Abstract:
A technique for electrically interconnecting a signal between a first circuit board and a second circuit board is disclosed. In each board, at least one signal conductor is shielded by an electrically conductive shield. Multiple conductors may be shielded by the same shield. A first opening is formed in the electrically conductive shield of the first circuit board and a second opening is formed in the electrically conductive shield of the second circuit board so as to expose the signal conductor in the each circuit board. An electrically conductive adhesive, reflowed solder paste, or interposer/elastomer device is applied surrounding at least one of the openings and may further be applied within at least one of the openings. The first circuit board and the second circuit board are then positioned such that the first opening and the second opening are aligned and a signal propagating along the first signal conductor is electrically interconnected to the second signal conductor.
Abstract:
A technique for improving signal reach and signal integrity when using high bit rates or high signal frequencies is provided. A multi-layer substrate comprises a conductor having a continuous main path and discrete spaced edges protruding from opposing edges of the continuous main path. A first spacer layer is disposed on a first side of the conductor, the first a spacer layer having an air channel substantially coextensive with the continuous main path and a solid portion overlapping with the discrete spaced edges. A second spacer layer is disposed on a second side of the conductor, the second spacer layer having an air channel substantially coextensive with the continuous main path of the conductor and a solid portion overlapping with the discrete spaced edges.
Abstract:
A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.
Abstract:
A network device includes optical modules with both electrical and optical connections facing an end of the optical module configured to be plugged into the network device. The optical modules may extend through a faceplate of the network device or may be retained behind the faceplate. Utilizing optical modules with both electrical and optical connections facing one end of the optical module enables optical fiber management may take place within the network device and independent of the electrical connections. This facilitates replacement of non-functional or obsolete optical modules. The optical modules may be parallel to or approximately parallel to the connector plane when connected to the connector plane.
Abstract:
An optical module includes a body having a proximal end and a distal end, a first optical connector disposed on the body to face the proximal end of the body, a first shelf extending from the body, and a first electrical connector disposed on the first shelf to face the proximal end of the body. Additional optical and electrical connectors and shelves may be included. The optical and electrical connectors may be disposed on the body of the optical connector at different distances from the proximal end of the body to enable electrical signals and optical signals to be transferred from/to the optical module in different physical regions. The optical connector(s) may mate with a receptor in a connector plane, may be positioned adjacent an aperture in a connector plane to receive a mating connector through the aperture, or may extend through the aperture to receive a mating connector.
Abstract:
A technique for providing a multi-layer substrate which is capable of signal transmission at multiple propagation speeds is disclosed. In one embodiment, the technique is realized by constructing a multi-layer substrate by creating air channels in dielectric layers adjacent to a conductor. The air channels may also be filled with an alternative dielectric material. At least three types of multi-layer substrates may be produced through this technique. Furthermore, signal tracks of varying lengths can be provided to accommodate differing delays.
Abstract:
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.
Abstract:
A wireless communication system formed of a plurality of antennae, the antennae being arranged in a grid pattern over a communication region, wireless portable terminals located within the communication region for emitting and/or receiving electromagnetic signals via the antennae, apparatus for determining the position of at least one of the terminals within the communication region relative to the grid pattern.