摘要:
A semiconductor circuit includes a pad, a pad driver connected to the pad at an output terminal thereof and configured to calibrate a voltage of the pad in response to code signals, a comparison section configured to compare a reference voltage and the voltage of the pad and generate a comparison signal, and a code generation section configured to calibrate code values of the code signals in response to the comparison signal.
摘要:
A semiconductor memory device includes an open-loop-type delay locked loop (DLL) configured to generate a clock signal locked by reflecting a first delay amount which actually occurs in a data path and a second delay amount which is required for locking the clock signal, a latency control unit configured to shift an inputted command according to a latency code value corresponding to the first delay amount and latency information, and output the shifted command, and an additional delay line configured to delay the shifted command according to a delay code value corresponding to the second delay amount, and output the command of which operation timing is controlled.
摘要:
A semiconductor device includes a data alignment unit configured to align serial input data in response to a data strobe signal, a data latching unit configured to latch an output signal of the data alignment unit in response to first and second synchronization pulse signals which are activated according to BL information during a write operation, and a data output unit configured to output an output signal of the data latching unit to a plurality of global data lines in response to a data input strobe signal corresponding to the BL information.
摘要:
A semiconductor memory apparatus includes a first data input/output line configured to transmit data from a first memory bank; a second data input/output line configured to transmit the data from the first memory bank; a first data output section configured to align and output data transmitted through the first data input/output line based on an input/output mode; and a second data output section configured to align and output either data transmitted through the first input/output line or the second data input/output line based on the input/output mode and an address signal.
摘要:
A delay circuit of a semiconductor memory apparatus includes a decoding unit configured to decode a plurality of test signals and enable one of a plurality of control signals; a bias voltage generation unit configured to generate a first bias voltage and a second bias voltage depending upon the control signal enabled among the plurality of control signals; and a delay unit configured to determine a delay time depending upon levels of the first and second bias voltages, delay an input signal by the determined delay time, and output a resultant signal as an output signal.
摘要:
Various embodiments of a semiconductor apparatus and related methods are disclosed. In one exemplary embodiment, a semiconductor apparatus may include a chip, scribe lanes disposed around the chip, and a probe test logic circuit for conducting a probe test on the chip. The probe test logic circuit is disposed on a portion of the scribe lanes.
摘要:
A delay circuit includes first and second selective delay stages each including a number of unit delay cells to delay signals applied thereto; and a delay control unit configured to control selectively applying an input signal to the first selective delay stage or the second selective delay stage in response to a code combination of first and second selection signals and produce an output signal.
摘要:
An apparatus for controlling an operation timing in a semiconductor memory device, comprising: a shift information generator configured to generate shift information based on data path delay information and latency information; and a shift register configured to shift a command based on the shift information and produce a shifted command to control an operation timing.
摘要:
A semiconductor circuit includes a pad, a pad driver connected to the pad at an output terminal thereof and configured to calibrate a voltage of the pad in response to code signals, a comparison section configured to compare a reference voltage and the voltage of the pad and generate a comparison signal, and a code generation section configured to calibrate code values of the code signals in response to the comparison signal.
摘要:
A data input/output circuit includes a rank selecting section and a data input/output section. The rank selecting section is selectively connected to one of the first and second ranks in response to a chip selection signal, and outputs data to a connected rank or receives data from the connected rank. The data input/output section outputs the data transmitted from the rank selecting section through a data pad to an external device during a read operation, and outputs the data inputted to the data pad to the rank selecting section during a write operation.