公开(公告)号：US08712304B2

公开(公告)日：2014-04-29

申请号：US13442240

申请日：2012-04-09

Applicant: Jin Wu ,  Lanhui Zhang ,  Lin Ma ,  Jonathan H. Herko

Inventor： Jin Wu ,  Lanhui Zhang ,  Lin Ma ,  Jonathan H. Herko

IPC: G03G15/20

CPC classification number: G03G15/2057

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer having a polyimide polymer and a fluoro acid. A method of manufacturing a fuser member is also described.

Abstract translation: 本教导提供定影器构件。 定影器构件包括具有聚酰亚胺聚合物和氟酸的基底层。 还描述了一种制造定影器构件的方法。

公开(公告)号：US08691664B2

公开(公告)日：2014-04-08

申请号：US12685523

申请日：2010-01-11

Applicant: Ku-Feng Yang ,  Weng-Jin Wu ,  Wen-Chih Chiou ,  Jung-Chih Hu

Inventor： Ku-Feng Yang ,  Weng-Jin Wu ,  Wen-Chih Chiou ,  Jung-Chih Hu

IPC: H01L21/00

CPC classification number: H01L21/30625 ,  H01L21/30608 ,  H01L21/3212 ,  H01L21/76898 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13109 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/9202 ,  H01L2225/06541 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: A method of forming a semiconductor device is presented. A conductor is embedded within a substrate, wherein the substrate contains a non-conducting material. The backside of the substrate is ground to a thickness wherein at least 1 μm of the non-conducting material remains on the backside covering the conductor embedded within the substrate. Chemical mechanical polishing (CMP) is employed with an undiscerning slurry to the backside of the substrate, thereby planarizing the substrate and exposing the conductive material. A spin wet-etch, with a protective formulation, is employed to remove a thickness y of the non-conducting material from the backside of the substrate, thereby causing the conductive material to uniformly protrude from the backside of the substrate.

Abstract translation: 提出了一种形成半导体器件的方法。 导体嵌入衬底内，其中衬底含有非导电材料。 将衬底的背面研磨成厚度，其中至少1μm的非导电材料保留在覆盖衬底内的导体的背面上。 采用化学机械抛光（CMP），其具有不透明的浆料到衬底的背面，由此平坦化衬底并暴露导电材料。 使用具有保护性配方的旋转湿蚀刻从衬底的背面除去非导电材料的厚度y，从而使导电材料从衬底的背面均匀地突出。

公开(公告)号：US20140030438A1

公开(公告)日：2014-01-30

申请号：US13557466

申请日：2012-07-25

Applicant: Varun Sambhy ,  Jin Wu ,  Kock-Yee Law ,  Kyle B. Tallman ,  Darren Smith ,  Michael S. Roetker

Inventor： Varun Sambhy ,  Jin Wu ,  Kock-Yee Law ,  Kyle B. Tallman ,  Darren Smith ,  Michael S. Roetker

IPC: C09D5/00 ,  B05D3/00

CPC classification number: B41J2/1606 ,  B41J2/164

Abstract: A coating for an ink jet printhead front face, wherein the coating comprises an oleophobic low adhesion coating having high thermal stability as indicated by less than about 15 percent weight loss when heated to up to 300° C., and wherein a drop of ultra-violet (UV) gel ink or a drop of solid ink exhibits a contact angle of greater than about 45° and sliding angle of less than about 30° with a surface of the coating, wherein the coating maintains the contact angle and sliding angle after the coating has been exposed to a temperature of at least 200° C. for at least 30 minutes. In particular, the coating shows no oil on the coating surface after curing.

Abstract translation: 一种用于喷墨打印头前面的涂层，其中所述涂层包含具有高热稳定性的疏油性低粘合性涂层，当加热至高达300℃时，其重量损失小于约15重量％，并且其中， 紫外线（UV）凝胶油墨或一滴固体油墨与涂层的表面呈现大于约45°的接触角和小于约30°的滑动角度，其中涂层保持接触角和滑动角度 已经将涂层暴露于至少200℃的温度至少30分钟。 特别地，涂层在固化后在涂层表面上不显示油。

公开(公告)号：US20140008585A1

公开(公告)日：2014-01-09

申请号：US13543851

申请日：2012-07-08

Applicant: Jin Wu

Inventor： Jin Wu

IPC: C08G75/24 ,  H01B1/20 ,  C08L81/08 ,  H01B1/24

CPC classification number: C08L71/00 ,  C08G65/48 ,  C08G2650/40 ,  G03G15/162 ,  C08L83/04

Abstract: An intermediate transfer member that includes a sulfonated poly(ether ether ketone) polymer, an optional conductive component, an optional polymer, and an optional release additive.

Abstract translation: 包含磺化聚（醚醚酮）聚合物，任选的导电组分，任选的聚合物和任选的释放添加剂的中间转移构件。

公开(公告)号：US08620187B2

公开(公告)日：2013-12-31

申请号：US13171361

申请日：2011-06-28

Applicant: Brian P. Gilmartin ,  Jin Wu ,  April M. Mattox ,  Aaron M. Stuckey

Inventor： Brian P. Gilmartin ,  Jin Wu ,  April M. Mattox ,  Aaron M. Stuckey

IPC: G03G15/02

CPC classification number: G03G15/0233

Abstract: Various embodiments provide materials and methods for bias charging members including an outer surface coating overlaying an outer base layer, wherein the outer surface coating can include conductive fillers combined with one or more polymers to provide desirable surface, electrical, and/or mechanical properties.

Abstract translation: 各种实施例提供了用于偏置充电构件的材料和方法，包括覆盖外基层的外表面涂层，其中外表面涂层可以包括与一种或多种聚合物组合的导电填料以提供期望的表面，电和/或机械性能。

公开(公告)号：US08598263B2

公开(公告)日：2013-12-03

申请号：US13026251

申请日：2011-02-13

Applicant: Jin Wu

Inventor： Jin Wu

IPC: C08K3/04 ,  C08G73/10

CPC classification number: G03G15/162

Abstract: Flexible members for use in imaging devices comprise a polyamic acid and an internal release agent; and optionally, a polysiloxane surfactant.

Abstract translation: 用于成像装置的柔性构件包括聚酰胺酸和内部脱模剂; 和任选的聚硅氧烷表面活性剂。

公开(公告)号：US08598161B2

公开(公告)日：2013-12-03

申请号：US13478238

申请日：2012-05-23

Applicant: Yong-Jin Wu

Inventor： Yong-Jin Wu

IPC: C07D513/04 ,  C07D279/08

CPC classification number: C07D513/04

Abstract: Compounds of formula (I), including pharmaceutically acceptable salts thereof, are set forth herein: wherein R1, R2, R3, R4, R5, and R6 are independently hydrogen, C1-C6 alkyl or C1-C6 cycloalkyl; Y and Z are independently a C6-C10-aryl group or a 5-10 membered heterocyclic group, wherein each Y and Z group can be optionally substituted with from 0-3 substituents selected from halogen, amino, C1-4alkylamino, C1-4dialkylamino, haloC1-4 alkyl, OH, CN, C1-C6 alkyl or cycloalkyl, C1-C6 alkoxy, and C2-C4 alkynyl; L is either a bond or is —NHCO—; L and Z together can be absent; and m is 1, 2 or 3.

Abstract translation: 式（I）化合物，包括其药学上可接受的盐，在此列出：其中R 1，R 2，R 3，R 4，R 5和R 6独立地为氢，C 1 -C 6烷基或C 1 -C 6环烷基; Y和Z独立地是C 6 -C 10 - 芳基或5-10元杂环基，其中每个Y和Z基团可以任选地被0-3个选自卤素，氨基，C 1-4烷基氨基，C 1-4二烷基氨基 卤代C 1-4烷基，OH，CN，C 1 -C 6烷基或环烷基，C 1 -C 6烷氧基和C 2 -C 4炔基; L是键或是-NHCO-; L和Z一起可以不存在; m为1,2或3。

公开(公告)号：US08541104B2

公开(公告)日：2013-09-24

申请号：US12886710

申请日：2010-09-21

Applicant: Jin Wu ,  Jonathan H. Herko ,  Lanhui Zhang ,  Lin Ma

Inventor： Jin Wu ,  Jonathan H. Herko ,  Lanhui Zhang ,  Lin Ma

IPC: B32B27/20

CPC classification number: B32B27/281 ,  B32B27/08 ,  B32B27/20 ,  B32B27/285 ,  B32B27/322 ,  B32B27/327 ,  B32B2270/00 ,  B32B2559/00 ,  G03G15/162 ,  Y10T428/269 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: There is described an intermediate transfer member including a substrate layer comprising a polyimide and a surface layer. The surface layer includes a functionalized polyfluoropolyether and functionalized polybutadiene in a weight ratio of functionalized polyfluoropolyether/functionalized polybutadiene of from about 20/80 to about 80/20 and conductive particles. The method of manufacturing the intermediate transfer member is also described.

Abstract translation: 描述了包括包含聚酰亚胺和表面层的基底层的中间转印部件。 表面层包括官能化聚氟聚醚和官能化聚丁二烯，其官能化聚氟醚/官能化聚丁二烯的重量比为约20/80至约80/20，和导电颗粒。 还描述了制造中间转印部件的方法。

公开(公告)号：US08500182B2

公开(公告)日：2013-08-06

申请号：US12818022

申请日：2010-06-17

Applicant: Ku-Feng Yang ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Chen-Hua Yu

Inventor： Ku-Feng Yang ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Chen-Hua Yu

IPC: B25J15/00

CPC classification number: H01L21/67346 ,  H01L21/6838 ,  H01L21/68785

Abstract: An apparatus for supporting a wafer includes a base, and a gas-penetration layer. The gas-penetration layer and a portion of the base directly underlying the gas-penetration layer form a gas passage therebetween. The gas passage is configured to be sealed by the wafer placed directly over the gas-penetration layer. The apparatus further includes a valve connected to the gas passage.

Abstract translation: 用于支撑晶片的装置包括基座和气体穿透层。 气体渗透层和直接位于气体穿透层下方的基底的一部分在它们之间形成气体通道。 气体通道被直接设置在气体穿透层上方的晶片密封。 该装置还包括连接到气体通道的阀。

公开(公告)号：US08465838B2

公开(公告)日：2013-06-18

申请号：US13020453

申请日：2011-02-03

Applicant: Jin Wu

Inventor： Jin Wu

IPC: B32B25/20 ,  B32B27/06 ,  B32B27/18 ,  G03G15/20

CPC classification number: G03G15/2057 ,  B32B25/08 ,  C08K5/0091 ,  C08K5/5398 ,  C08L79/08 ,  C08L83/10 ,  C08L83/12 ,  Y10T428/3154 ,  Y10T428/31663 ,  Y10T428/31721

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyimide polymer and an alkylthiophosphate.

Abstract translation: 本教导提供定影器构件。 定影器构件包括包含聚酰亚胺聚合物和烷基硫代磷酸酯的基底层。