Electrical feed-through structure and method
    11.
    发明授权
    Electrical feed-through structure and method 有权
    电气馈通结构和方法

    公开(公告)号:US07164142B2

    公开(公告)日:2007-01-16

    申请号:US10072607

    申请日:2002-02-08

    CPC classification number: H01J37/065 H01J2237/166

    Abstract: Electrical lead-through systems from atmospheric into vacuum environments are presented. Electrical feed-through structures (EFTS) comprised of a multiplicity of parallel connection lines used to operate e-beam tip-array sources in high vac environments for chip lithography are disclosed. In one embodiment, an EFTS comprises a sheet of insulating material having conductive tracks extending along potions of the sheet and a vacuum seal separating one portion from another portion of the sheet so as to maintain a pressure differential among multiple portions of the sheet.

    Abstract translation: 介绍了从大气到真空环境的电气导通系统。 公开了由用于在用于芯片光刻的高真空环境中操作电子束尖端阵列源的多个并联连接线组成的电气馈通结构(EFTS)。 在一个实施例中,EFTS包括具有沿着片材的一部分延伸的导电轨道的绝缘材料片和将片材的另一部分分开的真空密封件,以便保持片材的多个部分之间的压力差。

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