Electronic component
    11.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号:US08593785B2

    公开(公告)日:2013-11-26

    申请号:US13092996

    申请日:2011-04-25

    CPC classification number: H01G4/005 H01G4/228 H01G4/232 H01G4/30

    Abstract: A laminate includes insulating layers laminated to each other. Capacitor conductors are embedded in the laminate and have exposed portions exposed between the insulating layers at respective surfaces of the laminate. The capacitor conductors define a capacitor. External electrodes are provided by plating on the respective surfaces of the laminate so as to directly cover the respective exposed portions. When the laminate is viewed in plan in a y axis direction, the length of each of the exposed portions is approximately 35% to approximately 45% of the length of an outer periphery of the insulating layer.

    Abstract translation: 层压体包括彼此层叠的绝缘层。 电容器导体嵌入在层叠体中,并且暴露在层压体的相应表面处的绝缘层之间的暴露部分。 电容器导体定义电容器。 通过电镀在层叠体的各个表面上以直接覆盖各个露出部分来提供外部电极。 当在y轴方向上平面地观察层压体时,每个暴露部分的长度约为绝缘层外周长度的35%至约45%。

    Ceramic electronic component
    12.
    发明授权
    Ceramic electronic component 有权
    陶瓷电子元件

    公开(公告)号:US08477476B2

    公开(公告)日:2013-07-02

    申请号:US13079049

    申请日:2011-04-04

    CPC classification number: H01G4/2325 H01G4/232 H01G4/30

    Abstract: A ceramic electronic component includes a ceramic element including opposed side surfaces, an inner electrode, and an external terminal electrode. The external terminal electrode includes a first conductive layer and a second conductive layer. The first conductive layer is formed by plating so as to be electrically coupled to an exposed section of the internal electrode exposed to the side surfaces. The second conductive layer is arranged so as to cover the first conductive layer and includes conductive resin. The value of T2/T1 is in the range of about 3.4 to about 11.3, where T1 indicates the thickness of the first conductive layer and T2 indicates the thickness of the second conductive layer.

    Abstract translation: 陶瓷电子部件包括:陶瓷元件,其包括相对的侧面,内部电极和外部端子电极。 外部端子电极包括第一导电层和第二导电层。 第一导电层通过电镀形成,以便电连接到暴露于侧表面的内部电极的暴露部分。 第二导电层被布置成覆盖第一导电层并且包括导电树脂。 T2 / T1的值在约3.4至约11.3的范围内,其中T1表示第一导电层的厚度,T2表示第二导电层的厚度。

    Multilayer ceramic electronic component including directly plated external electrodes
    16.
    发明授权
    Multilayer ceramic electronic component including directly plated external electrodes 有权
    多层陶瓷电子元件包括直接电镀外部电极

    公开(公告)号:US08547682B2

    公开(公告)日:2013-10-01

    申请号:US12765965

    申请日:2010-04-23

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: In a multilayer ceramic electronic component including directly plated external electrodes, in an exposed area defined by exposed portions of a plurality of internal conductors, an area ratio of the exposed portions in an end section of the exposed area is smaller than an area of exposed portions in a center section of the exposed area.

    Abstract translation: 在包括直接电镀的外部电极的多层陶瓷电子部件中,在由多个内部导体的暴露部分限定的露出区域中,露出区域的端部中的露出部分的面积比小于暴露部分的面积 在暴露区域的中心部分。

    Laminate type ceramic electronic component and manufacturing method therefor
    18.
    发明授权
    Laminate type ceramic electronic component and manufacturing method therefor 有权
    层压陶瓷电子元件及其制造方法

    公开(公告)号:US08587919B2

    公开(公告)日:2013-11-19

    申请号:US13208393

    申请日:2011-08-12

    CPC classification number: H01G4/005 H01G4/30

    Abstract: In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.

    Abstract translation: 在层叠型陶瓷电子部件中,当通过电镀直接形成在组件主体的表面上的层叠陶瓷电容器的外部电极时,直接镀膜的膜相对于部件主体可具有低的固定强度 。 作为外部电极,首先形成由P含量为约9重量%以上的Ni-P镀膜构成的第一镀层,以使各个内部电极的露出端作为起点沉积的电镀沉积为 在组件主体的至少一个端面上生长。 然后,在第一镀层上形成由基本上不含P的Ni镀膜构成的第二镀层。 优选地,通过无电镀形成第一镀层,而通过电解电镀形成第二镀层。

    Laminated ceramic electronic component
    19.
    发明授权
    Laminated ceramic electronic component 有权
    层压陶瓷电子元件

    公开(公告)号:US08305729B2

    公开(公告)日:2012-11-06

    申请号:US12489631

    申请日:2009-06-23

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: A laminated ceramic electronic component includes first internal electrodes and second internal electrodes that overlap each other through ceramic layers, each of the first and second internal electrodes having first and second effective portions, first and second connecting portions, and first and second extended portions whose film thickness is greater than that of the first and second connecting portions and which are exposed at the outer surface of a ceramic element assembly. When distances from side surfaces of the ceramic assembly on which first and second external electrodes are provided to the inner edges of the first and second extended portions are defined as L1 and L2, respectively, and a distance between side surfaces and the end of the second internal electrode or the end of the first internal electrode is defined as G2 or G1, G2>L1 and G1>L2 are satisfied.

    Abstract translation: 层叠陶瓷电子部件包括通过陶瓷层彼此重叠的第一内部电极和第二内部电极,第一和第二内部电极中的每一个具有第一和第二有效部分,第一和第二连接部分,以及第一和第二延伸部分,其膜 厚度大于第一和第二连接部分的厚度并且暴露在陶瓷元件组件的外表面处。 当陶瓷组件的与第一和第二外部电极设置在第一和第二延伸部分的内边缘的侧表面的距离分别被定义为L1和L2,并且侧表面与第二外部电极的端部之间的距离 内部电极或第一内部电极的端部被定义为G2或G1,G2> L1和G1> L2。

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