公开(公告)号：US09035192B2

公开(公告)日：2015-05-19

申请号：US12974476

申请日：2010-12-21

Applicant: Gyu Ho Lee ,  Young Woo Park ,  Il Rae Cho ,  Young Hun Kim ,  Kyoung Soo Park ,  Jin Seong Park ,  Dong Seon Uh ,  Kyung Jin Lee ,  Kwang Jin Jung

Inventor： Gyu Ho Lee ,  Young Woo Park ,  Il Rae Cho ,  Young Hun Kim ,  Kyoung Soo Park ,  Jin Seong Park ,  Dong Seon Uh ,  Kyung Jin Lee ,  Kwang Jin Jung

IPC: H05K1/09 ,  C09J11/04 ,  C09J9/02 ,  H05K3/32 ,  C08K3/00 ,  C08K9/02

CPC classification number: C09J11/04 ,  C08K3/017 ,  C08K9/02 ,  C09J9/02 ,  H05K3/323 ,  H05K2201/0218

Abstract: An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.

Abstract translation: 各向异性导电粘合剂复合物和膜包括粘合剂和分散在粘合剂中的导电颗粒。 导电颗粒包括铜芯颗粒和涂覆在相应的铜芯颗粒的表面上的金属涂层。

公开(公告)号：US20120141802A1

公开(公告)日：2012-06-07

申请号：US13273498

申请日：2011-10-14

Applicant: Dong Seon UH ,  Hyun Hee Namkung ,  Kwang Jin Jung ,  Jin Seong Park ,  Jae Sun Han

Inventor： Dong Seon UH ,  Hyun Hee Namkung ,  Kwang Jin Jung ,  Jin Seong Park ,  Jae Sun Han

IPC: B32B27/38 ,  B32B9/04

CPC classification number: G02B1/14 ,  C09J9/02 ,  C09J163/10 ,  C09J175/14 ,  G02B1/10 ,  G02B1/105 ,  Y10T428/31504 ,  Y10T428/31511

Abstract: An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.

Abstract translation: 光学构件包括具有多层结构的各向异性导电膜，所述多层结构具有包含环氧树脂作为固化部分的接合层和含有（甲基）丙烯酸酯树脂作为固化部分的接合层。

公开(公告)号：US06204191B1

公开(公告)日：2001-03-20

申请号：US09333932

申请日：1999-06-16

Applicant: Kwang-Jin Jung ,  Tae-ryong Kim ,  Chung-howan Kim ,  Jae-hee Hwang

Inventor： Kwang-Jin Jung ,  Tae-ryong Kim ,  Chung-howan Kim ,  Jae-hee Hwang

IPC: H01L21302

CPC classification number: H01L28/84 ,  H01L21/32137 ,  H01L21/76885 ,  H01L27/10814 ,  H01L28/92 ,  Y10S438/964

Abstract: A method of manufacturing semiconductor device that improves the alignment margin between a contact hole and a device pattern includes a layer having an upper vertically shaped portion and a lower symmetrically inclined shaped portion. That is, the lower portion is tapered.

Abstract translation: 制造改善接触孔和器件图案之间的对准边缘的半导体器件的方法包括具有上垂直形状部分和下对称倾斜成形部分的层。 也就是说，下部是锥形的。