公开(公告)号：US20110256763A1

公开(公告)日：2011-10-20

申请号：US13081323

申请日：2011-04-06

Applicant: Jan De Geest ,  Stefaan Hendrik Jozef Sercu ,  Jonathan E. Buck ,  Douglas M. Johnescu ,  Stuart C. Stoner ,  Stephen B. Smith

Inventor： Jan De Geest ,  Stefaan Hendrik Jozef Sercu ,  Jonathan E. Buck ,  Douglas M. Johnescu ,  Stuart C. Stoner ,  Stephen B. Smith

IPC: H01R13/648 ,  H01R24/00

CPC classification number: H01R13/514 ,  H01R12/724 ,  H01R13/6464

Abstract: In an electrical connector, a non-grounded, electrically conductive material (such as copper foil or other sheet of metal) may be located adjacent to at least one differential signal pair. An example includes a ring of material that circumscribes a leadframe assembly. Ring-shaped structures placed around, but not in contact with, the signal and ground contacts effectively mitigate cross-talk resonances in the interconnection structure.

Abstract translation: 在电连接器中，可以将非接地的导电材料（例如铜箔或其它金属片）定位成与至少一个差分信号对相邻。 一个例子包括围绕引线框架组件的材料环。 放置在信号和接地触点周围但不接触的环形结构有效地减轻了互连结构中的串扰谐振。

公开(公告)号：US07709747B2

公开(公告)日：2010-05-04

申请号：US11287926

申请日：2005-11-28

Applicant: Danny L. C. Morlion ,  Stefaan Sercu ,  Winnie Heyvaert ,  Jan De Geest

Inventor： Danny L. C. Morlion ,  Stefaan Sercu ,  Winnie Heyvaert ,  Jan De Geest

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/114 ,  H05K1/0219 ,  H05K1/0237 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/10189 ,  H05K2201/10734

Abstract: Disclosed are methodologies for defining matched-impedance surface-mount technology footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads and an arrangement of electrically-conductive vias. The via arrangement may differ from the pad arrangement. The vias may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias and signal vias may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.

Abstract translation: 公开了用于在诸如印刷电路板的基板上定义匹配阻抗表面贴装技术足迹的方法，例如适于接收具有端子引线布置的电气部件。 这种覆盖区可以包括导电焊盘的布置和导电通孔的布置。 通孔布置可以不同于衬垫布置。 通孔可以被布置成增加布线密度，同时限制串扰并且提供组件和基板之间的匹配阻抗。 可以改变通孔布置以在板的层上实现期望的布线密度。 增加布线密度可能会减少电路板层数，这往往会降低电容，从而增加阻抗。 接地通路和信号通孔可以以影响阻抗的方式相对于彼此布置。 因此，可以改变通孔布置以实现与部件的阻抗匹配的阻抗。 也可以改变通孔装置以限制相邻信号导体之间的串扰。 因此，可以定义通孔布置以平衡系统的阻抗，串扰和布线密度要求。

公开(公告)号：US20080102702A1

公开(公告)日：2008-05-01

申请号：US11924002

申请日：2007-10-25

Applicant: Stefaan Hendrik Jozef Sercu ,  Jan De Geest ,  Jonathan E. Buck ,  Stephen B. Smith

Inventor： Stefaan Hendrik Jozef Sercu ,  Jan De Geest ,  Jonathan E. Buck ,  Stephen B. Smith

IPC: H01R13/648

CPC classification number: H01R12/724 ,  H01R13/6585

Abstract: An electrical connector having at least four electrical contacts that form two pairs of differential signal contacts. The first and second electrical contacts may be arranged edge-to-edge along a first direction. The third electrical contact may be adjacent to, and arranged broadside-to-broadside with, the first electrical contact along a second direction substantially transverse to the first direction. The first and third electrical contacts may define one of the pairs of differential signal contacts. The fourth electrical contact may be adjacent to, and arranged broadside-to-broadside with, the second electrical contact along the second direction. The second and fourth electrical contacts may define the other pair of differential signal contacts. The two pairs of differential signal contacts may be offset from one another along the second direction.

Abstract translation: 具有形成两对差分信号触点的至少四个电触点的电连接器。 第一和第二电触点可以沿着第一方向沿边缘对边缘布置。 第三电触头可以沿着基本上横向于第一方向的第二方向与第一电触头相邻并且布置成宽边到宽边。 第一和第三电触点可以限定差分信号触点对中的一个。 第四电接触可以沿着第二方向与第二电接触相邻并且布置成宽侧到宽边。 第二和第四电触点可以限定另一对差分信号触点。 两对差分信号触点可以沿第二方向彼此偏移。

公开(公告)号：US07316585B2

公开(公告)日：2008-01-08

申请号：US11626679

申请日：2007-01-24

Applicant: Stephen B. Smith ,  Jan De Geest ,  Stefaan Hendrik Jozef Sercu

Inventor： Stephen B. Smith ,  Jan De Geest ,  Stefaan Hendrik Jozef Sercu

IPC: H01R13/648

CPC classification number: H01P3/003

Abstract: An electrical connector including a lead frame assembly of a first dielectric material that includes a pocket filled with a second dielectric material. A first ground reference, which may be either a ground contact or conductor or a virtual ground defined between signal contacts of a differential signal pair, extends in the first dielectric material and has a first physical length. A second ground reference having a different physical length than the first length extends in the first dielectric material and also through the pocket. The combination of the length of the second ground reference through the pocket along with the difference in the dielectric constants associated with the first and second dielectric materials, provides for equalizing or matching the electrical lengths of these two references having different physical lengths. This may aid in reducing slot-line mode of a co-planar waveguide. The cross-sectional size of the second reference within the pocket may be altered to provide uniform impedance along the length of the second reference as well as an impedance matched to the first conductor.

Abstract translation: 一种电连接器，包括第一介电材料的引线框架组件，所述引线框架组件包括填充有第二电介质材料的凹穴。 可以是接地触点或导体的第一接地参考或在差分信号对的信号触点之间限定的虚拟接地在第一电介质材料中延伸并且具有第一物理长度。 具有与第一长度不同的物理长度的第二接地参考在第一电介质材料中延伸并且还通过口袋延伸。 通过口袋的第二接地参考的长度与与第一和第二介电材料相关联的介电常数的差异的组合提供均衡或匹配具有不同物理长度的这两个参考物的电长度。 这有助于减小共面波导的槽线模式。 口袋内的第二参考线的横截面尺寸可以改变，以沿着第二参考线的长度提供均匀的阻抗以及与第一导体匹配的阻抗。

公开(公告)号：US08715003B2

公开(公告)日：2014-05-06

申请号：US12974132

申请日：2010-12-21

Applicant: Jonathan E. Buck ,  Stefaan Hendrik Jozef Sercu ,  Jan De Geest

Inventor： Jonathan E. Buck ,  Stefaan Hendrik Jozef Sercu ,  Jan De Geest

IPC: H01R13/648

CPC classification number: H01R13/514 ,  H01R12/73 ,  H01R13/6474

Abstract: An electrical connector is provided that includes a connector housing supporting a plurality of electrical contacts. The electrical contacts are edge-coupled along a column direction, and spaced apart along a row direction so as to define a space that is defined by adjacent electrical contacts along the row direction. The electrical connector includes at least one rib disposed in the space. The rib has a dielectric constant greater than air such that the dielectric constant of the space is increased with respect to a substantially identical space that is filled only with air. The increased dielectric constant reduces the impedance of the electrical connector.

Abstract translation: 提供一种电连接器，其包括支撑多个电触点的连接器壳体。 电触点沿着列方向边缘耦合，并且沿着行方向间隔开，以便限定由相邻的电触点沿着行方向限定的空间。 电连接器包括设置在该空间中的至少一个肋。 肋具有大于空气的介电常数，使得空间的介电常数相对于仅用空气填充的基本相同的空间增加。 介电常数的增加降低了电连接器的阻抗。

公开(公告)号：US07708569B2

公开(公告)日：2010-05-04

申请号：US11924002

申请日：2007-10-25

Applicant: Stefaan Hendrik Jozef Sercu ,  Jan De Geest ,  Jonathan E. Buck ,  Stephen B. Smith

Inventor： Stefaan Hendrik Jozef Sercu ,  Jan De Geest ,  Jonathan E. Buck ,  Stephen B. Smith

IPC: H01R13/648

CPC classification number: H01R12/724 ,  H01R13/6585

Abstract: An electrical connector having at least four electrical contacts that form two pairs of differential signal contacts. The first and second electrical contacts may be arranged edge-to-edge along a first direction. The third electrical contact may be adjacent to, and arranged broadside-to-broadside with, the first electrical contact along a second direction substantially transverse to the first direction. The first and third electrical contacts may define one of the pairs of differential signal contacts. The fourth electrical contact may be adjacent to, and arranged broadside-to-broadside with, the second electrical contact along the second direction. The second and fourth electrical contacts may define the other pair of differential signal contacts. The two pairs of differential signal contacts may be offset from one another along the second direction.

Abstract translation: 具有形成两对差分信号触点的至少四个电触点的电连接器。 第一和第二电触点可以沿着第一方向沿边缘对边缘布置。 第三电触头可以沿着基本上横向于第一方向的第二方向与第一电触头相邻并且布置成宽侧到宽边。 第一和第三电触点可以限定差分信号触点对中的一个。 第四电接触可以沿着第二方向与第二电接触相邻并且布置成宽侧到宽边。 第二和第四电触点可以限定另一对差分信号触点。 两对差分信号触点可以沿着第二方向彼此偏移。

公开(公告)号：US20080021519A1

公开(公告)日：2008-01-24

申请号：US11597730

申请日：2005-05-26

Applicant: Jan De Geest ,  Wim De Geest

Inventor： Jan De Geest ,  Wim De Geest

IPC: A61N1/04

CPC classification number: G08B6/00 ,  G08B21/24

Abstract: Electric communication unit to be placed on a person's skin, comprising a support element (3), a series of body contacts (7), a pulse generator (6) provided for generating a series of pulses and for transmitting the series of pulses to said series of body contacts (7), said series of body contacts (7) being provided to transmit said series of pulses onto the skin of said person. The electric communication unit is in the form of a patch.

Abstract translation: 电气通信单元被放置在人的皮肤上，包括支撑元件（3），一系列身体触点（7），脉冲发生器（6），用于产生一系列脉冲并用于将所述一系列脉冲发送到所述 一系列身体接触（7），所述一系列身体接触（7）被提供以将所述一系列脉冲传送到所述人的皮肤上。 电气通信单元是补丁的形式。

公开(公告)号：US09545003B2

公开(公告)日：2017-01-10

申请号：US14092039

申请日：2013-11-27

Applicant: Madhumitha Rengarajan ,  Jan De Geest ,  Stephen B. Smith ,  Stefaan Hendrik Jozef Sercu

Inventor： Madhumitha Rengarajan ,  Jan De Geest ,  Stephen B. Smith ,  Stefaan Hendrik Jozef Sercu

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/116 ,  H05K1/0222 ,  H05K1/0251 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2203/0207 ,  H05K2203/0242

Abstract: An electrical connector footprint on a printed circuit board (PCB) can include vias and antipads surrounding those vias. While conventional antipads surrounding vias are large in order to improve impedance of the PCB, the presence of the antipads can compromise the integrity of the ground plane and can permit cross talk to arise between differential pairs on different layers in the PCB. Antipads can be constructed and arranged so as to limit cross talk between layers in a PCB, while also maximizing impedance.

Abstract translation: 印刷电路板（PCB）上的电连接器封装可以包括围绕这些通孔的通孔和反电极片。 虽然围绕通孔的常规反焊盘较大以改善PCB的阻抗，但是反焊盘的存在可能损害接地平面的完整性，并且可以允许在PCB中的不同层上的差分对之间产生串扰。 可以构建和布置反阻臂以限制PCB中的层之间的串扰，同时还使阻抗最大化。

公开(公告)号：US20080085618A1

公开(公告)日：2008-04-10

申请号：US11866061

申请日：2007-10-02

Applicant: Stefaan Hendrik Jozef Sercu ,  Jan De Geest

Inventor： Stefaan Hendrik Jozef Sercu ,  Jan De Geest

IPC: H01R4/66

CPC classification number: H01R13/6586 ,  H01R12/7082 ,  H01R13/6471 ,  H01R13/6477

Abstract: An electrical connector having a first electrical contact and a second electrical contact adjacent to the first electrical contact. The first electrical contact may define a first broadside and a second broadside opposite the first broadside. The second electrical contact may define a third broadside and a fourth broadside opposite the third broadside. The electrical connector may further include a non-air dielectric and a commoned ground plate. The non-air dielectric may be disposed between the second broadside of the first electrical contact and the fourth broadside of the second electrical contact. The commoned ground plate and the first electrical contact may be adjacent to one another and may be separated by an air dielectric.

Abstract translation: 一种电连接器，具有与第一电触点相邻的第一电接触和第二电接触。 第一电触头可以限定与第一宽边相对的第一宽边和第二宽边。 第二电触点可以限定与第三宽边相对的第三宽边和第四宽边。 电连接器还可以包括非空气电介质和公共接地板。 非空气电介质可以设置在第一电触点的第二宽侧和第二电接触的第四宽边之间。 公共接地板和第一电接触件可以彼此相邻并且可以由空气电介质分离。

公开(公告)号：US09385477B2

公开(公告)日：2016-07-05

申请号：US13993438

申请日：2011-12-13

Applicant: Jan De Geest

Inventor： Jan De Geest

IPC: H01R12/00 ,  H01R13/646 ,  H01R13/6477 ,  H01R12/72

CPC classification number: H01R13/646 ,  H01R12/721 ,  H01R13/6477

Abstract: A connector for connection between a circuit board and a further electronic component is disclosed. The connector includes an insulating housing having a board slot open towards a mating direction for accommodating the circuit board, and a plurality of terminals. The terminals have a rear portion, an intermediate portion and a tip portion, the intermediate portion including a contact portion for contacting a surface portion of the circuit board when accommodated in the board slot. The housing includes a window such that for a number of adjacent terminals housing material is absent between the intermediate portions. A shield member may be arranged in between the rear portions of the terminals. Improved circuit boards are also disclosed.

Abstract translation: 公开了一种用于电路板和另一电子部件之间连接的连接器。 连接器包括绝缘壳体，其具有朝向配合方向开口的板槽，用于容纳电路板，以及多个端子。 端子具有后部，中间部分和尖端部分，中间部分包括接触部分，用于在容纳在板槽中时接触电路板的表面部分。 壳体包括一个窗口，使得对于多个相邻的端子，在中间部分之间不存在壳体材料。 可以在端子的后部之间布置屏蔽构件。 还公开了改进的电路板。