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公开(公告)号:US08209023B2
公开(公告)日:2012-06-26
申请号:US12163658
申请日:2008-06-27
申请人: David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada , Melody Tabada, legal representative
发明人: David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada
CPC分类号: A61N1/0543 , A61N1/0541 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/28 , H05K2201/0133 , H05K2201/0195 , Y10T156/1002
摘要: A flexible circuit electrode array and method of fabrication having a polymer base layer; metal traces deposited on the polymer base layer, including electrodes to stimulate tissue; a polymer top layer deposited on the polymer base layer and metal traces; and a coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: providing a first soft polymer layer; depositing a first a base layer on the first soft polymer layer; providing a metal thin film on the base layer; depositing a top polymer layer on the metal thin film; providing holes in the top polymer layer; depositing a second soft polymer layer on the top polymer layer; providing holes in the second soft polymer layer for bond pads and electrodes; and preparing electrodes in the provided holes.
摘要翻译: 柔性电路电极阵列和具有聚合物基底层的制造方法; 沉积在聚合物基层上的金属痕迹,包括刺激组织的电极; 沉积在聚合物基底层上的聚合物顶层和金属痕迹; 以及通过软聚合物涂覆基体和顶层。 一种制备柔性电路电极阵列的方法,包括:提供第一软聚合物层; 在第一软质聚合物层上沉积第一基底层; 在基层上提供金属薄膜; 在金属薄膜上沉积顶部聚合物层; 在顶部聚合物层中提供孔; 在顶部聚合物层上沉积第二软聚合物层; 在第二软聚合物层中提供用于接合焊盘和电极的孔; 并在所提供的孔中制备电极。