Abstract:
The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.
Abstract:
The present invention discloses a micro-electro-mechanical system (MEMS) device. The MEMS device includes: a substrate; a proof mass which defines an internal space inside and forms at least two capacitors with the substrate; at least two anchors connected to the substrate and respectively located in the capacitor areas of the capacitors from a cross-sectional view; at least one linkage truss located in the hollow structure, wherein the linkage truss is directly connected to the anchors or indirectly connected to the anchors through buffer springs; and multiple rotation springs located in the hollow structure, wherein the rotation springs are connected between the proof mass and the linkage truss, such that the proof mass can rotate along an axis formed by the rotation springs. There is no coupling mass which does not form a movable electrode in the connection between the proof mass and the substrate.
Abstract:
The invention provides a manufacturing method of a MEMS device, which includes: providing an integrated circuit device including a substrate and an electrical structure on the substrate, the electrical structure includes at least one sensing region and at least one first connection section; providing a structure layer, and forming at least one second connection section on the structure layer; bonding the at least one first connection section and the at least one second connection section; etching the structure layer for forming at least one movable structure, the movable structure being located at a position corresponding to a position of the sensing region, and the movable structure being connected to the at least one first connection section via the at least one second connection section; and thereafter, providing a cap to cover the movable structure and the sensing region, wherein the movable structure is not directly connected to the cap.