公开(公告)号：US20160142910A1

公开(公告)日：2016-05-19

申请号：US14542668

申请日：2014-11-17

Applicant: Solid State System Co., Ltd.

Inventor： Tai-Yao Lee

IPC: H04W12/06 ,  G06F12/02 ,  H04L29/06 ,  G06F12/14

CPC classification number: H04W12/06 ,  G06F12/0246 ,  G06F12/14 ,  G06F21/79 ,  G06F2212/7209 ,  H04L63/083 ,  H04L63/105 ,  H04L63/107 ,  H04W4/80 ,  H04W12/00503 ,  H04W12/08

Abstract: A short-range wireless communication (SRWC) mobile storage device includes a portable storage device and a SRWC device tag. The SRWC device tag has a non-volatile memory for storing an access-control setting information. If the access-control setting information has already been set with required parameters and when the portable storage device with the SRWC device tag is connected to a master equipment, the portable storage device is automatically switched to a secured private zone for the master equipment to access.

Abstract translation: 短距离无线通信（SRWC）移动存储设备包括便携式存储设备和SRWC设备标签。 SRWC设备标签具有用于存储访问控制设置信息的非易失性存储器。 如果访问控制设置信息已经被设置为所需参数，并且当具有SRWC设备标签的便携式存储设备连接到主设备时，便携式存储设备被自动切换到主设备访问的安全私有区域 。

公开(公告)号：US09321635B2

公开(公告)日：2016-04-26

申请号：US14092929

申请日：2013-11-28

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: H01L21/00 ,  B81C1/00

CPC classification number: B81C1/00928 ,  B81C1/00476

Abstract: A method for releasing a diaphragm of a micro-electro-mechanical systems (MEMS) device at a stage of semi-finished product. The method includes pre-wetting the MEMS device in a pre-wetting solution to at least pre-wet a sidewall surface of a cavity of the MEMS device. Then, a wetting process after the step of pre-wetting the MEMS device is performed to etch a dielectric material of a dielectric layer for holding the diaphragm, wherein a sensing portion of the diaphragm is released from the dielectric layer.

Abstract translation: 一种在半成品阶段释放微电子机械系统（MEMS）装置的隔膜的方法。 该方法包括将预先润湿溶液中的MEMS器件预润湿至少预先润湿MEMS器件的空腔的侧壁表面。 然后，执行在预先润湿MEMS器件的步骤之后的润湿过程，以蚀刻用于保持隔膜的电介质层的电介质材料，其中隔膜的感测部分从电介质层释放。

公开(公告)号：US09271087B1

公开(公告)日：2016-02-23

申请号：US14505495

申请日：2014-10-02

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Chih-Hsien Chung ,  Yong-Wei Chen ,  Jhyy-Cheng Liou

IPC: H04R25/00 ,  H04R23/00 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R23/006 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003

Abstract: A MEMS microphone package device includes a MEMS microphone chip as an integrated circuit chip. An acoustic sensing structure is embedded in the integrated circuit chip. An adhesive structure adheres on outer sidewall of the microphone chip. A bottom portion of the adhesive structure protrudes out from first surface of the microphone chip and adheres on a surface of a substrate, having interconnection structure, to form a first seal ring. A space between the acoustic sensing structure and the substrate and sealed by the first seal ring forms a second chamber. A cover adheres to top portion of the adhesive structure, covering over the cavity on the second surface of the microphone chip. The top portion of the adhesive structure forms as a second seal ring. A space between the cover and the second surface of the microphone chip and sealed by the second seal ring forms a first chamber.

Abstract translation: MEMS麦克风封装器件包括作为集成电路芯片的MEMS麦克风芯片。 声学感测结构嵌入在集成电路芯片中。 粘合剂结构粘附在麦克风芯片的外侧壁上。 粘合剂结构的底部从麦克风芯片的第一表面突出出来并粘附在具有互连结构的基板的表面上，以形成第一密封环。 在声学检测结构和衬底之间并由第一密封环密封的空间形成第二腔室。 盖子粘附到粘合剂结构的顶部，覆盖在麦克风芯片的第二表面上的空腔上。 粘合剂结构的顶部形成为第二密封环。 所述盖和麦克风芯片的第二表面之间的空间被第二密封环密封形成第一腔室。

公开(公告)号：US09264832B2

公开(公告)日：2016-02-16

申请号：US14066712

申请日：2013-10-30

Applicant: Solid State System Co., Ltd.

Inventor： Cheng-Wei Tsai ,  Chien-Hsing Lee ,  Jhyy-Cheng Liou

IPC: H01L21/00 ,  H04R31/00 ,  H04R19/00

CPC classification number: H04R31/00 ,  H01L2224/48137 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/005 ,  H04R2201/003

Abstract: A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.

Abstract translation: 提供了保护微机电系统（MEMS）麦克风的声学端口的方法。 该方法包括：提供MEMS麦克风; 并在MEMS麦克风的声学端口上形成保护膜。 保护膜在声学端口上方具有多孔区域以接收声信号，但是至少阻挡入侵材料。 保护膜至少可以承受焊料流动的处理温度。

公开(公告)号：US20150315013A1

公开(公告)日：2015-11-05

申请号：US14328727

申请日：2014-07-11

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai ,  Jhyy-Cheng Liou

IPC: B81B7/00 ,  H04R23/00

CPC classification number: H04R19/005 ,  B81B7/0006 ,  B81B7/0058 ,  B81B2201/0257 ,  H04R23/006 ,  H04R2201/003 ,  H04R2460/11

Abstract: A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.

Abstract translation: 微电气机械系统（MEMS）麦克风包括具有基板，隔膜和背板的MEMS结构，其中基板具有空腔，并且背板位于空腔和隔膜之间。 背板具有多个通气孔，其连接到空腔并允许空腔延伸到隔膜。 此外，粘合层设置在基板上，围绕空腔。 盖板粘附在粘合剂层上，其中盖板具有声孔，从空腔脱位而没有直接连接。

公开(公告)号：US20220127134A1

公开(公告)日：2022-04-28

申请号：US17081995

申请日：2020-10-27

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai

IPC: B81B3/00 ,  B81C1/00 ,  H04R19/04 ,  H04R31/00

Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.

公开(公告)号：US11317220B2

公开(公告)日：2022-04-26

申请号：US16719941

申请日：2019-12-18

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Cheng-Wei Tsai ,  Chien-Hsing Lee

IPC: H04R19/00 ,  H04R19/04 ,  H04R1/22 ,  B81B3/00 ,  B81C1/00 ,  H04R7/18 ,  H04R7/08

Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.

公开(公告)号：US11312616B1

公开(公告)日：2022-04-26

申请号：US17081995

申请日：2020-10-27

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Chien-Hsing Lee ,  Cheng-Wei Tsai

IPC: H04R19/00 ,  B81B3/00 ,  B81C1/00 ,  H04R19/04 ,  H04R31/00

Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.

公开(公告)号：US11172287B2

公开(公告)日：2021-11-09

申请号：US16673962

申请日：2019-11-05

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Cheng-Wei Tsai ,  Chien-Hsing Lee

IPC: H04R1/24 ,  H04R3/00 ,  B81B3/00

Abstract: A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.

公开(公告)号：US20210144485A1

公开(公告)日：2021-05-13

申请号：US16677622

申请日：2019-11-07

Applicant: Solid State System Co., Ltd.

Inventor： Tsung-Min Hsieh ,  Li-Chi Tsao ,  Chien-Hsing Lee

IPC: H04R19/04 ,  B81B3/00 ,  B81C1/00 ,  H04R7/04 ,  H04R7/18 ,  H04R19/00

Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.