. Finally, spacers on side-walls of the multi-layer structure are formed to create the semiconductor device, the side-wall of the anisotropicaly etched polycide layer generated after the oxidation process is prevented from penetrating the spacer of the semiconductor device according to the present invention.
摘要:
A phosphor device of an illumination system is provided. The illumination system emits a first waveband light and has an optical path. The phosphor device includes a first section and a first phosphor agent. The first phosphor agent is coated on the first section. After the first waveband light is received by the first phosphor agent, the first waveband light is converted into a third waveband light, and the third waveband light is directed to the optical path, so that the third waveband light is separated into at least two color lights along the optical path.
摘要:
A method of image-tracking by using an image capturing device (12). The method comprises: performing an image-capture of a scene (54) by using an image capturing device; and tracking movement (62) of the image capturing device (12) by analyzing a set of images by using an image processing algorithm (64).
摘要:
This is related to a method for the manufacture of a capacitor with wing extensions and the capacitor device. The method comprises: (1) causing multiple contact areas to be disposed in alternate positions, such that two adjacent contact areas are complements of each other, (2) depositing electroplating base material (EBM) over the contact area, (3) electroplating a conductive material on the sidewalls of the EBM slab to form plate electrode; and then (4) etching back the EBM leaving only the electrode portion. The capacitor formed by the above method has a larger surface area on the electrode compared with that made by the conventional method, and the cell capacitance is also better. This method is especially effective for the manufacture of high-density memory device.
摘要:
A planet gear speed reducer includes a casing having a receiving space defined therein for receiving an output shaft and an input shaft. The output shaft and the input shaft are longitudinally connected to each other. The output shaft includes a planet gear arm and a drive axle concentrically and longitudinally extending the planet gear arm. A third bearing is mounted in a bottom of the planet gear arm. The input shaft has a sun gear axle concentrically extends therefrom and engaged to the multiple planet gears on the planet gear arm. A fourth bearing is securely sleeved on a heel of the sun gear axle and an outer periphery of the fourth bearing is securely received within annular protrusion. A stub concentrically and longitudinally extends from a free end of the sun gear axle and securely received in the third bearing.
摘要:
A method for fabricating semiconductor memory cells such as dynamic random access memory (DRAM) and ferroelectric random access memory (FRAM) with improved contact between the capacitor electrode and the underneath device area. It includes the following main steps of: (1) forming a first dielectric layer on a wafer surface; (2) forming at least one through opening in the first dielectric layer; (3) forming a ruthenium based plug in the through opening; and (4) forming a capacitor in contact with the ruthenium based plug. The ruthenium based plug can be made of ruthenium metal, conductive ruthenium oxide, or a stack of conductive ruthenium oxide and ruthenium metal. The method allows the memory cell to be made without the need for a barrier, which is required to protect the storage electrode from reacting with Si atoms during the fabrication process.