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1.发明授权公开(公告)号：US08587919B2
公开(公告)日：2013-11-19
申请号：US13208393
申请日：2011-08-12
IPC分类号： H01G4/30
摘要： In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.
摘要翻译： 在层叠型陶瓷电子部件中，当通过电镀直接形成在组件主体的表面上的层叠陶瓷电容器的外部电极时，直接镀膜的膜相对于部件主体可具有低的固定强度 。 作为外部电极，首先形成由P含量为约9重量％以上的Ni-P镀膜构成的第一镀层，以使各个内部电极的露出端作为起点沉积的电镀沉积为 在组件主体的至少一个端面上生长。 然后，在第一镀层上形成由基本上不含P的Ni镀膜构成的第二镀层。 优选地，通过无电镀形成第一镀层，而通过电解电镀形成第二镀层。
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2.发明授权公开(公告)号：US08503160B2
公开(公告)日：2013-08-06
申请号：US13208416
申请日：2011-08-12
CPC分类号： H01G4/005 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.
摘要翻译： 在层叠型陶瓷电子部件中，当通过电镀直接形成在主体的表面上的外部电极时，作为外部电极的镀膜可以相对于部件主体具有低的固定强度 。 为了防止这个问题，外部电极包括由Ni-B镀膜组成的第一镀层，并且首先形成为以至少沉积作为起点的各内部电极的露出端沉积的电镀沉积 组件主体的端面。 然后，在第一镀层上形成由基本不含B的Ni镀膜构成的第二镀层。 优选构成第一镀层的Ni-B镀膜的B含量为约0.1重量％〜约6重量％。
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公开(公告)号：US09111690B2
公开(公告)日：2015-08-18
申请号：US12543549
申请日：2009-08-19
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/18 , H01G4/30 , Y10T29/435
摘要： A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
摘要翻译： 一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。 在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将 在含有金属离子或金属络合物的液体中的多层复合材料。 然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。 因此，内部电极的露出端彼此电连接。
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公开(公告)号：US08797711B2
公开(公告)日：2014-08-05
申请号：US12632823
申请日：2009-12-08
IPC分类号： H01G4/228
摘要： A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
摘要翻译： 在形成外部电极的电子部件中，通过直接对构成体的表面的特定区域进行电镀，能够精确地控制形成有构成外部电极的镀膜的区域。 在构成体中，在形成有外部电极的区域被分隔的位置设置凸块。 在电镀工艺中，构成外部电极的镀膜的生长在凸块中基本上停止或延迟。 结果，可以在凸块的位置上精确地控制构成外部电极的镀膜的生长终止点。
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公开(公告)号：US08730646B2
公开(公告)日：2014-05-20
申请号：US12466435
申请日：2009-05-15
摘要： A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 μm or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 μm or less. The metal particles defining the lower plating films may be Cu particles.
摘要翻译： 层叠电子部件包括外部端子电极，其包括具有平均尺寸为0.5μm以下的金属粒子的下部电镀膜，下部电镀膜通过直接电镀电子部件主体的外表面而形成，使得下部电镀膜为电气 连接到内部导体的暴露部分。 外部端子电极还可以包括形成在下部镀膜上的上部镀膜，上部镀膜由一层或多层限定。 限定上镀膜的金属粒子的平均粒径可以为0.5μm以下。 限定下镀层的金属颗粒可以是Cu颗粒。
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公开(公告)号：US08411409B2
公开(公告)日：2013-04-02
申请号：US13161535
申请日：2011-06-16
申请人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Syunsuke Takeuchi , Kiyoyasu Sakurada
发明人： Makoto Ogawa , Akihiro Motoki , Masahito Saruban , Toshiyuki Iwanaga , Syunsuke Takeuchi , Kiyoyasu Sakurada
IPC分类号： H01G4/30
摘要： When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.
摘要翻译： 当通过电镀形成层压陶瓷电容器等陶瓷电子部件的外部端子电极时，即使在不希望的位置也可能产生电镀生长。 由组件主体提供的陶瓷表面被构造为包括例如呈现较高镀层生长的例如钛酸钡系陶瓷的高镀层生长区域和例如锆酸锆的低镀层生长区域 其具有相对较低的电镀生长。 构成用于限定外部端子电极的基底的第一层的电镀膜以这样的方式形成，使得以由内部电极的暴露端作为起点设置的导电表面沉积的镀覆沉积物的生长被限制为不交叉 在高电镀生长区域和低电镀生长区域之间的边界朝向低电镀生长区域。
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7.发明授权公开(公告)号：US08154848B2
公开(公告)日：2012-04-10
申请号：US12354026
申请日：2009-01-15
摘要： A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要翻译： 多层陶瓷电子部件包括层叠体，其包括多个陶瓷层的叠层和沿着陶瓷层之间的界面延伸的多个内部电极，以及电连接在层叠体的表面露出的内部电极的多个外部电极。 每个外部电极至少包括直接连接到内部电极的部分的镀层。 镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。
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公开(公告)号：US07764484B2
公开(公告)日：2010-07-27
申请号：US12142924
申请日：2008-06-20
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325 , H05K1/0306 , H05K1/092 , H05K3/102 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T428/25
摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.
摘要翻译： 一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部 电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。 形成外部电极的步骤包括将多个具有约1μm以上的粒径的导电粒子附着在层叠体的规定表面上的步骤，以及在导电粒子的规定表面上直接进行电镀的工序 附上。
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公开(公告)号：US07589952B2
公开(公告)日：2009-09-15
申请号：US12109371
申请日：2008-04-25
IPC分类号： H01G4/228
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的电镀膜限定。
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公开(公告)号：US09171671B2
公开(公告)日：2015-10-27
申请号：US13315311
申请日：2011-12-09
申请人： Akihiro Motoki , Makoto Ogawa
发明人： Akihiro Motoki , Makoto Ogawa
摘要： In a method of manufacturing a laminate type electronic component, while the distance between adjacent exposed ends of a plurality of internal electrodes is adjusted preferably to be about 50 μm or less, a plurality of conductive particles composed of Pd, Pt, Cu, Au, or Ag are provided on the surface of a component main body. The conductive particles have an average particle size of about 0.1 nm to about 100 nm, which are distributed in island-shaped configurations over the entire surface of the component main body, while the average distance between the respective conductive particles is adjusted to fall within the range of about 10 nm to about 100 nm. The component main body is subjected to electrolytic plating such that plating growth develops in and around a region including the respective exposed ends of the plurality of internal electrodes.
摘要翻译： 在层压型电子部件的制造方法中，将多个内部电极的相邻的露出端之间的距离优选调整为约50μm以下，由Pd，Pt，Cu，Au， 或Ag设置在组件主体的表面上。 导电性粒子的平均粒径为约0.1nm〜约100nm，分布在成分主体的整个表面上的岛状构型，同时将各导电粒子之间的平均距离调节为 范围为约10nm至约100nm。 对组件主体进行电镀，使得电镀生长在包括多个内部电极的各个露出端的区域内和周围形成。
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