-
公开(公告)号：US08209023B2
公开(公告)日：2012-06-26
申请号：US12163658
申请日：2008-06-27
申请人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada , Melody Tabada, legal representative
发明人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada
CPC分类号： A61N1/0543 , A61N1/0541 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/28 , H05K2201/0133 , H05K2201/0195 , Y10T156/1002
摘要： A flexible circuit electrode array and method of fabrication having a polymer base layer; metal traces deposited on the polymer base layer, including electrodes to stimulate tissue; a polymer top layer deposited on the polymer base layer and metal traces; and a coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: providing a first soft polymer layer; depositing a first a base layer on the first soft polymer layer; providing a metal thin film on the base layer; depositing a top polymer layer on the metal thin film; providing holes in the top polymer layer; depositing a second soft polymer layer on the top polymer layer; providing holes in the second soft polymer layer for bond pads and electrodes; and preparing electrodes in the provided holes.
摘要翻译： 柔性电路电极阵列和具有聚合物基底层的制造方法; 沉积在聚合物基层上的金属痕迹，包括刺激组织的电极; 沉积在聚合物基底层上的聚合物顶层和金属痕迹; 以及通过软聚合物涂覆基体和顶层。 一种制备柔性电路电极阵列的方法，包括：提供第一软聚合物层; 在第一软质聚合物层上沉积第一基底层; 在基层上提供金属薄膜; 在金属薄膜上沉积顶部聚合物层; 在顶部聚合物层中提供孔; 在顶部聚合物层上沉积第二软聚合物层; 在第二软聚合物层中提供用于接合焊盘和电极的孔; 并在所提供的孔中制备电极。
-
公开(公告)号：US08489193B2
公开(公告)日：2013-07-16
申请号：US13460495
申请日：2012-04-30
申请人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada
发明人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada
IPC分类号： A61N1/04
CPC分类号： A61N1/0543 , A61N1/0541 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/28 , H05K2201/0133 , H05K2201/0195 , Y10T156/1002
摘要： A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer.
摘要翻译： 一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及通过软聚合物的基底和顶层的部分或全部涂层。
-
公开(公告)号：US20120239126A1
公开(公告)日：2012-09-20
申请号：US13460495
申请日：2012-04-30
申请人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Nevsmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada
发明人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Nevsmith , Boon-Khai Ng , James Singleton Little , Neil Hamilton Talbot , Satinderpall Singh Pannu , James Courtney Davidson , Phillipe John Tabada
CPC分类号： A61N1/0543 , A61N1/0541 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/28 , H05K2201/0133 , H05K2201/0195 , Y10T156/1002
摘要： A visual prosthesis which includes a hermetic package and flexible circuit electrode array is disclosed. The hermetic package includes electrode drivers and contacts. The flexible circuit electrode array includes a polymer base layer, metal traces, including electrodes suitable to stimulate visual neural tissue and bond pads bonded to contacts on the hermetic package, all deposited on the polymer base layer, a polymer top layer deposited on the polymer base layer and deposited on the metal traces, a partial or an entire coating of the polymer base layer and of the polymer top layer by a soft polymer that is softer than the polymer base layer; and the polymer base layer and the polymer top layer contain a plurality of aligned holes to facilitate bonding of the soft polymer.
摘要翻译： 公开了一种包括气密封装和柔性电路电极阵列的视觉假体。 密封包装包括电极驱动器和触点。 柔性电路电极阵列包括聚合物基层，金属迹线，包括适于刺激视觉神经组织的电极和粘合到密封封装上的触点的焊盘，全部沉积在聚合物基底层上，聚合物顶层沉积在聚合物基底上 并且通过比聚合物基底层更柔软的软质聚合物沉积在金属迹线上，聚合物基层和聚合物顶层的部分或全部涂层; 并且聚合物基层和聚合物顶层包含多个对准的孔以有助于软聚合物的结合。
-
公开(公告)号：US20090264972A1
公开(公告)日：2009-10-22
申请号：US12163658
申请日：2008-06-27
申请人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little
发明人： David Daomin Zhou , Robert J. Greenberg , Jordan Matthew Neysmith , Boon-Khai Ng , James Singleton Little
CPC分类号： A61N1/0543 , A61N1/0541 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/28 , H05K2201/0133 , H05K2201/0195 , Y10T156/1002
摘要： A flexible circuit electrode array, which comprises: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces; and a partial or entire coating of the base and top layer by a soft polymer.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) providing holes in the top polymer layer; (f) depositing a second soft polymer layer on the top polymer layer; (g) providing holes in the second soft polymer layer for bond pads and electrodes; and (h) preparing electrodes in the provided holes.A method of preparing a flexible circuit electrode array, comprising: (a) providing a first soft polymer layer; (b) depositing a first a base layer on the first soft polymer layer; (c) providing a metal thin film on the base layer; (d) depositing a top polymer layer on the metal thin film; (e) depositing a second soft polymer layer on the top polymer layer; (f) providing holes in the second soft polymer layer and in the top polymer layer for bond pads and electrodes; and (g) preparing electrodes in the provided holes.
摘要翻译： 一种柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基底层和所述金属迹线上的聚合物顶层; 以及通过软聚合物的基底和顶层的部分或全部涂层。 一种制备柔性电路电极阵列的方法，包括：（a）提供第一软聚合物层; （b）在第一软聚合物层上沉积第一基底层; （c）在基层上提供金属薄膜; （d）在金属薄膜上沉积顶部聚合物层; （e）在顶部聚合物层中提供孔; （f）在顶部聚合物层上沉积第二软聚合物层; （g）在第二软聚合物层中为接合焊盘和电极提供孔; 和（h）在所提供的孔中制备电极。 一种制备柔性电路电极阵列的方法，包括：（a）提供第一软聚合物层; （b）在第一软聚合物层上沉积第一基底层; （c）在基层上提供金属薄膜; （d）在金属薄膜上沉积顶部聚合物层; （e）在顶部聚合物层上沉积第二软聚合物层; （f）在第二软聚合物层和顶部聚合物层中提供用于接合焊盘和电极的孔; 和（g）在所提供的孔中制备电极。
-
-
-
搜索结果
4 条记录 (耗时 0.048 秒)