APPARATUS AND METHOD FOR DRYING SUBSTRATES
    11.
    发明申请
    APPARATUS AND METHOD FOR DRYING SUBSTRATES 有权
    干燥基材的装置和方法

    公开(公告)号:US20100146813A1

    公开(公告)日:2010-06-17

    申请号:US12600550

    申请日:2008-05-22

    Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.

    Abstract translation: 使用异丙醇(IPA)干燥基材的方法包括:将加热的流体注入基材的底表面的前期,同时提高基材的温度,以将有机溶剂注入到 将干燥气体的基材和其上表面注入,以提高有机溶剂的蒸发能力; 并且终止加热流体的注入并将有机溶剂和干燥气体注入到基板的顶表面的最后阶段。

    SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TRANSFERRING SUBSTRATE FOR THE APPARATUS
    12.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND METHOD FOR TRANSFERRING SUBSTRATE FOR THE APPARATUS 有权
    基板处理装置和用于传送装置的基板的方法

    公开(公告)号:US20100047045A1

    公开(公告)日:2010-02-25

    申请号:US12544552

    申请日:2009-08-20

    CPC classification number: H01L21/67769 H01L21/67775

    Abstract: A substrate processing apparatus includes a main load unit, a buffer load unit, and a transfer unit. Containers each accommodating substrates are placed on the main load unit and the buffer load unit. The buffer load unit is disposed above the main load unit and movable into and outward from a process module. Therefore, more containers can be placed in the substrate processing apparatus without increasing the footprint of the substrate processing apparatus, and thus it is possible to reduce equipment idle time during which standby substrates wait before being processed, thereby improving productivity.

    Abstract translation: 衬底处理装置包括主负载单元,缓冲器负载单元和转移单元。 容纳各容纳基板的容器被放置在主负载单元和缓冲装载单元上。 缓冲装载单元设置在主负载单元上方,并可从处理模块移入和移出。 因此,可以在基板处理装置中放置更多的容器,而不会增加基板处理装置的占地面积,从而可以减少备用基板在处理之前等待的设备空闲时间,从而提高生产率。

    Method and apparatus for cleaning and driving wafers
    13.
    发明申请
    Method and apparatus for cleaning and driving wafers 审中-公开
    清洁和驱动晶圆的方法和装置

    公开(公告)号:US20080308131A1

    公开(公告)日:2008-12-18

    申请号:US12222697

    申请日:2008-08-14

    CPC classification number: H01L21/67051 B08B3/024 C23G5/00 H01L21/67028

    Abstract: The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving direction. The injection unit migrates straightly from the center of a wafer to the edge thereof, and the first and second injection ports are linearly arranged on a moving line of the nozzle.

    Abstract translation: 本发明涉及一种用于清洗和干燥晶片的方法和设备。 该装置包括具有第一和第二注射端口的注射单元,该第一和第二注射端口配置用于注射不同的流体并沿着玫瑰的移动方向或与移动方向相邻的线布置。 注射单元从晶片的中心直线移动到其边缘,并且第一和第二注入口线性地布置在喷嘴的移动线上。

    Apparatus for treating substrate
    14.
    发明授权
    Apparatus for treating substrate 有权
    用于处理基材的设备

    公开(公告)号:US07323080B2

    公开(公告)日:2008-01-29

    申请号:US11084034

    申请日:2005-03-21

    CPC classification number: H01L21/67086 H01L21/67051 H01L21/67069

    Abstract: The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.

    Abstract translation: 本发明涉及用于蚀刻晶片的顶部边缘和底部的装置。 该装置包括用于支撑晶片的基板支撑部分和用于防止蚀刻流体流入晶片的非蚀刻部分的可移动保护部分。 通过湿式蚀刻蚀刻晶片的顶部边缘和底部,通过干蚀刻蚀刻非蚀刻部分和晶片边缘的边界。

    Chemical supply apparatus
    15.
    发明授权
    Chemical supply apparatus 有权
    化工设备

    公开(公告)号:US06918406B2

    公开(公告)日:2005-07-19

    申请号:US10412209

    申请日:2003-04-14

    Abstract: The present invention is directed to a chemical supply apparatus including a first tank in which at least two chemicals supplied from each supply bath are mixed, circulating means for circulating the chemicals in the first tank to uniformly mix the chemicals therein, a second tank for storing the mixed solution provided from the first tank, a distributor for distributing the mixed solution to supply the mixed solution to each processing unit, and a heating unit mounted upon a supply line for supplying the mixed solution to the distributor to heat up the mixed solution.

    Abstract translation: 本发明涉及一种化学品供应装置,其包括:第一罐,其中从每个供应浴供应的至少两种化学品混合;循环装置,用于使第一罐中的化学物质循环,使其中的化学品均匀混合;第二罐, 从第一罐提供的混合溶液,用于分配混合溶液以将混合溶液供应到每个处理单元的分配器,以及安装在供给管线上的加热单元,用于将混合溶液供给到分配器以加热混合溶液。

    Wafer drying method
    16.
    发明授权
    Wafer drying method 有权
    晶圆烘干法

    公开(公告)号:US06784106B2

    公开(公告)日:2004-08-31

    申请号:US10183788

    申请日:2002-06-26

    CPC classification number: H01L21/67028 H01L21/67034

    Abstract: A method for drying a semiconductor substrate includes the steps of clearing the substrate by supplying a liquid into a processing bath of a chamber, injecting first dry gases onto a surface of the supplied liquid, draining the liquid from the processing bath so that the substrate is slowly exposed to the surface of the liquid, and injecting a second dry gas into the chamber and forcibly exhausting gas in the chamber.

    Abstract translation: 干燥半导体衬底的方法包括以下步骤:通过将液体供应到室的处理槽中来清洗衬底,将第一干燥气体注入到所提供的液体的表面上,从处理槽排出液体,使得衬底为 缓慢地暴露于液体的表面,并且将第二干燥气体注入到室中并强制地排出腔室中的气体。

    Wafer drying apparatus
    17.
    发明授权
    Wafer drying apparatus 有权
    晶圆烘干设备

    公开(公告)号:US06757989B2

    公开(公告)日:2004-07-06

    申请号:US10183813

    申请日:2002-06-26

    CPC classification number: H01L21/67034

    Abstract: An apparatus for drying a semiconductor substrate includes a chamber having a processing bath and a cover, a liquid flow system for supplying a liquid flow into the processing bath so as to clean the substrate and for draining a liquid from the processing bath, a gas distributor for spraying a gas for drying the substrate, and decompression means for exhausting air in the chamber.

    Abstract translation: 用于干燥半导体衬底的设备包括具有处理槽和盖的室,用于将液体流供应到处理槽中以便清洁衬底并从处理槽排出液体的液体流动系统,气体分配器 用于喷射用于干燥基底的气体,以及用于排出腔室中的空气的减压装置。

    APPARATUS AND METHOD FOR DRYING SUBSTRATES
    18.
    发明申请
    APPARATUS AND METHOD FOR DRYING SUBSTRATES 审中-公开
    干燥基材的装置和方法

    公开(公告)号:US20130074359A1

    公开(公告)日:2013-03-28

    申请号:US13586250

    申请日:2012-11-02

    Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.

    Abstract translation: 使用异丙醇(IPA)干燥基材的方法包括:将加热的流体注入基材的底表面的前期,同时提高基材的温度,以将有机溶剂注入到 将干燥气体的基材和其上表面注入,以提高有机溶剂的蒸发能力; 并且终止加热流体的注入并将有机溶剂和干燥气体注入到基板的顶表面的最后阶段。

    SPIN HEAD, APPARATUS FOR TREATING SUBSTRATE, AND METHOD FOR TREATING SUBSTRATE
    19.
    发明申请
    SPIN HEAD, APPARATUS FOR TREATING SUBSTRATE, AND METHOD FOR TREATING SUBSTRATE 有权
    旋转头,处理基板的装置和处理基板的方法

    公开(公告)号:US20100126539A1

    公开(公告)日:2010-05-27

    申请号:US12623582

    申请日:2009-11-23

    CPC classification number: H01L21/68728 H01L21/67051 H01L21/68785

    Abstract: Provided is a spin head supporting a substrate and rotating the substrate. The spin head includes a body, chuck pins installed on the body and moving between supporting positions where a substrate is supported and waiting positions providing space for loading/unloading of the substrate, and a chuck pin moving unit configured to move the chuck pins. The chuck pin moving unit includes a rotation rod coupled with each of the chuck pins, a pivot pin fixing the rotation rod to the body, and a driving member rotating the rotation rod about the pivot pin as a rotation shaft to move the chuck pin from the supporting position to the waiting position. When the body rotates, the rotation rod uses reverse centrifugal force to apply force to the chuck pin from the waiting position to the supporting position. The chuck pins include first pins and second pins that alternately chuck a substrate during a process.

    Abstract translation: 提供了支撑衬底并旋转衬底的旋转头。 旋转头包括主体,安装在主体上的卡盘销,并且在支撑基板的支撑位置和在提供用于装载/卸载基板的空间的等待位置之间移动的卡盘销以及配置成移动卡盘销的卡盘销移动单元。 卡盘销移动单元包括与每个卡盘销连接的旋转杆,将旋转杆固定到主体上的枢轴销和驱动构件,该旋转杆将旋转杆围绕枢转销旋转,以将卡盘销从 支持位置到等待位置。 当主体旋转时,旋转杆使用反向离心力将卡盘销从等待位置向支撑位置施加力。 卡盘销包括在过程中交替地卡住基板的第一销和第二销。

    System and method for supplying functional water
    20.
    发明授权
    System and method for supplying functional water 有权
    供水功能的系统和方法

    公开(公告)号:US07617836B2

    公开(公告)日:2009-11-17

    申请号:US11377679

    申请日:2006-03-17

    Abstract: A supply system for supplying a functional water to a process unit which treats a substrate using the functional water is provided. In the system, the functional water generated in the functional water generator is supplied to a distributor through a functional water supply pipe. Thereafter, the functional water is supplied to the process unit while the process unit performs a process, and the functional water is returned to the functional water generator through a functional water returning pipe while the process unit does not perform a process. A buffer tank is installed in the functional water supply pipe and the concentration of the functional water is measured in a circulation line connected with the buffer tank. When the measured concentration of the functional water goes out of a set concentration range, the functional water is returned to the functional water generator through functional water returning pipe.

    Abstract translation: 提供了一种用于向功能水处理基板的处理单元供给功能水的供给系统。 在该系统中,功能水发生器中产生的功能水通过功能性供水管道供给到分配器。 此后,在处理单元执行处理时,将功能水供给处理单元,并且在处理单元不执行处理时,功能水通过功能回水管返回到功能水生成器。 在功能性供水管中安装缓冲罐,在与缓冲罐连接的循环管线中测量功能水的浓度。 当功能水的测量浓度超出设定浓度范围时,功能水通过功能回水管返回到功能水发生器。

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