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公开(公告)号：US20070170529A1
公开(公告)日：2007-07-26
申请号：US11545052
申请日：2006-10-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L29/84
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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公开(公告)号：US20050184304A1
公开(公告)日：2005-08-25
申请号：US10787509
申请日：2004-02-25
Applicant: Pavan Gupta , Paul Hagelin , Gregory Andronaco
Inventor： Pavan Gupta , Paul Hagelin , Gregory Andronaco
CPC classification number: B81C1/00317 , B81B2201/042 , B81C1/00214 , B81C2203/0118 , G02B26/0833 , G02B26/0841
Abstract: The invention provides a wafer-level package for a micromirror array. The wafer-level package includes a substrate including a wafer having a substrate surface with a plurality of actuatable micromirrors coupled to the substrate surface. An optical window is attached to the substrate surface to form at least one sealed cavity between an inner surface of the optical window and the substrate surface. A beam of light transmitted through the optical window is redirected by at least one actuatable micromirror within the sealed cavity.
Abstract translation: 本发明提供了一种用于微镜阵列的晶片级封装。 晶片级封装包括具有基板表面的晶片的基板，多个可致动的微镜耦合到基板表面。 光学窗口附接到基板表面以在光学窗口的内表面和基板表面之间形成至少一个密封空腔。 通过光学窗口传输的光束由密封空腔内的至少一个可致动微镜重定向。
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公开(公告)号：US20050162765A1
公开(公告)日：2005-07-28
申请号：US10764018
申请日：2004-01-22
Applicant: Paul Hagelin , Pavan Gupta , Gregory Andronaco
Inventor： Paul Hagelin , Pavan Gupta , Gregory Andronaco
CPC classification number: B81B3/007 , B81B2201/042 , G02B26/0841
Abstract: The invention provides a micromirror for directing a beam of light. The micromirror includes a mirror plate movably coupled to a substrate and a lower reinforcement rib connected to a lower surface of the mirror plate. The lower reinforcement rib is formed in a rib trench within the substrate when at least a portion of the mirror plate is formed. The lower reinforcement rib reinforces the mirror plate to minimize mirror plate curvature. A system for directing a beam of light and a method of fabricating a reinforced micromirror is also disclosed.
Abstract translation: 本发明提供一种用于引导光束的微镜。 微镜包括可移动地联接到基板的镜板和连接到镜板的下表面的下加强肋。 当形成镜板的至少一部分时，下加强肋形成在基底内的肋沟槽中。 下加强肋加强了镜板，以最小化镜板曲率。 还公开了一种用于引导光束的系统和制造增强微镜的方法。
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公开(公告)号：US08324729B2
公开(公告)日：2012-12-04
申请号：US13151316
申请日：2011-06-02
Applicant: Pavan Gupta , Aaron Partridge , Markus Lutz
Inventor： Pavan Gupta , Aaron Partridge , Markus Lutz
IPC: H01L23/34 , H01L23/495
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.
Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。
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Patent Agency Ranking
公开(公告)号：US20120170103A1
公开(公告)日：2012-07-05
申请号：US12983199
申请日：2010-12-31
Applicant: Pavan Gupta , Gabriel Matus , Vlad Novotny
Inventor： Pavan Gupta , Gabriel Matus , Vlad Novotny
CPC classification number: G02B26/0841 , Y10T156/1052
Abstract: We describe a method of fabricating an optical MEMS spatial light modulator (SLM). The method comprises providing an optical MEMS SLM wafer bearing multiple optical MEMS SLM devices and spin coating a glass wafer with an organic adhesive, in some preferred embodiments benzocyclobutene. The adhesive is patterned, preferably by uv lithography, to define multiple ring-shaped bond lines each sized to fit around one of the SLM devices, and the glass wafer is then bonded to the MEMS SLM wafer, preferably at a temperature of between 100° C. and 450° C., such that each of the ring-shaped bond lines encompasses a respective SLM device. A portion of the glass wafer adjacent an SLM device is then removed to reveal electrical connectors to the device and the devices are tested before dicing and packaging, to enable selective packaging of working devices.
Abstract translation: 我们描述了一种制造光学MEMS空间光调制器（SLM）的方法。 该方法包括提供具有多个光学MEMS SLM器件的光学MEMS SLM晶片，并且在一些优选实施方案中，使用有机粘合剂旋转涂覆玻璃晶片，苯并环丁烯。 将粘合剂图案化，优选通过紫外光刻法来限定多个环形接合线，每个环形接合线的尺寸适合于围绕一个SLM器件，并且然后将玻璃晶片接合到MEMS SLM晶片，优选地在100°的温度 C.和450℃，使得每个环形接合线包括相应的SLM装置。 然后移除与SLM装置相邻的玻璃晶片的一部分以露出与装置的电连接器，并且在切割和包装之前对装置进行测试，以便能够选择性地包装工作装置。
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公开(公告)号：US20110227175A1
公开(公告)日：2011-09-22
申请号：US13151316
申请日：2011-06-02
Applicant: Pavan Gupta , Aaron Partridge , Markus Lutz
Inventor： Pavan Gupta , Aaron Partridge , Markus Lutz
IPC: H01L29/84
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.
Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。
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公开(公告)号：US20070181962A1
公开(公告)日：2007-08-09
申请号：US11580197
申请日：2006-10-12
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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公开(公告)号：US20070172976A1
公开(公告)日：2007-07-26
申请号：US11593404
申请日：2006-11-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L21/00
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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公开(公告)号：US20070170530A1
公开(公告)日：2007-07-26
申请号：US11545113
申请日：2006-10-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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