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公开(公告)号：US20070170532A1
公开(公告)日：2007-07-26
申请号：US11593429
申请日：2006-11-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L29/84
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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公开(公告)号：US20070170440A1
公开(公告)日：2007-07-26
申请号：US11600860
申请日：2006-11-16
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L31/0312
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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3.发明授权公开(公告)号：US08871551B2
公开(公告)日：2014-10-28
申请号：US11593404
申请日：2006-11-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。 本发明的制造或制造微机电系统及其制造的系统采用晶片接合封装技术。
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公开(公告)号：US20130075853A1
公开(公告)日：2013-03-28
申请号：US13681065
申请日：2012-11-19
Applicant: Pavan Gupta , Aaron Patridge , Markus Lutz
Inventor： Pavan Gupta , Aaron Patridge , Markus Lutz
IPC: H01L23/498 , H01L23/34
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A stacked die package for an electromechanical resonator system includes an electromechanical resonator die bonded or fixed to a control IC die for the electromechanical resonator by, for example, a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Certain packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package may provide small package footprint and/or low package thickness, and low thermal resistance and a robust conductive path between the dice.
Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括通过例如热和/或导电环氧树脂结合或固定到用于机电谐振器的控制IC管芯的机电谐振腔。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的某些封装结构包括芯片引线（COL），片上芯片（COP）和芯片芯片（COT）封装。 堆叠的管芯封装可以提供小的封装封装和/或低的封装厚度，以及低的热阻和在管芯之间的坚固的导电路径。
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公开(公告)号：US20070290364A1
公开(公告)日：2007-12-20
申请号：US11763801
申请日：2007-06-15
Applicant: Pavan GUPTA , Eric Razda
Inventor： Pavan GUPTA , Eric Razda
IPC: H01L23/52
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.
Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。
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Patent Agency Ranking
公开(公告)号：US20070170528A1
公开(公告)日：2007-07-26
申请号：US11336521
申请日：2006-01-20
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L29/84
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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7.发明申请Wafer encapsulated microelectromechanical structure and method of manufacturing same 审中-公开晶圆封装的微机电结构及其制造方法公开(公告)号：US20070170439A1
公开(公告)日：2007-07-26
申请号：US11600460
申请日：2006-11-16
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L31/0312
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
Abstract translation: 这里描述和说明了许多发明。 一方面，本发明涉及包封和制造机电结构或元件的装置，系统和/或方法，例如加速度计，陀螺仪或其他换能器（例如，压力传感器，应变传感器，触觉传感器，磁传感器和 /或温度传感器），滤波器或谐振器。 本发明的制造或制造微机电系统及其制造的系统采用晶片接合封装技术。
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公开(公告)号：US20070170438A1
公开(公告)日：2007-07-26
申请号：US11593500
申请日：2006-11-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L31/0312
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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公开(公告)号：US08022554B2
公开(公告)日：2011-09-20
申请号：US11763801
申请日：2007-06-15
Applicant: Pavan Gupta , Eric Razda
Inventor： Pavan Gupta , Eric Razda
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.
Abstract translation: 用于机电谐振器系统的堆叠管芯封装包括芯片，其包含通过热和/或导电环氧树脂粘合到用于机电谐振器的控制芯片上的机电谐振器。 在各种实施例中，机电谐振器可以是微机电系统（MEMS）谐振器或纳米机电系统（NEMS）谐振器。 可以包括包含机电谐振器和控制芯片的芯片的封装结构包括芯片引线（COL），片上芯片（COP）和片上芯片（COT）封装。 堆叠管芯封装提供小的封装封装和/或低封装厚度，以及低热阻和在包含机电谐振器的芯片和控制芯片之间的坚固的导电路径。
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公开(公告)号：US20070170531A1
公开(公告)日：2007-07-26
申请号：US11593428
申请日：2006-11-06
Applicant: Aaron Partridge , Markus Lutz , Pavan Gupta
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L29/84
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
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