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11.
公开(公告)号:US20250150923A1
公开(公告)日:2025-05-08
申请号:US18890141
申请日:2024-09-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yangsoo KWON , Jonggun MOON , Seungjin CHOI , Yoojin CHOI , Jinho KIM , Woongjae HAN
IPC: H04W36/32 , H04B17/318 , H04W24/08 , H04W76/19
Abstract: A user equipment (UE) supporting a first radio access technology (RAT) network and a second RAT network, the UE includes processing circuitry configured to monitor whether a position of the UE has changed from a first position to obtain a monitoring result, a network connected to the UE switching from the first RAT network to the second RAT network based on the UE moving to the first position, and perform a re-connection operation to the first RAT network based on the monitoring result.
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12.
公开(公告)号:US20250150916A1
公开(公告)日:2025-05-08
申请号:US18934541
申请日:2024-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mahmoud WATFA , Chadi KHIRALLAH
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. A method for energy saving in a network is provided. The method includes determining, based on energy information associated with a first network node, that the capacity of the first network node should be reduced, based on the determining, selecting a second network node, and redirecting a UE from the first network node to the second network node.
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公开(公告)号:US20250150733A1
公开(公告)日:2025-05-08
申请号:US18783876
申请日:2024-07-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Je Yeoun JUNG , Sang Yoon KIM , Seung Sik KIM , Hyeon Woo LEE , Jae Hoon JEON
IPC: H04N25/771 , H04N25/532 , H04N25/79
Abstract: An image sensor includes a first semiconductor chip which extends in first and second directions that intersect each other, and having a pixel part including a plurality of pixel regions; and a second semiconductor chip including a circuit part electrically connected to the pixel part, on the first semiconductor chip. The pixel part includes a photodiode, a floating diffusion node which accumulates photocharges generated by the photodiode, and a first source follower which amplifies and outputs a signal corresponding to a change in potential of the floating diffusion node. The circuit part includes a first pre-charge selection transistor connected between a first node and a second node, a second pre-charge selection transistor connected to the first pre-charge selection transistor, and a pre-charge transistor which pre-charges the second node connected to the first source follower. The plurality of pixel regions share the pre-charge transistor.
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公开(公告)号:US20250150528A1
公开(公告)日:2025-05-08
申请号:US19018662
申请日:2025-01-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sumit KUMAR , Harichandana Bhogaraju Swarajya Sai , Deepak Chaurasia
IPC: H04M1/72454 , G06F1/3234
Abstract: A method for managing an Always-on-Display (AoD) of an electronic device, includes: receiving a candidate AoD content to be displayed on the electronic device and a AoD contextual information; determining an AoD preferred pattern of a user of the electronic device based on the candidate AoD content and the AoD contextual information; generating a set of variable AoD content corresponding to the candidate AoD content based on the AoD preferred pattern of the user and the AoD contextual information, wherein AoD content of the set of variable AoD content is generated for changes in the AoD contextual information; and displaying the set of variable AoD content on the electronic device.
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公开(公告)号:US20250150523A1
公开(公告)日:2025-05-08
申请号:US19014740
申请日:2025-01-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyonghwan CHO , Jongmin KIM , Eunbae KWON , Sangho HONG
Abstract: According to one embodiment of the present invention, a display may comprise a display panel comprising a light-emitting layer, a flexible printed circuit board which extends from the display panel and is at least partially arranged on the rear surface of the display panel, a display driver integrated circuit (DDI) which is arranged on one surface of the flexible printed circuit board and is configured to drive the display panel, and a shielding film attached to the flexible printed circuit board, while surrounding at least a portion of the DDI. In one embodiment, the flexible printed circuit board may comprise at least one through hole or at least one recess formed in an area where the shielding film is attached. Various other embodiments may also be possible.
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公开(公告)号:US20250150493A1
公开(公告)日:2025-05-08
申请号:US18824326
申请日:2024-09-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Murali REDDIBOYANA , Mustque AHMED , Gururaj B MALANNAVAR
IPC: H04L65/1073 , H04L65/1016 , H04L65/1045 , H04L65/1069
Abstract: Methods for handling a data connection session in an Internet Protocol (IP) Multimedia Subsystem (IMS) network are provided. The method includes configuring a S50 interface between a Mobility Management Entity (MME) and a Policy and Charging Rules Function (PCRF) entity in the IMS network, and notifying a User Equipment (UE) about a Mobile Terminated (MT) Voice over LTE (VOLTE) call by using the MME. Another method includes configuring a SBI interface between an Access and Mobility Management Function (AMF) entity and the Policy Control Function (PCF) entity in the IMS network, and includes notifying a UE about a MT Voice over New Radio (VoNR) call by using the AMF entity.
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公开(公告)号:US20250150246A1
公开(公告)日:2025-05-08
申请号:US19002187
申请日:2024-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanho AN , Jonghyung KWUN , Jinhyuk LEE , Jonghyune KIM , Taekhoon KIM , Jinwoo YANG , Hyoungju JI , Seunghoon CHOI , Youngkyu CHOI
IPC: H04L5/14 , H04W8/24 , H04W72/0457 , H04W72/21
Abstract: The disclosure relates to a 5G or 6G communication system for supporting higher data transmission rates. A method performed by a base station configured to support a time division duplex (TDD) system in a wireless communication system, according to various embodiments of the present disclosure, may comprise: transmitting, to a terminal, resource configuration information including a first cross division duplex-uplink (XDD-UL) section; determining whether a change of the first XDD-UL section is necessary; identifying a second XDD-UL section based on the determination result; transmitting, to the terminal, information about the second XDD-UL section; and receiving, from the terminal, an uplink signal on the basis of the first XDD-UL section and/or the second XDD-UL section.
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公开(公告)号:US20250149942A1
公开(公告)日:2025-05-08
申请号:US18813718
申请日:2024-08-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Woong HWANG
Abstract: A motor may include a shaft, a stator and a rotor. The rotor may include a plurality of magnets, a casing and a rotor core. The rotor core may include a plurality of first core layers and a plurality of second core layers. The first core layer may include a base part through which the shaft passes, a plurality of core parts spaced apart from each other along a circumferential direction of the base part, and a plurality of bridge parts configured so that each of the plurality of bridge parts extends from a corresponding core part of the plurality of core parts toward the base part, and is bent toward the corresponding core part.
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公开(公告)号:US20250149773A1
公开(公告)日:2025-05-08
申请号:US19013690
申请日:2025-01-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byungjoon KIM , Heejin PARK , Kyunghoon MOON , Sungsoo KIM , Yongyoun KIM , Youngjoon LIM
Abstract: An electronic device is provided. The electronic device includes a first housing forming at least a part of a side surface of the electronic device, wherein a first opening is formed in the first housing, a first conductive structure formed on the inside the first opening, and an antenna module, wherein the antenna module includes a printed circuit board (PCB), a plurality of conductive patches disposed on the PCB to face the first opening, and a wireless communication circuit, wherein, as the wireless communication circuit is configured to feed power to the plurality of conductive patches, a first electric path is formed in the first conductive structure which is spaced apart from the plurality of conductive patches, and wherein a radio frequency (RF) signal generated based on the first electric path is radiated to an outside of the electronic device.
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公开(公告)号:US20250149520A1
公开(公告)日:2025-05-08
申请号:US18780675
申请日:2024-07-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junghoon Kang , Daegon Kim
IPC: H01L25/18 , G02B6/12 , H01L23/00 , H01L23/31 , H01L23/48 , H01L23/538 , H01L27/144
Abstract: A semiconductor package including a package substrate, a plurality of chiplets located on the package substrate, the plurality of chiplets including a photonics chip and a semiconductor chip located on the photonics chip, and a plurality of photonics bridge chips located on the package substrate. The plurality of chiplets are spaced apart from each other in a horizontal direction, and each of the plurality of photonics bridge chips is located between the plurality of chiplets.
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