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公开(公告)号：US06872595B1
公开(公告)日：2005-03-29
申请号：US10434222
申请日：2003-05-09
Applicant: Herman Kwong , Richard R. Goulette , Martin R. Handforth
Inventor： Herman Kwong , Richard R. Goulette , Martin R. Handforth
CPC classification number: H05K1/14 , H05K1/0239 , Y10T29/49126
Abstract: A technique for electrically interconnecting a signal between a first circuit board and a second circuit board is disclosed. In each board, at least one signal conductor is shielded by an electrically conductive shield. Multiple conductors may be shielded by the same shield. A first opening is formed in the electrically conductive shield of the first circuit board and a second opening is formed in the electrically conductive shield of the second circuit board so as to expose the signal conductor in the each circuit board. An electrically conductive adhesive, reflowed solder paste, or interposer/elastomer device is applied surrounding at least one of the openings and may further be applied within at least one of the openings. The first circuit board and the second circuit board are then positioned such that the first opening and the second opening are aligned and a signal propagating along the first signal conductor is electrically interconnected to the second signal conductor.
Abstract translation: 公开了一种用于将第一电路板和第二电路板之间的信号电互连的技术。 在每个板中，至少一个信号导体被导电屏蔽屏蔽。 多个导体可以被同一屏蔽屏蔽。 在第一电路板的导电屏蔽中形成第一开口，并且在第二电路板的导电屏蔽中形成第二开口以暴露每个电路板中的信号导体。 围绕至少一个开口施加导电粘合剂，回流焊膏或插入物/弹性体装置，并且还可以施加在至少一个开口内。 然后将第一电路板和第二电路板定位成使得第一开口和第二开口对齐，并且沿着第一信号导体传播的信号与第二信号导体电互连。
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2.发明授权Embedded shielded stripline (ESS) structure using air channels within the ESS structure 失效使用ESS结构内的空气通道的嵌入式屏蔽带状线（ESS）结构公开(公告)号：US06600395B1
公开(公告)日：2003-07-29
申请号：US09749412
申请日：2000-12-28
Applicant: Martin R. Handforth , Herman Kwong , Richard R. Goulette
Inventor： Martin R. Handforth , Herman Kwong , Richard R. Goulette
IPC: H01P308
CPC classification number: H01P3/085 , H01P3/088 , H05K1/0218 , H05K1/024 , H05K1/0298 , H05K2201/0715
Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.
Abstract translation: 公开了一种用于促进多层基板中的高信号频率的信号传输的技术。 在一个实施例中，多层衬底包括导体或一对导体，在导体或一对导体的第一侧上的第一介电层和在导体或导体对的一对导体的第二侧上的第二介电层。 空气通道设置在第一电介质层中，空气通道形成为与导体或一对导体基本共同延伸。 导电屏蔽围绕导体或一对导体，第一介电层和第二介电层，以消除串扰。 导体或导体对可以具有离散的间隔边缘，并且由于空气的低介电常数，可以增加导体或导线对的宽度以调整阻抗。 此外，结构中可以包括附加的空气通道和支撑层。
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公开(公告)号：US06972647B1
公开(公告)日：2005-12-06
申请号：US10420733
申请日：2003-04-23
Applicant: Martin R. Handforth , Herman Kwong , Richard R. Goulette
Inventor： Martin R. Handforth , Herman Kwong , Richard R. Goulette
CPC classification number: H01P3/085 , H01P3/088 , H05K1/0218 , H05K1/024 , H05K1/0298 , H05K2201/0715
Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.
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4.发明授权公开(公告)号：US06608258B1
公开(公告)日：2003-08-19
申请号：US09749409
申请日：2000-12-28
Applicant: Herman Kwong , Richard R. Goulette , Martin R. Handforth
Inventor： Herman Kwong , Richard R. Goulette , Martin R. Handforth
IPC: H05K100
CPC classification number: H05K1/14 , H05K1/0239 , Y10T29/49126
Abstract: A technique for electrically interconnecting a signal between a first circuit board and a second circuit board is disclosed. In each board, at least one signal conductor is shielded by an electrically conductive shield. Multiple conductors may be shielded by the same shield. A first opening is formed in the electrically conductive shield of the first circuit board and a second opening is formed in the electrically conductive shield of the second circuit board so as to expose the signal conductor in the each circuit board. An electrically conductive adhesive, reflowed solder paste, or interposer/elastomer device is applied surrounding at least one of the openings and may further be applied within at least one of the openings. The first circuit board and the second circuit board are then positioned such that the first opening and the second opening are aligned and a signal propagating along the first signal conductor is electrically interconnected to the second signal conductor.
Abstract translation: 公开了一种用于将第一电路板和第二电路板之间的信号电互连的技术。 在每个板中，至少一个信号导体被导电屏蔽屏蔽。 多个导体可以被同一屏蔽屏蔽。 在第一电路板的导电屏蔽中形成第一开口，并且在第二电路板的导电屏蔽中形成第二开口以暴露每个电路板中的信号导体。 围绕至少一个开口施加导电粘合剂，回流焊膏或插入物/弹性体装置，并且还可以施加在至少一个开口内。 然后将第一电路板和第二电路板定位成使得第一开口和第二开口对齐，并且沿着第一信号导体传播的信号与第二信号导体电互连。
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公开(公告)号：US07348494B1
公开(公告)日：2008-03-25
申请号：US09821722
申请日：2001-03-29
Applicant: Martin R. Handforth , Herman Kwong , Richard R. Goulette
Inventor： Martin R. Handforth , Herman Kwong , Richard R. Goulette
IPC: H05K1/16
CPC classification number: H05K3/368 , H01R12/52 , H01R12/61 , H05K1/0218 , H05K1/117 , H05K3/365 , H05K2201/0367 , H05K2201/0373 , H05K2201/0715 , H05K2201/0919 , H05K2201/10598
Abstract: Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by extending the traces beyond the other layers of the printed wiring board. Corresponding conductors associated with the other device are placed in direct physical contact with the exposed inner layer traces, and may be aligned and secured with guide plates, alignment pins and spring members. Such direct connection mitigates the need for vias, and has more favorable electrical characteristics for high frequency signal transmission.
Abstract translation: 暴露多层印刷线路板上的内层迹线，以便能够与诸如印刷电路板的其它器件直接互连。 可以通过去除迹线周围的至少一些电介质基板材料，或者通过将迹线延伸超过印刷线路板的其它层来暴露迹线。 与另一装置相关联的相应的导体被放置成与暴露的内层迹线直接物理接触，并且可以与引导板，对准销和弹簧构件对准和固定。 这种直接连接减轻了对通孔的需要，并且对于高频信号传输具有更有利的电特性。
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Patent Agency Ranking
6.发明授权Embedded shielded stripline (ESS) structure using air channels within the ESS structure 失效使用ESS结构内的空气通道的嵌入式屏蔽带状线（ESS）结构公开(公告)号：US06949991B1
公开(公告)日：2005-09-27
申请号：US10420734
申请日：2003-04-23
Applicant: Martin R. Handforth , Herman Kwong , Richard R. Goulette
Inventor： Martin R. Handforth , Herman Kwong , Richard R. Goulette
CPC classification number: H01P3/085 , H01P3/088 , H05K1/0218 , H05K1/024 , H05K1/0298 , H05K2201/0715
Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.
Abstract translation: 公开了一种用于促进多层基板中的高信号频率的信号传输的技术。 在一个实施例中，多层衬底包括导体或一对导体，在导体或一对导体的第一侧上的第一介电层和在导体或导体对的一对导体的第二侧上的第二介电层。 空气通道设置在第一电介质层中，空气通道形成为与导体或一对导体基本共同延伸。 导电屏蔽围绕导体或一对导体，第一介电层和第二介电层，以消除串扰。 导体或导体对可以具有离散的间隔边缘，并且由于空气的低介电常数，可以增加导体或导线对的宽度以调整阻抗。 此外，结构中可以包括附加的空气通道和支撑层。
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7.发明授权Technology implementation of suspended stripline within multi-layer substrate used to vary time delay and to maximize the reach of signals with high data rates or high frequencies 有权用于多层衬底内的悬垂带状线的技术实现，用于改变时间延迟并最大化具有高数据速率或高频率的信号的范围公开(公告)号：US06621384B1
公开(公告)日：2003-09-16
申请号：US09749435
申请日：2000-12-28
Applicant: Martin R. Handforth , Herman Kwong , Richard R. Goulette
Inventor： Martin R. Handforth , Herman Kwong , Richard R. Goulette
IPC: H01P308
CPC classification number: H01P3/087 , H05K1/024 , H05K1/0298 , H05K2201/0187
Abstract: A technique for providing a multi-layer substrate which is capable of signal transmission at multiple propagation speeds is disclosed. In one embodiment, the technique is realized by constructing a multi-layer substrate by creating air channels in dielectric layers adjacent to a conductor. The air channels may also be filled with an alternative dielectric material. At least three types of multi-layer substrates may be produced through this technique. Furthermore, signal tracks of varying lengths can be provided to accommodate differing delays.
Abstract translation: 公开了一种用于提供能够以多个传播速度进行信号传输的多层基板的技术。 在一个实施例中，该技术通过在与导体相邻的电介质层中产生空气通道来构造多层基板来实现。 空气通道也可以用替代电介质材料填充。 可以通过这种技术生产至少三种类型的多层基底。 此外，可以提供不同长度的信号轨道以适应不同的延迟。
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8.发明授权Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate 有权用于通过信号轨道连接的插入元件，以实现多层基板中的连续阻抗匹配公开(公告)号：US06441319B1
公开(公告)日：2002-08-27
申请号：US09749470
申请日：2000-12-28
Applicant: Martin R. Handforth , Herman Kwong , Richard R. Goulette , Rolf G. Meier
Inventor： Martin R. Handforth , Herman Kwong , Richard R. Goulette , Rolf G. Meier
IPC: H01R909
CPC classification number: H05K3/4046 , H01P1/047 , H05K1/024 , H05K1/0298 , H05K2201/0187 , H05K2201/09536 , H05K2201/10924 , H05K2203/1446 , Y10T29/49126 , Y10T29/49165
Abstract: A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.
Abstract translation: 公开了一种用于连接多层衬底内的信号轨道的技术。 在一个实施例中，该技术通过在基板中提供开口并将插入的部件装配到开口中来实现。 插入的部件包括安装到引线框的介质块。 引线框架是导电的，使得形成在插入部件和衬底之间的信号层连接衬底的多个信号层上的信号轨道。
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公开(公告)号：US06462957B1
公开(公告)日：2002-10-08
申请号：US09739882
申请日：2000-12-20
Applicant: Herman Kwong , Bao Chau L. Nguyen , Van C. Au , Paul A. Senyshyn , Martin R. Handforth , Rolf G. Meier , Delfin Y. Montuno , Ernst A. Munter , Hasler R. Hayes
Inventor： Herman Kwong , Bao Chau L. Nguyen , Van C. Au , Paul A. Senyshyn , Martin R. Handforth , Rolf G. Meier , Delfin Y. Montuno , Ernst A. Munter , Hasler R. Hayes
IPC: H05K714
CPC classification number: H05K1/14 , H05K1/0239 , H05K7/1445
Abstract: An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.
Abstract translation: 提供了第一电路板和第二电路板之间的改进的电互连。 在一个实施例中，第一电路板具有基本上刚性的电路部分，其具有包括第一信号层的多个电路层和包括第一信号层的第一互连部分，用于与第二电路的第二互连部分配合 板。 第一电路板还包括柔性部分，包括第一信号层，用于将基本刚性的电路部分连接到第一互连部分。 柔性部分允许第一互连部分基本上垂直于基本上刚性的电路部分定向，使得第一互连部分与第二互连部分的配合导致第一电路板和第二电路之间的基本正交的电互连布置 板。
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10.发明授权Suspended stripline structures to reduce skin effect and dielectric loss to provide low loss transmission of signals with high data rates or high frequencies 有权悬挂的带状线结构以减少皮肤效应和介电损耗，以提供具有高数据速率或高频率的信号的低损耗传输公开(公告)号：US06603376B1
公开(公告)日：2003-08-05
申请号：US09749411
申请日：2000-12-28
Applicant: Martin R. Handforth , Scott B. Kuntze , Herman Kwong
Inventor： Martin R. Handforth , Scott B. Kuntze , Herman Kwong
IPC: H01P308
CPC classification number: H01P3/087 , H05K1/024 , H05K2201/0715 , H05K2201/09727
Abstract: A technique for improving signal reach and signal integrity when using high bit rates or high signal frequencies is provided. A multi-layer substrate comprises a conductor having a continuous main path and discrete spaced edges protruding from opposing edges of the continuous main path. A first spacer layer is disposed on a first side of the conductor, the first a spacer layer having an air channel substantially coextensive with the continuous main path and a solid portion overlapping with the discrete spaced edges. A second spacer layer is disposed on a second side of the conductor, the second spacer layer having an air channel substantially coextensive with the continuous main path of the conductor and a solid portion overlapping with the discrete spaced edges.
Abstract translation: 提供了一种用于在使用高比特率或高信号频率时改善信号到达和信号完整性的技术。 多层基板包括具有连续主路径和从连续主路径的相对边缘突出的离散间隔边缘的导体。 第一间隔层设置在导体的第一侧上，第一间隔层具有与连续主路径基本共同延伸的空气通道和与离散间隔开的边缘重叠的实心部分。 第二间隔层设置在导体的第二侧上，第二间隔层具有与导体的连续主路径基本共同延伸的空气通道和与离散间隔开的边缘重叠的实心部分。
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