摘要:
The energy transducer includes an upper part and a lower part. The upper part having a housing, a helix metal spring, a first circular board, a second circular board with a short metal shaft, a ball bearing engaged to the short metal shaft, a third circular board with a groove to receive metal bearing balls, an upper metal shaft welded to the bottom of the third circular board, four arc-shaped springs welded to the bottom of the third circular board, and four sets of wheels rotatably attached to one end of the spring. The lower part includes: a housing, a lower metal shaft, a fourth circular board placed on the upper end of the lower part, bundles of electric wire, pluralities of permanent magnets, and a fifth circular board placed at the lower end of the lower part. As the helix metal spring is compressed by an external force, the bundle of electric wire turns between permanent magnets to produce electricity. Direction of the electricity alternates as the helix metal spring oscillates.
摘要:
Disclosed is a liquid crystal display apparatus in which a liquid crystal display module and cases are tightly combined. At least one protuberance formed on a top chassis of the liquid crystal display module combines at least one fixing portion formed on a portion of a rear case corresponding to the at least one protuberance. Also, a fixing protuberance formed on a portion of a front case is inserted into between the liquid crystal display module and the rear case, thereby preventing the liquid crystal display module from being moved. Therefore, the liquid crystal display module and the cases are tightly combined, and productivity of the liquid crystal display apparatus can increase by reducing the number of parts demanded for fabrication of the liquid crystal display module and the cases.
摘要:
A backlight assembly, an LCD assembly having the same and an assembly method thereof are disclosed to reduce the assembly time and to improve the efficiency. The backlight assembly comprises: a mold frame having an inner lower surface and side walls normal to the inner lower surface; a reflector plate mounted on the inner lower surface of the mold frame; a light guiding plate disposed on the reflecting plate; a lamp assembly accommodated between one side portion of the light guiding plate and the side wall of the mold frame facing the one side portion of the light guiding plate; a series of diffusion sheets disposed on the light guiding plate; and a pair of fixing frames facing each other, covering an edge of the light guiding plate corresponding to a portion where the lamp assembly is accommodated and the side walls of the mold frame, pressing and fixing the light guiding plate, and being detachably coupled to the mold frame.
摘要:
There is provided a method of optimizing recipe of in-situ cleaning process for process chamber after a specific process on semiconductor wafers by using Residual Gas Analyzer Quadrupole Mass Spectrometer (RGA-QMS) According to the present invention, a Chemical Vapor Deposition (CVD) apparatus for manufacturing semiconductor devices comprises: a process chamber; process gas supply line for supplying process gas into the process chamber; a waste-gas exhaust line for removing the waste-gas from the process chamber after process; a supply line for supplying a ClF3 gas into the process chamber; a sampling manifold for sampling the gas inside process chamber by using pressure difference; and RGA-QMS for analyzing the sampling gas, and the optimization of the end points according to gas flow, pressure, and temperature of the cleaning process for the process chamber is achieved through the analysis by above RGA-QMS.
摘要:
A backlight assembly, an LCD assembly having the same and an assembly method thereof are disclosed to reduce the assembly time and to improve the efficiency. The backlight assembly comprises: a mold frame having an inner lower surface and side walls normal to the inner lower surface; a reflector plate mounted on the inner lower surface of the mold frame; a light guiding plate disposed on the reflecting plate; a lamp assembly accommodated between one side portion of the light guiding plate and the side wall of the mold frame facing the one side portion of the light guiding plate; a series of diffusion sheets disposed on the light guiding plate; and a pair of fixing frames facing each other, covering an edge of the light guiding plate corresponding to a portion where the lamp assembly is accommodated and the side walls of the mold frame, pressing and fixing the light guiding plate, and being detachably coupled to the mold frame.
摘要:
A method for stripping a film from a wafer substrate includes the steps of inserting a boat holding the wafer into a processing chamber of a CVD apparatus, and injecting gas into the chamber, to thereby strip the wafer of its film. A typical film requiring stripping is a polysilicon film grown on an underlying oxide layer of the substrate. In this case, CIF.sub.3 is used to strip the polysilicon film without damaging the oxide layer. Accordingly, this method is applicable to the quality testing of semiconductor wafer films using a test wafer. In such quality testing a film is formed on a test wafer substrate at the same time the semiconductor wafer film is formed. The film of the test wafer is tested to evaluate the quality of the formation of the semiconductor wafer film. The test wafer can then be stripped within the chemical vapor deposition apparatus and thus can be reused soon thereafter.
摘要:
An apparatus for low pressure chemical vapor deposition for fabricating a semiconductor device comprises a group of reaction chambers, a group of high-vacuum pumps connected to the reaction chambers, a group of gate valves connected to the high-vacuum pumps, and a low-vacuum pump connected to the gate valves. There are fewer gate valves than high-vacuum pumps. A method for fabricating a semiconductor device using the above apparatus includes the sequence and duration of opening gate valves, injecting reaction gases, and pumping with the low vacuum pump. According to the present invention, since the number of pumps is reduced, the cost for installation, operation and maintenance of the semiconductor device fabrication apparatus is reduced.
摘要:
Provided are a lamp socket structured to realize a slimmer display device, and a display device having the lamp socket. The lamp socket includes: a body portion; a connection terminal for connection of the lamp socket to a terminal of a lamp; a compliant portion which connects the body portion and the connection terminal and includes a first portion connected to the connection terminal and a second portion connected to the body portion; and one or more fixing portions which extend from the body portion, wherein the first portion and the second portion at least partially overlap each other.
摘要:
Disclosed is to an improvement apparatus of surface roughness of hot/cold rolled stainless steel coils and the method thereof. The present invention provides an improvement apparatus of surface roughness of hot/cold rolled stainless steel coils including a water spray unit for spraying water on a surface of a cast stainless steel slab; a cutting unit for cutting the stainless steel slab; and a high-pressure water spray having at least one nozzle in a region where the stainless steel slab is cut by the cutting unit and discharged and installed to be symmetric in upper and lower parts of the stainless steel slab; and a roller brush installed to be in contact with and symmetric in the upper and lower parts of the stainless steel slab passed through the water spray so as to rotate at a high speed. Accordingly, the improvement apparatus according to the present invention may be useful to produce a stainless steel slab having an excellent surface quality since it is possible to easily remove the scale and mold slag from the stainless steel slab.
摘要:
A liquid crystal display (LCD) which can prevent electronic elements from being short-circuited due to a detachment of a printed circuit board (PCB). The LCD includes a liquid crystal panel which displays an image, a first container which is disposed below the liquid crystal panel and includes one or more first protrusions that are formed on an outer surface of a sidewall of the first container, a printed circuit board (PCB) which is electrically connected to the liquid crystal panel via a plurality of connection elements, wherein the PCB is held to the sidewall of the first container, and includes one or more coupling holes that respectively correspond to and receive the first protrusions. The LCD includes a second container which covers the periphery of the liquid crystal panel, the first container and the PCB and the second container includes one or more second protrusions that are formed on a sidewall of the second container and respectively correspond to the first protrusions.