公开(公告)号：US06750754B2

公开(公告)日：2004-06-15

申请号：US10429657

申请日：2003-05-05

申请人： David Shau-Chew Wang ,  Chih-Ming Yu ,  Yi-Nuo Chen

发明人： David Shau-Chew Wang ,  Chih-Ming Yu ,  Yi-Nuo Chen

IPC分类号： H01C710

CPC分类号： H01C7/02 ,  H01C1/1406 ,  H01C7/13

摘要： The present invention reveals an over-current protection apparatus comprising a first electrode plate, a second electrode plate, a third electrode plate, a conductive element and a high resistance material layer, where the high resistance material layer may contact the first electrode plate to form a conducting path, the conductive element is connected to the first electrode plate and the second electrode, the thermally expanded conductive element can cut off current, the high resistance material layer is connected to the third electrode plate and the second electrode plate, and the thermal expansion coefficient of the high resistance layer is less than that of the conductive element. By virtue of the thermal expansion of the conductive element due to an over-current, the first electrode plate is departed from the third electrode plate so as to enforce the current flows through the high resistance material layer for current reduction. In addition, the heat generated from the high resistance material layer can be transferred to the conductive element to keep the conductive element expanded to cut off current.

摘要翻译： 本发明揭示了一种过电流保护装置，其包括第一电极板，第二电极板，第三电极板，导电元件和高电阻材料层，其中高电阻材料层可以接触第一电极板以形成 导电路径，导电元件连接到第一电极板和第二电极，热膨胀导电元件可以截止电流，高电阻材料层连接到第三电极板和第二电极板，并且热 高电阻层的膨胀系数小于导电元件的膨胀系数。 由于由于过电流引起的导电元件的热膨胀，所以第一电极板从第三电极板脱离，以便强制电流流过用于电流还原的高电阻材料层。 此外，从高电阻材料层产生的热可以传递到导电元件，以保持导电元件膨胀以截止电流。

公开(公告)号：US08803428B2

公开(公告)日：2014-08-12

申请号：US13427192

申请日：2012-03-22

申请人： Chun Teng Tseng ,  David Shau Chew Wang

发明人： Chun Teng Tseng ,  David Shau Chew Wang

IPC分类号： H05B37/02

CPC分类号： H05B33/089 ,  H05B33/0806

摘要： An LED apparatus includes an LED component and a current-limiting device. The LED component includes at least one LED having a corresponding current-limiting resistance value. The current-limiting device includes a plurality of PTC devices connected in series. The plurality of PTC devices are capable of effectively sensing the temperature of the LED and are electrically coupled to the LED component. The resistance value of the current-limiting device increases with the increment of sensed temperature. The current-limiting device has a resistance close to or equal to the current-limiting resistance value at a temperature at which the LED operates normally. When the temperature of the LED gradually increases to an abnormal temperature, current allowable to be flowed through the current-limiting device gradually decreases to be lower than LED operating current.

摘要翻译： LED装置包括LED组件和限流装置。 LED组件包括至少一个具有相应的限流电阻值的LED。 限流装置包括串联连接的多个PTC装置。 多个PTC器件能够有效地感测LED的温度并且电耦合到LED部件。 限流装置的电阻值随感测温度的增加而增加。 限流装置在LED正常工作的温度下具有接近或等于限流电阻值的电阻。 当LED的温度逐渐升高到异常温度时，允许流过限流装置的电流逐渐降低到低于LED工作电流。

公开(公告)号：US20130200987A1

公开(公告)日：2013-08-08

申请号：US13365726

申请日：2012-02-03

申请人： Yi An SHA ,  Chun Teng TSENG ,  David Shau Chew WANG

发明人： Yi An SHA ,  Chun Teng TSENG ,  David Shau Chew WANG

IPC分类号： H01C7/02

CPC分类号： H01C7/008 ,  H01C7/02 ,  H01C7/04

摘要： A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 μm.

摘要翻译： 热敏电阻包括电阻器件，第一绝缘层，第一电极，第二电极和第一导热层。 电阻装置包括第一导电构件，第二导电构件和层压在其间的聚合材料层。 聚合材料层表现出正温度系数（PTC）或负温度系数（NTC）行为。 第一绝缘层设置在第一导电构件上。 第一电极电耦合到第一导电构件，而第二电极电耦合到第二导电构件并与第一电极绝缘。 第一导热层设置在第一绝缘层上，具有至少30W / m-K的导热率和15-250μmum的厚度。

公开(公告)号：US08502638B1

公开(公告)日：2013-08-06

申请号：US13365726

申请日：2012-02-03

申请人： Yi An Sha ,  Chun Teng Tseng ,  David Shau Chew Wang

发明人： Yi An Sha ,  Chun Teng Tseng ,  David Shau Chew Wang

IPC分类号： H01C7/10

CPC分类号： H01C7/008 ,  H01C7/02 ,  H01C7/04

摘要： A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 μm.

摘要翻译： 热敏电阻包括电阻器件，第一绝缘层，第一电极，第二电极和第一导热层。 电阻装置包括第一导电构件，第二导电构件和层压在其间的聚合材料层。 聚合材料层表现出正温度系数（PTC）或负温度系数（NTC）行为。 第一绝缘层设置在第一导电构件上。 第一电极电耦合到第一导电构件，而第二电极电耦合到第二导电构件并与第一电极绝缘。 第一导热层设置在第一绝缘层上，具有至少30W / m-K的导热率和15-250μmum的厚度。

公开(公告)号：US20110217462A1

公开(公告)日：2011-09-08

申请号：US13106596

申请日：2011-05-12

申请人： DAVID SHAU CHEW WANG ,  YI AN SHA ,  KUO HSUN CHEN

发明人： DAVID SHAU CHEW WANG ,  YI AN SHA ,  KUO HSUN CHEN

IPC分类号： B05D5/00

CPC分类号： B05D5/00

摘要： A method for manufacturing an insulated heat conductive substrate comprises the steps of: performing hydrolysis and condensation of at least one thermally conductive ceramic powder to prepare at least one modified thermally conductive ceramic powder, which comprises a plurality of modified powder particles, each grafted with an organic material; mixing the at least one modified thermally conductive ceramic powder with two substantially mutually soluble polymers to achieve a uniform mixture; blending the uniform mixture with a curing agent to obtain a melt extrudable dielectric curable material; extruding the dielectric curable material through a slit to form a sheet-like substrate; and disposing a first film and a second film on two side surfaces of the substrate to obtain an insulated heat conductive substrate, wherein each of the first and second films can be either a metal foil or a release film.

摘要翻译： 绝缘导热基板的制造方法包括以下步骤：进行至少一种导热陶瓷粉末的水解和冷凝以制备至少一种改性导热陶瓷粉末，其包含多个改性粉末颗粒，每个改性粉末颗粒接枝 有机材料; 将所述至少一种改性的导热陶瓷粉末与两种基本上相互溶解的聚合物混合以获得均匀的混合物; 将均匀混合物与固化剂混合以获得可熔融挤出的介电可固化材料; 通过狭缝挤出介电可固化材料以形成片状基材; 以及在所述基板的两个侧表面上设置第一膜和第二膜以获得绝热导热基板，其中所述第一膜和所述第二膜可以是金属箔或剥离膜。

公开(公告)号：US08003216B2

公开(公告)日：2011-08-23

申请号：US11699710

申请日：2007-01-30

申请人： David Shau Chew Wang ,  En Tien Yang ,  Jyh Ming Yu ,  Fu Hua Chu

发明人： David Shau Chew Wang ,  En Tien Yang ,  Jyh Ming Yu ,  Fu Hua Chu

IPC分类号： B32B15/092 ,  B32B27/20 ,  B32B27/38 ,  C08K3/14 ,  C08K3/20 ,  C08K3/22 ,  C08K3/28 ,  C08K3/34 ,  C08K3/38 ,  C08L63/00

CPC分类号： H05K1/0373 ,  H01B3/006 ,  H01B3/40 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/09309 ,  H05K2201/10106 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529

摘要： A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

摘要翻译： 具有穿透网络（IPN）结构的导热介电聚合物材料包括均匀分散在聚合物组分中的聚合物组分，固化剂和导热填料。 聚合物组分包括热塑性塑料和热固性环氧树脂。 固化剂用于在固化温度下固化热固性环氧树脂。 导热介电聚合物材料的导热率大于0.5W / mK。 包含本发明的导热介电聚合物材料的散热基板的厚度小于0.5mm，并具有超过1000伏特的电压。

公开(公告)号：US07892392B2

公开(公告)日：2011-02-22

申请号：US12041322

申请日：2008-03-03

申请人： David Shau Chew Wang ,  Jyh Ming Yu

发明人： David Shau Chew Wang ,  Jyh Ming Yu

IPC分类号： B29C65/00 ,  B29C65/02 ,  B29C65/18 ,  B32B37/04 ,  B32B37/06 ,  B32B37/16 ,  B32B38/00 ,  B32B38/04 ,  H02H5/04

CPC分类号： B32B37/10 ,  B32B37/04 ,  B32B2307/20 ,  B32B2457/00 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/1062

摘要： A method for manufacturing an over-current protection device comprises a step of providing at least one current sensitive device and a step of pressing. The current sensitive device comprises a first electrode foil, a second electrode foil and a PTC conductive layer physically laminated between the first and second electrode foils. The pressing step is to press the current sensitive device at a predetermined temperature, thereby generating at least one overflow portion at sides of the PTC conductive layer to form the over-current protection device. The predetermined temperature is higher than the softening temperature of the PTC conductive layer. The over-current protection devices manufactured according to the present invention have superior resistance distribution.

摘要翻译： 一种用于制造过电流保护装置的方法包括提供至少一个电流敏感装置和按压步骤的步骤。 电流敏感器件包括物理层压在第一和第二电极箔之间的第一电极箔，第二电极箔和PTC导电层。 按压步骤是将电流敏感器件按预定温度按压，从而在PTC导电层的侧面产生至少一个溢出部分以形成过电流保护器件。 预定温度高于PTC导电层的软化温度。 根据本发明制造的过电流保护装置具有优异的电阻分布。

公开(公告)号：US07852192B2

公开(公告)日：2010-12-14

申请号：US11923741

申请日：2007-10-25

申请人： Ching Han Yu ,  David Shau Chew Wang ,  Pao Hsuan Chen

发明人： Ching Han Yu ,  David Shau Chew Wang ,  Pao Hsuan Chen

IPC分类号： H01C7/10

CPC分类号： H01C7/02 ,  H01C1/01 ,  H01C1/1406 ,  H01M10/425 ,  H01M10/48 ,  H01M2200/106

摘要： The over-current protection device of the present invention can be used for over-current protection to PCM. The over-current protection device comprises a PTC device, at least one insulation layer; at least one electrode layer and at least one conductive channel. The insulation layer is placed on a surface of the PTC device, and the electrode layer is formed on the insulation layer afterwards. As a result, the insulation layer is between the electrode layer and the PTC device. The electrode layer serves as a surface of the over-current protection device. The conductive channel electrically connects the PTC device and the electrode layer. In an embodiment, the conductive channel is a blind hole penetrating through the electrode layer and the insulation layer and ending at the surface of the PTC device, and the surface of the blind hole is coated with a conductive layer to electrically connect the PTC device and the electrode layer.

摘要翻译： 本发明的过电流保护装置可用于PCM的过电流保护。 过电流保护装置包括PTC器件，至少一个绝缘层; 至少一个电极层和至少一个导电通道。 绝缘层放置在PTC器件的表面上，之后在绝缘层上形成电极层。 结果，绝缘层位于电极层和PTC器件之间。 电极层用作过电流保护装置的表面。 导电通道电连接PTC器件和电极层。 在一个实施例中，导电通道是贯穿电极层和绝缘层并终止于PTC器件表面的盲孔，并且盲孔的表面涂覆有导电层以将PTC器件和 电极层。

公开(公告)号：US20080289751A1

公开(公告)日：2008-11-27

申请号：US12041322

申请日：2008-03-03

申请人： David Shau Chew Wang ,  Jyh Ming Yu

发明人： David Shau Chew Wang ,  Jyh Ming Yu

IPC分类号： B32B38/04 ,  B32B37/04

CPC分类号： B32B37/10 ,  B32B37/04 ,  B32B2307/20 ,  B32B2457/00 ,  Y10T156/1052 ,  Y10T156/1056 ,  Y10T156/1062

摘要： A method for manufacturing an over-current protection device comprises a step of providing at least one current sensitive device and a step of pressing. The current sensitive device comprises a first electrode foil, a second electrode foil and a PTC conductive layer physically laminated between the first and second electrode foils. The pressing step is to press the current sensitive device at a predetermined temperature, thereby generating at least one overflow portion at sides of the PTC conductive layer to form the over-current protection device. The predetermined temperature is higher than the softening temperature of the PTC conductive layer. The over-current protection devices manufactured according to the present invention have superior resistance distribution.

摘要翻译： 一种用于制造过电流保护装置的方法包括提供至少一个电流敏感装置和按压步骤的步骤。 电流敏感器件包括物理层压在第一和第二电极箔之间的第一电极箔，第二电极箔和PTC导电层。 按压步骤是将电流敏感器件按预定温度按压，从而在PTC导电层的侧面产生至少一个溢出部分以形成过电流保护器件。 预定温度高于PTC导电层的软化温度。 根据本发明制造的过电流保护装置具有优异的电阻分布。

公开(公告)号：US20080111505A1

公开(公告)日：2008-05-15

申请号：US11656224

申请日：2007-01-19

申请人： David Shau Chew Wang ,  Jyh Ming Yu

发明人： David Shau Chew Wang ,  Jyh Ming Yu

IPC分类号： H05B37/02

CPC分类号： H05B33/0872

摘要： A light emitting diode (LED) apparatus with temperature control and current regulation functions is provided. The LED apparatus includes at least one LED die and at least one temperature control and current regulation (TCCR) device. The TCCR device is electrically connected between the LED die and a power source, and is placed within an effective temperature sensing distance of the LED die, so as to sense temperature changes of the LED die. The resistance of the TCCR device is proportional to the temperature in a range of 25° C. to 85° C., i.e., the resistance increases with temperature. Moreover, the resistance difference of the TCCR device between 50° C. and 80° C. is greater than or equal to 100 mΩ.

摘要翻译： 提供了具有温度控制和电流调节功能的发光二极管（LED）装置。 LED装置包括至少一个LED管芯和至少一个温度控制和电流调节（TCCR）器件。 TCCR器件电连接在LED管芯和电源之间，并被放置在LED管芯的有效温度感测距离内，以便感测LED管芯的温度变化。 TCCR器件的电阻与25℃至85℃范围内的温度成比例，即电阻随温度升高。 此外，TCCR器件在50°C和80°C之间的电阻差大于或等于100 mOmega。