公开(公告)号：US10927226B2

公开(公告)日：2021-02-23

申请号：US14431079

申请日：2013-09-25

Applicant: TOHO TENAX CO., LTD.

Inventor： Takaya Suzuki ,  Hajime Sakamoto ,  Toyoaki Ishiwata ,  Yoshitaka Umemoto

IPC: B32B5/26 ,  B32B7/06 ,  B32B27/08 ,  B32B37/10 ,  B32B27/38 ,  B29B11/16 ,  C08J5/24 ,  B29K63/00 ,  B29K105/08 ,  B29K307/04

Abstract: The invention provides a prepreg comprising: a primary prepreg composed of reinforcing fibers and a resin composition (I) impregnating the interior of a reinforcing fiber layer formed from these fibers; and a surface layer composed of a resin composition (II) formed on one or both sides of the primary prepreg; wherein the resin composition (I) is an epoxy resin composition [B] containing at least an epoxy resin and a thermoplastic resin, and the resin composition (II) is an epoxy resin composition [A] containing at least an epoxy resin and conductive particles.

公开(公告)号：US20190168425A1

公开(公告)日：2019-06-06

申请号：US16310008

申请日：2017-05-11

Applicant: HONDA MOTOR CO., LTD. ,  SUBARU CORPORATION ,  SUZUKI MOTOR CORPORATION ,  TOYOTA JIDOSHA KABUSHIKI KAISHA ,  Toray Industries, Inc. ,  KYOWA INDUSTRIAL CO., LTD. ,  NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY ,  AISIN SEIKI KABUSHIKI KAISHA ,  Mitsubishi Jidosha Kogyo Kabushiki Kaisha ,  TOHO TENAX CO., LTD.

Inventor： Satoshi Hirawaki ,  Masashi Horikawa ,  Shusuke Sanai ,  Kanji Takaoka ,  Kazuaki Amaoka ,  Munehito Kawakami ,  Kazuki Baba

IPC: B29C43/58 ,  B29C43/04 ,  B29C43/00

Abstract: A molding method and a molding system for improving a molding speed of a resin molded member. In the method, firstly a thermoplastic resin composite material is filled in a metal mold (i.e., at time T0), and subsequently a mold-clamping process gets started. As the mold-clamping process progresses, a first decompression circuit starts to decompress an inside of a cavity when the cavity is closed by a sealing member provided on the metal mold. Then, as the mold-clamping process further progresses, the thermoplastic resin composite material thus filled in the metal mold contacts an upper mold of the metal mold (i.e., at time T2). After that, a second decompression circuit starts to decompress the inside of the cavity, thereby to complete the mold-clamping process (i.e., at time T3).

公开(公告)号：US20180208729A1

公开(公告)日：2018-07-26

申请号：US15329098

申请日：2015-07-24

Applicant: Toho Tenax Co., Ltd.

Inventor： Kazuma KUROKAWA ,  Hironori KAWAMOTO ,  Yoshitaka UMEMOTO ,  Akio NAKAISHI

IPC: C08J5/24 ,  B32B5/26 ,  B32B27/12

CPC classification number: C08J5/24 ,  B32B5/26 ,  B32B27/12 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2307/202 ,  C08J2363/00 ,  C08J2377/02 ,  C08J2381/06

Abstract: A prepreg includes conductive fibers impregnated with a matrix resin, the prepreg having a conductive region where a conductive material is dispersed in the resin. In the present invention, a resin layer composed of at least the matrix resin preferably is present on one or both surfaces of a conductive fiber layer composed of at least the conductive fibers, and the conductive region is present at least in the resin layer. In addition, the above-described conductive region preferably is present continuously in the thickness direction. The conductive region preferably is a conductive region where the conductive material is dispersed in the matrix resin, and the resin in the conductive region preferably forms a continuous phase with the matrix resin in other regions. A volume resistivity of the conductive region preferably is 1/1,000 or less of that of other regions of the matrix resin.

公开(公告)号：US20140057515A1

公开(公告)日：2014-02-27

申请号：US13981807

申请日：2012-03-21

Applicant: TOHO TENAX CO., Ltd.

Inventor： Takaya Suzuki ,  Toyoaki Ishiwata ,  Yoshinori Suzuki ,  Hiroshi Numata

IPC: D06M15/55 ,  B29D7/01

CPC classification number: D06M15/55 ,  B29C70/504 ,  B29D7/01 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08L63/00 ,  Y10T442/2049

Abstract: The present invention provides a prepreg comprising: a primary pre-pregnant made of a reinforced fiber substrate and an epoxy resin composition containing at least epoxy resin and thermoplastic resin impregnated into the reinforcing fiber that forms the reinforced fiber substrate; and a surface layer made of epoxy resin composition containing at least an epoxy resin and an epoxy resin-soluble thermoplastic resin that dissolves in the epoxy resin, the surface layer being formed on one or both surfaces of the primary prepreg; the prepreg being characterized in that only one of either the epoxy resin composition of the primary prepreg or the epoxy resin composition of the surface layer contains a hardening agent for an epoxy resin.

Abstract translation: 本发明提供一种预浸料坯，其特征在于，包括：由增强纤维基材制成的初级预浸料和至少含有环氧树脂和浸渍在形成增强纤维基材的增强纤维中的热塑性树脂的环氧树脂组合物; 以及由环氧树脂组合物构成的表层，其至少含有环氧树脂和可溶于环氧树脂的环氧树脂可溶性热塑性树脂，所述表面层形成在所述一次预浸料的一个或两个表面上; 预浸料的特征在于，一次预浸料的环氧树脂组合物或表面层的环氧树脂组合物中只有一种含有环氧树脂用硬化剂。