公开(公告)号：US20110186949A1

公开(公告)日：2011-08-04

申请号：US13084996

申请日：2011-04-12

申请人： Shunpei YAMAZAKI ,  Jun KOYAMA ,  Kiyoshi KATO ,  Takaaki KOEN ,  Yuto YAKUBO ,  Makoto YANAGISAWA ,  Hisashi OHTANI ,  Eiji SUGIYAMA ,  Nozomi HORIKOSHI

发明人： Shunpei YAMAZAKI ,  Jun KOYAMA ,  Kiyoshi KATO ,  Takaaki KOEN ,  Yuto YAKUBO ,  Makoto YANAGISAWA ,  Hisashi OHTANI ,  Eiji SUGIYAMA ,  Nozomi HORIKOSHI

IPC分类号： H01L29/66

CPC分类号： G06K19/07735 ,  G06K19/07722 ,  G06K19/07794 ,  H01L23/295 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.

摘要翻译： 一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。 半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。 在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。 其中一个结构体设置在片上天线和增强天线之间。 在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω·cm 2 / cm 2的导电膜。

公开(公告)号：US20090085182A1

公开(公告)日：2009-04-02

申请号：US12219382

申请日：2008-07-21

申请人： Shunpei Yamazaki ,  Jun Koyama ,  Kiyoshi Kato ,  Takaaki Koen ,  Yuto Yakubo ,  Makoto Yanagisawa ,  Hisashi Ohtani ,  Eiji Sugiyama ,  Nozomi Horikoshi

发明人： Shunpei Yamazaki ,  Jun Koyama ,  Kiyoshi Kato ,  Takaaki Koen ,  Yuto Yakubo ,  Makoto Yanagisawa ,  Hisashi Ohtani ,  Eiji Sugiyama ,  Nozomi Horikoshi

IPC分类号： H01L21/58 ,  H01L23/12

CPC分类号： G06K19/07735 ,  G06K19/07722 ,  G06K19/07794 ,  H01L23/295 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor device capable of wireless communication, which has high reliability in terms of resistance to external force, in particular, pressing force and can prevent electrostatic discharge in an integrated circuit without preventing reception of an electric wave. The semiconductor device includes an on-chip antenna connected to the integrated circuit and a booster antenna which transmits a signal or power included in a received electric wave to the on-chip antenna without contact. In the semiconductor device, the integrated circuit and the on-chip antenna are interposed between a pair of structure bodies formed by impregnating a fiber body with a resin. One of the structure bodies is provided between the on-chip antenna and the booster antenna. A conductive film having a surface resistance value of approximately 106 to 1014 Ω/cm2 is formed on at least one surface of each structure body.

摘要翻译： 一种能够进行无线通信的半导体装置，其在外力方面具有高的可靠性，特别是按压力，并且能够防止集成电路中的静电放电，而不会妨碍电波的接收。 半导体器件包括连接到集成电路的片上天线和将接收到的电波中包含的信号或功率发送到片上天线而不接触的增强天线。 在半导体器件中，集成电路和片上天线插入通过用树脂浸渍纤维体而形成的一对结构体之间。 其中一个结构体设置在片上天线和增强天线之间。 在每个结构体的至少一个表面上形成表面电阻值为大约106至1014Ω/ cm2的导电膜。