Method for the cleaning and direct bonding of solids
    20.
    发明授权
    Method for the cleaning and direct bonding of solids 失效
    清洁和直接粘结固体的方法

    公开(公告)号:US5915193A

    公开(公告)日:1999-06-22

    申请号:US444035

    申请日:1995-05-18

    IPC分类号: H01L21/306 H01L21/304

    CPC分类号: H01L21/02052

    摘要: Cleaning in periodic acid (H.sub.5 IO.sub.6) aqueous solutions (HI solutions) of particular compositions removes thermally unstable hydrocarbons from the surfaces of semiconductor wafers and enables the direct bonding of semiconductor surfaces such that the bonded interface between these surfaces remains free of bubbles even after heating subsequent to bonding.

    摘要翻译: 在特定组合物的高碘酸(H5106)水溶液(HI溶液)中的清洗从半导体晶片的表面除去热不稳定的烃,并且能够直接粘合半导体表面,使得即使在加热之后这些表面之间的结合界面仍然没有气泡 粘合。