公开(公告)号：US20080242004A1

公开(公告)日：2008-10-02

申请号：US11694886

申请日：2007-03-30

申请人： Peter M. Gulvin ,  Peter J. Nystrom ,  John P. Meyers

发明人： Peter M. Gulvin ,  Peter J. Nystrom ,  John P. Meyers

IPC分类号： H01L21/00

CPC分类号： H01L24/82 ,  H01L23/3185 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.

摘要翻译： 将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层 。 印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。 该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。

公开(公告)号：US09139004B2

公开(公告)日：2015-09-22

申请号：US13412516

申请日：2012-03-05

申请人： Gary D. Redding ,  Antonio L. Williams ,  John P. Meyers

发明人： Gary D. Redding ,  Antonio L. Williams ,  John P. Meyers

IPC分类号： H01L41/22 ,  B21D39/03 ,  B23Q17/00 ,  H05K3/30 ,  H01L21/00 ,  H01L21/46 ,  B41J2/16

CPC分类号： B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1632 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49764 ,  Y10T29/49778 ,  Y10T29/49826

摘要： A method of mounting print head transducers to a diaphragm includes providing a print head transducer slab with a diaphragm, heating the transducer slab and the diaphragm to a cure temperature, pressing the diaphragm to the slab to form an assembly at the cure temperature, and dicing the slab to separate the slab into an array of print head transducers after pressing the diaphragm to the slab, wherein the array of print head transducers align with an array of body cavities, thereby mounting the array of print head transducers to the diaphragm.

摘要翻译： 将打印头传感器安装在隔膜上的方法包括提供具有隔膜的打印头传感器板，将换能器板和隔膜加热到固化温度，将隔膜压到板坯上以在固化温度下形成组件，并切割 所述板坯在将所述隔膜压到所述板坯之后将所述板坯分离成打印头转换器阵列，其中所述打印头转换器阵列与体腔阵列对准，从而将所述打印头转换器阵列安装到所述隔膜。

公开(公告)号：US08097497B2

公开(公告)日：2012-01-17

申请号：US11694886

申请日：2007-03-30

申请人： Peter M. Gulvin ,  Peter J. Nystrom ,  John P. Meyers

发明人： Peter M. Gulvin ,  Peter J. Nystrom ,  John P. Meyers

IPC分类号： H01L21/00

CPC分类号： H01L24/82 ,  H01L23/3185 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.

摘要翻译： 将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层 。 印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。 该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。

公开(公告)号：US20100214361A1

公开(公告)日：2010-08-26

申请号：US12773191

申请日：2010-05-04

申请人： Peter J. Nystrom ,  John P. Meyers

发明人： Peter J. Nystrom ,  John P. Meyers

IPC分类号： B41J2/14

CPC分类号： B21D53/76 ,  B41J2/15 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  H01L2224/48091 ,  Y10T29/49146 ,  Y10T29/49401 ,  H01L2924/00014

摘要： A method of forming an enclosed fluid path in a print head includes providing a die member and a truncated nozzle plate spaced from the upper surface of the die member. The die and nozzle plate are formed on a print head substrate having an aperture formed therein. A sacrificial material is seated over the aperture of the print head substrate and joins a terminal end of the truncated nozzle plate. The sacrificial material is encapsulated from the terminal end of the nozzle plate to a surface of the print head substrate. Removal of the sacrificial material defines the fluid path from the aperture of the print head substrate to the nozzle plate.

摘要翻译： 在打印头中形成封闭流体路径的方法包括提供与模具构件的上表面间隔开的模具构件和截头喷嘴板。 模具和喷嘴板形成在其上形成有孔的打印头基板上。 将牺牲材料安置在打印头基板的孔口上方并连接截头喷嘴板的终端。 牺牲材料从喷嘴板的终端封装到打印头基板的表面。 去除牺牲材料限定了从打印头基板的孔到喷嘴板的流体路径。

公开(公告)号：US07591535B2

公开(公告)日：2009-09-22

申请号：US11837728

申请日：2007-08-13

申请人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

发明人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

IPC分类号： B41J2/155 ,  B21D51/16

CPC分类号： B41J2/155 ,  B41J2202/19 ,  B41J2202/20 ,  Y10T29/49346 ,  Y10T29/49885 ,  Y10T156/1089

摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.

摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每​​个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。

公开(公告)号：US20090201328A1

公开(公告)日：2009-08-13

申请号：US12422532

申请日：2009-04-13

申请人： Peter J. NYSTROM ,  Peter M. Gulvin ,  John P. Meyers

发明人： Peter J. NYSTROM ,  Peter M. Gulvin ,  John P. Meyers

IPC分类号： B41J29/38

CPC分类号： B41J2/16 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2202/20

摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.

公开(公告)号：US08182069B2

公开(公告)日：2012-05-22

申请号：US13246170

申请日：2011-09-27

申请人： Mark A. Cellura ,  Peter J. Nystrom ,  Scott J. Phillips ,  John P. Meyers ,  Lyle G. Dingman ,  Bryan R. Dolan

发明人： Mark A. Cellura ,  Peter J. Nystrom ,  Scott J. Phillips ,  John P. Meyers ,  Lyle G. Dingman ,  Bryan R. Dolan

IPC分类号： B41J2/14 ,  B41J2/16

CPC分类号： H01L25/16 ,  H01L22/20 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/00

摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

摘要翻译： 一种硅基模块，包括：基板; 第一芯片组件，其固定到所述基板，所述第一芯片组件包括第一硅芯片和具有电路的第一驱动器芯片; 以及固定到所述基板的第二芯片组件，所述第二芯片组件包括第二硅芯片和具有电路的第二驱动器芯片。 第一和第二芯片组件的部分在基板的纵向方向上排列; 并且所述第一和第二硅芯片的部分在与所述纵向正交的宽度方向上排列。 硅基模块的形成方法。

公开(公告)号：US08132892B2

公开(公告)日：2012-03-13

申请号：US12536196

申请日：2009-08-05

申请人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

发明人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

IPC分类号： B41J2/155

CPC分类号： B41J2/155 ,  B41J2202/19 ,  B41J2202/20 ,  Y10T29/49346 ,  Y10T29/49885 ,  Y10T156/1089

摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.

摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每​​个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。

公开(公告)号：US07681985B2

公开(公告)日：2010-03-23

申请号：US12422532

申请日：2009-04-13

申请人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

发明人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

IPC分类号： B41J2/25

CPC分类号： B41J2/16 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2202/20

摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.

摘要翻译： 本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。 该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。 临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。 真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。 临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。

公开(公告)号：US07571970B2

公开(公告)日：2009-08-11

申请号：US11777475

申请日：2007-07-13

申请人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

发明人： Peter J. Nystrom ,  Peter M. Gulvin ,  John P. Meyers

IPC分类号： B41J2/155

CPC分类号： B41J2/16 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2202/20

摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.

摘要翻译： 本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。 该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。 临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。 真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。 临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。