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公开(公告)号：US08132892B2
公开(公告)日：2012-03-13
申请号：US12536196
申请日：2009-08-05
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。
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公开(公告)号：US07681985B2
公开(公告)日：2010-03-23
申请号：US12422532
申请日：2009-04-13
IPC分类号： B41J2/25
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译： 本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。 该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。 临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。 真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。 临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。
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公开(公告)号：US07571970B2
公开(公告)日：2009-08-11
申请号：US11777475
申请日：2007-07-13
IPC分类号： B41J2/155
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译： 本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。 该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。 临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。 真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。 临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。
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公开(公告)号：US20090289994A1
公开(公告)日：2009-11-26
申请号：US12536196
申请日：2009-08-05
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。
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公开(公告)号：US20090046125A1
公开(公告)日：2009-02-19
申请号：US11837728
申请日：2007-08-13
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。
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公开(公告)号：US20090014413A1
公开(公告)日：2009-01-15
申请号：US11777475
申请日：2007-07-13
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译： 本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。 该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。 临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。 真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。 临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。
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公开(公告)号：US20080242004A1
公开(公告)日：2008-10-02
申请号：US11694886
申请日：2007-03-30
IPC分类号： H01L21/00
CPC分类号： H01L24/82 , H01L23/3185 , H01L23/552 , H01L23/66 , H01L24/24 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2224/82104 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.
摘要翻译： 将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层 。 印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。 该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。
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公开(公告)号：US08097497B2
公开(公告)日：2012-01-17
申请号：US11694886
申请日：2007-03-30
IPC分类号： H01L21/00
CPC分类号： H01L24/82 , H01L23/3185 , H01L23/552 , H01L23/66 , H01L24/24 , H01L2224/24011 , H01L2224/24051 , H01L2224/24226 , H01L2224/24998 , H01L2224/76155 , H01L2224/82007 , H01L2224/82102 , H01L2224/82104 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12044 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A method of connecting a chip to a package in a semiconductor device includes printing an encapsulant to a predetermined thickness on at least a portion of the chip and package and printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant such that the encapsulant defines a distance from the printed conductive material to the chip and package. The method further includes printing a second layer of encapsulant over the printed conductive material curing at least the second layer of encapsulant.
摘要翻译： 将芯片连接到半导体器件中的封装的方法包括在芯片和封装的至少一部分上将密封剂印刷到预定厚度，并且在芯片和封装之间以预定图案在密封剂上印刷导电材料层 。 印刷的导电材料符合密封剂的上表面，使得密封剂限定了从印刷的导电材料到芯片和封装的距离。 该方法还包括在固化至少第二层密封剂的印刷导电材料上印刷第二层密封剂。
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公开(公告)号：US07591535B2
公开(公告)日：2009-09-22
申请号：US11837728
申请日：2007-08-13
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译： 提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。 打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。 硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。
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公开(公告)号：US20090201328A1
公开(公告)日：2009-08-13
申请号：US12422532
申请日：2009-04-13
IPC分类号： B41J29/38
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
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