公开(公告)号：US08793898B2

公开(公告)日：2014-08-05

申请号：US12600550

申请日：2008-05-22

申请人： Young-Ju Jeong ,  Bok-Kyu Lee ,  Sun-Kyu Hwang ,  Jeong-Yong Bae ,  Soo-Bin Yong

发明人： Young-Ju Jeong ,  Bok-Kyu Lee ,  Sun-Kyu Hwang ,  Jeong-Yong Bae ,  Soo-Bin Yong

IPC分类号： F26B3/00

CPC分类号： F26B21/14 ,  F26B3/00 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/67051

摘要： A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.

摘要翻译： 使用异丙醇（IPA）干燥基材的方法包括：将加热的流体注入基材的底表面的前期，同时提高基材的温度，以将有机溶剂注入到 将干燥气体的基材和其上表面注入，以提高有机溶剂的蒸发能力; 并且终止加热流体的注入并将有机溶剂和干燥气体注入到基板的顶表面的最后阶段。

公开(公告)号：US20100146813A1

公开(公告)日：2010-06-17

申请号：US12600550

申请日：2008-05-22

申请人： Young-Ju Jeong ,  Bok-Kyu Lee ,  Sun-Kyu Hwang ,  Jeong-Yong Bae ,  Soo-Bin Yong

发明人： Young-Ju Jeong ,  Bok-Kyu Lee ,  Sun-Kyu Hwang ,  Jeong-Yong Bae ,  Soo-Bin Yong

IPC分类号： F26B3/32 ,  F26B19/00

CPC分类号： F26B21/14 ,  F26B3/00 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/67051

摘要： A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.

摘要翻译： 使用异丙醇（IPA）干燥基材的方法包括：将加热的流体注入基材的底表面的前期，同时提高基材的温度，以将有机溶剂注入到 将干燥气体的基材和其上表面注入，以提高有机溶剂的蒸发能力; 并且终止加热流体的注入并将有机溶剂和干燥气体注入到基板的顶表面的最后阶段。

公开(公告)号：US09529267B2

公开(公告)日：2016-12-27

申请号：US13928446

申请日：2013-06-27

申请人： Eun-Su Rho ,  Jeong-Yong Bae

发明人： Eun-Su Rho ,  Jeong-Yong Bae

IPC分类号： B08B3/00 ,  G03F7/42 ,  H01L21/67

CPC分类号： G03F7/422 ,  G03F7/423 ,  H01L21/6708

摘要： A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.

摘要翻译： 一种用于处理衬底的方法包括布置其上形成有光致抗蚀剂层的衬底，并提供用于去除衬底上的光致抗蚀剂层的处理液。 该方法还包括在基材上提供包含去离子水或过氧化氢的雾以与处理液体接触，从而提高处理液的温度。 因此，可以提高除去光致抗蚀剂层的效率。

公开(公告)号：US20050247667A1

公开(公告)日：2005-11-10

申请号：US11084034

申请日：2005-03-21

申请人： In-Jun Kim ,  Jung-Keun Cho ,  Jang-Seob Choi ,  Yong-Nam Choi ,  Jeong-Yong Bae

发明人： In-Jun Kim ,  Jung-Keun Cho ,  Jang-Seob Choi ,  Yong-Nam Choi ,  Jeong-Yong Bae

IPC分类号： H01L21/3065 ,  C23F1/00 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/67086 ,  H01L21/67051 ,  H01L21/67069

摘要： The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.

摘要翻译： 本发明涉及用于蚀刻晶片的顶部边缘和底部的装置。 该装置包括用于支撑晶片的基板支撑部分和用于防止蚀刻流体流入晶片的非蚀刻部分的可移动保护部分。 通过湿式蚀刻蚀刻晶片的顶部边缘和底部，通过干蚀刻蚀刻非蚀刻部分和晶片边缘的边界。

公开(公告)号：US07617836B2

公开(公告)日：2009-11-17

申请号：US11377679

申请日：2006-03-17

申请人： Ju-Won Kim ,  Doo-Keun An ,  Kwang-Il Choi ,  Pyong-Soon Jung ,  Yong-Nam Choi ,  Jeong-Yong Bae

发明人： Ju-Won Kim ,  Doo-Keun An ,  Kwang-Il Choi ,  Pyong-Soon Jung ,  Yong-Nam Choi ,  Jeong-Yong Bae

IPC分类号： G05D11/08

CPC分类号： C02F1/008 ,  C01B5/00 ,  C02F1/685 ,  C02F2103/02 ,  C02F2103/026 ,  Y10T137/0324 ,  Y10T137/0329 ,  Y10T137/2509

摘要： A supply system for supplying a functional water to a process unit which treats a substrate using the functional water is provided. In the system, the functional water generated in the functional water generator is supplied to a distributor through a functional water supply pipe. Thereafter, the functional water is supplied to the process unit while the process unit performs a process, and the functional water is returned to the functional water generator through a functional water returning pipe while the process unit does not perform a process. A buffer tank is installed in the functional water supply pipe and the concentration of the functional water is measured in a circulation line connected with the buffer tank. When the measured concentration of the functional water goes out of a set concentration range, the functional water is returned to the functional water generator through functional water returning pipe.

摘要翻译： 提供了一种用于向功能水处理基板的处理单元供给功能水的供给系统。 在该系统中，功能水发生器中产生的功能水通过功能性供水管道供给到分配器。 此后，在处理单元执行处理时，将功能水供给处理单元，并且在处理单元不执行处理时，功能水通过功能回水管返回到功能水生成器。 在功能性供水管中安装缓冲罐，在与缓冲罐连接的循环管线中测量功能水的浓度。 当功能水的测量浓度超出设定浓度范围时，功能水通过功能回水管返回到功能水发生器。

公开(公告)号：US20090108545A1

公开(公告)日：2009-04-30

申请号：US12091743

申请日：2006-10-26

申请人： Oh-Jin Kwon ,  Jeong-Yong Bae ,  Jeong-Yeol Choi

发明人： Oh-Jin Kwon ,  Jeong-Yong Bae ,  Jeong-Yeol Choi

IPC分类号： B23B31/12

CPC分类号： H01L21/6708 ,  H01L21/68728 ,  Y10T279/18

摘要： The present invention is directed to a spin chuck for use in a process, such as a cleaning process and an etching process, performed while rotating a substrate. The spin chuck includes a spin head on which a substrate is placed, a driving part configured to rotate the spin head, and a fix bracket installed on the spin head and having a contact surface that is in contact with a flat surface of a flat zone of the substrate at a position corresponding to the flat zone to prevent a vortex caused by the flat zone. Since the fix bracket has the same shape as the flat zone of the substrate, an air current unbalance resulting from the flat zone is suppressed to uniformly inject etchants to a rear surface of the substrate.

摘要翻译： 本发明涉及一种旋转卡盘，用于在旋转基板的同时执行诸如清洁处理和蚀刻工艺的工艺。 旋转卡盘包括其上放置基板的旋转头，构造成旋转旋转头的驱动部分和安装在旋转头上的固定支架，并且具有与平坦区域的平坦表面接触的接触表面 在对应于平坦区域的位置处的基板，以防止由平坦区域引起的涡流。 由于固定支架具有与基板的平坦区域相同的形状，所以抑制了从平坦区域产生的气流不平衡，以均匀地将蚀刻剂注入基板的后表面。

公开(公告)号：US5873261A

公开(公告)日：1999-02-23

申请号：US719207

申请日：1996-09-25

申请人： Jeong-Yong Bae

发明人： Jeong-Yong Bae

IPC分类号： F04C29/12 ,  F25B43/00

CPC分类号： F04C29/12 ,  F25B43/006

摘要： Disclosed is an accumulator for a rotary compressor, the accumulator being formed with a lengthy L-tube, thus improving the efficiency of the compressor. The present invention includes a lengthy refrigerant transferring part formed around the outer circumference of the compressor to separate gaseous refrigerant from liquid refrigerant in the accumulator, and to send only the gaseous refrigerant into the cylinder; and a pipe fixing strip to fix the refrigerant transferring part to the compressor to prevent the movement of the refrigerant transferring part otherwise caused by the vibration and noise, thus improving the EER and the cooling capability of the compressor.

摘要翻译： 公开了一种用于旋转式压缩机的蓄能器，该蓄能器形成有长L型管，从而提高了压缩机的效率。 本发明包括在压缩机的外周形成的长度的制冷剂传递部分，以将气态制冷剂与储液器中的液体制冷剂分离，并仅将气态制冷剂送入气缸; 以及用于将制冷剂传递部分固定到压缩机以防止由于振动和噪声引起的制冷剂传递部分移动的管固定条，从而提高了压缩机的EER和冷却能力。

公开(公告)号：US20090145463A1

公开(公告)日：2009-06-11

申请号：US12289751

申请日：2008-11-03

申请人： Rae-Taek Oh ,  Choon-Sik Kim ,  Jeong-Yong Bae

发明人： Rae-Taek Oh ,  Choon-Sik Kim ,  Jeong-Yong Bae

IPC分类号： B08B7/04 ,  B08B13/00 ,  B01F15/02

CPC分类号： B01F3/0876 ,  B01F3/088 ,  B01F5/0077 ,  B01F5/061 ,  B01F15/0429 ,  B01F2003/04886 ,  B01F2215/0096 ,  B08B2203/005 ,  H01L21/67017

摘要： Provided are an ozonated water mixture supply apparatus and method, and a substrate treating facility that receives an ozonated water mixture from the apparatus to treat a substrate. The ozonated water mixture supply apparatus includes a mixing line and distribution lines. The mixing line respectively receives a treating liquid and an ozonated water from a treating liquid supply line and an ozonated water supply line and mixes the treating liquid and the ozonated water to generate the ozonated water mixture satisfying a previously set concentration. Each of the distribution lines distributes the ozonated water mixture generated from the mixing line into a process unit. The mixing line includes a mixing valve and a static mixer. Therefore, the ozonated water mixture having the previously set concentration is generated and supplied using an in-line mixing method without requiring a mixing vessel such as a mixing tank.

摘要翻译： 提供了一种臭氧水混合物供应装置和方法，以及从该装置接收臭氧水混合物以处理基材的基板处理设备。 臭氧水混合物供给装置包括混合线和分配线。 混合线分别从处理液体供给管线和臭氧化供水管路接收处理液和臭氧水，并将处理液和臭氧水混合，产生满足预先设定浓度的臭氧水混合物。 每个分配线将从混合生产线产生的臭氧水混合物分配到处理单元中。 混合线包括混合阀和静态混合器。 因此，使用在线混合方法生产并提供具有预先设定的浓度的臭氧化水混合物，而不需要诸如混合罐的混合容器。

公开(公告)号：US07154611B2

公开(公告)日：2006-12-26

申请号：US10412120

申请日：2003-04-11

申请人： Chung-Sik Kim ,  Jeong-Yong Bae

发明人： Chung-Sik Kim ,  Jeong-Yong Bae

IPC分类号： G01B11/02

CPC分类号： G01B11/0625 ,  H01L22/12

摘要： A spin etcher with a thickness measuring system includes a rotatable spin head, etchant supply means, and etchant supply controller. A substrate is mounted upon the spin head. The etchant supply means is disposed over the substrate, and sprays an etchant onto the substrate. The etchant supply controller controls the etchant supply. The spin etcher further includes a main controller for transferring an etchant supply stop signal to the thickness measuring system and the etchant supply controller. The thickness measuring system allows a light to impinge on a surface of the substrate, and analyzes an interference signal of the light reflected from the substrate to measure a thickness of a thin film. The main controller compares a result measured by the thickness measuring system with a reference value, and transfers the etchant supply stop signal to the etchant supply controller before the measured result reaches the reference value. During a predetermined time after the etchant supply is stopped, the thin film is etched one more time by an etchant remaining on the substrate. As a result, the thickness of the thin film reaches the reference value.

摘要翻译： 具有厚度测量系统的旋转蚀刻机包括可旋转旋转头，蚀刻剂供应装置和蚀刻剂供应控制器。 衬底安装在旋转头上。 蚀刻剂供给装置设置在衬底上，并且将蚀刻剂喷射到衬底上。 蚀刻剂供应控制器控制蚀刻剂供应。 旋转蚀刻器还包括用于将蚀刻剂供给停止信号传送到厚度测量系统和蚀刻剂供应控制器的主控制器。 厚度测量系统允许光照射到衬底的表面上，并且分析从衬底反射的光的干涉信号以测量薄膜的厚度。 主控制器将由厚度测量系统测量的结果与参考值进行比较，并在测量结果达到参考值之前将蚀刻剂供应停止信号传送到蚀​​刻剂供应控制器。 在蚀刻剂供应停止之后的预定时间期间，通过残留在衬底上的蚀刻剂再次蚀刻薄膜。 结果，薄膜的厚度达到基准值。

公开(公告)号：US20060081269A1

公开(公告)日：2006-04-20

申请号：US11073687

申请日：2005-03-08

申请人： One-Vai Kim ,  Jae-Sun Han ,  Jeong-Yong Bae ,  Jung-Keun Cho

发明人： One-Vai Kim ,  Jae-Sun Han ,  Jeong-Yong Bae ,  Jung-Keun Cho

IPC分类号： C23G1/00 ,  B08B3/00 ,  B08B3/12

CPC分类号： H01L21/67051 ,  B08B3/024 ,  C23G5/00 ,  H01L21/67028

摘要： The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving direction. The injection unit migrates straightly from the center of a wafer to the edge thereof, and the first and second injection ports are linearly arranged on a moving line of the nozzle.

摘要翻译： 本发明涉及一种用于清洗和干燥晶片的方法和设备。 该装置包括具有第一和第二注射端口的注射单元，该第一和第二注射端口配置用于注射不同的流体并沿着玫瑰的移动方向或与移动方向相邻的线布置。 注射单元从晶片的中心直线移动到其边缘，并且第一和第二注入口线性地布置在喷嘴的移动线上。