MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE
    12.
    发明申请
    MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE 审中-公开
    微电子机电系统设备

    公开(公告)号:US20150293141A1

    公开(公告)日:2015-10-15

    申请号:US14681991

    申请日:2015-04-08

    CPC classification number: G01P15/125 G01P2015/0834

    Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device. The MEMS device includes: a substrate; a proof mass which defines an internal space inside and forms at least two capacitors with the substrate; at least two anchors connected to the substrate and respectively located in the capacitor areas of the capacitors from a cross-sectional view; at least one linkage truss located in the hollow structure, wherein the linkage truss is directly connected to the anchors or indirectly connected to the anchors through buffer springs; and multiple rotation springs located in the hollow structure, wherein the rotation springs are connected between the proof mass and the linkage truss, such that the proof mass can rotate along an axis formed by the rotation springs. There is no coupling mass which does not form a movable electrode in the connection between the proof mass and the substrate.

    Abstract translation: 本发明公开了一种微机电系统(MEMS)装置。 MEMS器件包括:衬底; 限定内部的内部空间并与衬底形成至少两个电容器的校验物质; 从横截面图分别连接到基板并且分别位于电容器的电容器区域中的至少两个锚点; 位于所述中空结构中的至少一个连杆桁架,其中所述连杆桁架直接连接到所述锚固件或通过缓冲弹簧间接连接到所述锚固件; 以及位于所述中空结构中的多个旋转弹簧,其中所述旋转弹簧连接在所述检测质量块和所述连杆桁架之间,使得所述检测质量块可以沿着由所述旋转弹簧形成的轴线旋转。 没有在检测质量体和基体之间的连接中不形成可动电极的耦合质量。

    MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY
    13.
    发明申请
    MANUFACTURING METHOD OF MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE AND MIRCO-ELECTRO-MECHANICAL SYSTEM DEVICE MADE THEREBY 有权
    微电子机械系统装置的制造方法及其制造的微机电系统装置

    公开(公告)号:US20150056733A1

    公开(公告)日:2015-02-26

    申请号:US14459646

    申请日:2014-08-14

    Abstract: The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.

    Abstract translation: 本发明提供一种MEMS器件的制造方法,其包括:在衬底上提供包括衬底和电结构的集成电路器件,电结构包括至少一个感测区域和至少一个第一连接部分; 提供结构层,并在所述结构层上形成至少一个第二连接部分; 键合所述至少一个第一连接部分和所述至少一个第二连接部分; 蚀刻所述结构层以形成至少一个可移动结构,所述可移动结构位于对应于所述感测区域的位置的位置,并且所述可移动结构经由所述至少一个第二连接件连接到所述至少一个第一连接部分 部分; 之后,设置盖以覆盖可移动结构和感测区域,其中可移动结构不直接连接到盖。

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