公开(公告)号：US20070091161A1

公开(公告)日：2007-04-26

申请号：US11583196

申请日：2006-10-19

Applicant: Noriyoshi Shoji ,  Yoshinori Sato ,  Toshimitsu Morooka

Inventor： Noriyoshi Shoji ,  Yoshinori Sato ,  Toshimitsu Morooka

IPC: B41J2/335

CPC classification number: B41J2/33585

Abstract: A thermal head is structured to have a substrate, a thermal storage layer formed on one surface of the substrate and made of glass, and heating resistors provided on the thermal storage layer. A plurality of hollow portions are formed at a position spaced apart from a surface where the heating resistors are formed by laser processing using a femtosecond laser, in an area of the thermal storage layer which is opposed to the heating resistors. In this way, to provide a heating resistance element for improving heating efficiency of heating resistors to reduce power consumption, improving strength of a substrate under the heating resistors, and for enabling simple manufacture at a low cost, a thermal head and a printer using the same, and a method of manufacturing a heating resistance element.

Abstract translation: 热敏头被构造成具有基板，形成在基板的一个表面上并由玻璃制成的热存储层和设置在热存储层上的加热电阻器。 在与加热电阻器相对的区域中，在与通过使用飞秒激光的激光加工形成加热电阻器的表面间隔开的位置处形成多个中空部分。 以这种方式，为了提供一种用于提高加热电阻器的加热效率以降低功耗，提高加热电阻器下的基板的强度并且能够以低成本简单制造的加热电阻元件，热敏头和使用 相同，以及制造耐热元件的方法。

公开(公告)号：US06648503B2

公开(公告)日：2003-11-18

申请号：US09760030

申请日：2001-01-12

Applicant: Keiichi Tanaka ,  Toshimitsu Morooka

Inventor： Keiichi Tanaka ,  Toshimitsu Morooka

IPC: G01K1702

CPC classification number: G01K17/006 ,  G01J5/20 ,  G01K17/003 ,  Y10T29/49002

Abstract: A colorimeter has an absorber for absorbing radiation energy and converting the radiation energy into thermal energy. A resistor is connected to the absorber for converting thermal energy into an electrical signal. A membrane is connected to the resistor for controlling a thermal discharge from the resistor. A substrate is connected to the membrane and has a tri-layer structure comprised of an etching layer having a preselected thickness, an etching stop layer and a support substrate. The membrane is spaced-apart from a main surface of the etching stop layer by the preselected thickness of the etching layer.

Abstract translation: 色度计具有用于吸收辐射能并将辐射能转换成热能的吸收体。 电阻器连接到吸收器，用于将热能转换成电信号。 膜连接到电阻器，用于控制来自电阻器的热放电。 衬底连接到膜并且具有由具有预选厚度的蚀刻层，蚀刻停止层和支撑衬底组成的三层结构。 膜通过蚀刻层的预选厚度与蚀刻停止层的主表面间隔开。

公开(公告)号：US08314822B2

公开(公告)日：2012-11-20

申请号：US12928257

申请日：2010-12-07

Applicant: Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Toshimitsu Morooka ,  Keitaro Koroishi

Inventor： Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Toshimitsu Morooka ,  Keitaro Koroishi

IPC: B41J2/335

CPC classification number: B41J2/3351 ,  B41J2/33545

Abstract: Provided is a thermal head capable of making good contact to a thermal recording medium or the like to increase heat transfer efficiency while maintaining the number of manufacturing steps and manufacturing cost. Provided is a thermal head (1) including: a flat plate-shaped substrate main body (13); a heating resistor (15) of a substantially rectangular shape formed on a surface of the flat plate-shaped substrate main body (13); and a pair of electrodes (17A, 17B) connected to both ends of the heating resistor (15), for supplying power to the heating resistor (15), in which the pair of electrodes (17A, 17B) respectively include connecting portions (27A, 27B) having a width dimension smaller than a width dimension of the heating resistor (15), and the connecting portions (27A, 27B) are connected to the heating resistor (15) at positions shifted from each other in a width direction of the heating resistor (15).

Abstract translation: 提供了一种能够在保持制造步骤数量和制造成本的同时与热记录介质等良好接触以提高传热效率的热敏头。 提供一种热敏头（1），包括：平板状基板主体（13）; 形成在所述平板状基板主体（13）的表面上的大致矩形形状的发热电阻体（15）。 以及连接到所述加热电阻器（15）的两端的一对电极（17A，17B），用于向所述加热电阻器（15）供电，所述一对电极（17A，17B）分别包括连接部分（27A ，27B），其宽度尺寸小于所述加热电阻器（15）的宽度尺寸，并且所述连接部分（27A，27B）在所述加热电阻器（15）的宽度方向上彼此偏移的位置连接到所述加热电阻器 加热电阻（15）。

公开(公告)号：US08256099B2

公开(公告)日：2012-09-04

申请号：US12589139

申请日：2009-10-19

Applicant: Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Yoshinori Sato ,  Toshimitsu Morooka ,  Keitaro Koroishi

Inventor： Noriyoshi Shoji ,  Norimitsu Sanbongi ,  Yoshinori Sato ,  Toshimitsu Morooka ,  Keitaro Koroishi

IPC: H05B3/00

CPC classification number: H01C17/065 ,  B41J2/3359 ,  H01C1/148 ,  H01C7/003 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/49099 ,  Y10T29/49146 ,  Y10T29/49204

Abstract: The manufacturing method for a thermal head includes: forming a hollow concave portion and a marking concave portion having a depth larger than a depth of the hollow concave portion on one surface of a thin plate glass; a bonding step of bonding a supporting plate onto the one surface of the thin plate glass, in which the hollow concave portion and the marking concave portion are formed in the concave portion forming step; a thinning step of thinning the thin plate glass onto which the supporting plate is bonded in the bonding step until the marking concave portion extends through the substrate from a side of a back surface opposite to the one surface; and a heating resistor forming step of forming a heating resistor on the back surface of the thin plate glass thinned in the thinning step so as to be opposed to the hollow concave portion.

Abstract translation: 热敏头的制造方法包括：在薄板玻璃的一个表面上形成深度大于中空凹部的深度的中空凹部和标记凹部; 在所述凹部形成工序中，将形成有所述中空凹部和所述标记凹部的所述薄板玻璃的一个面上的支撑板接合的接合工序; 在接合步骤中使贴片上的薄板玻璃变薄，直到标记凹部从与该表面相反的背面的一侧延伸穿过基板的薄化步骤; 以及加热电阻体的形成工序，在所述薄化工序中，在与所述中空凹部对置的薄板玻璃的背面形成发热电阻体。

公开(公告)号：US20120212557A1

公开(公告)日：2012-08-23

申请号：US13401891

申请日：2012-02-22

Applicant: Toshimitsu MOROOKA ,  Keitaro Karoishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu MOROOKA ,  Keitaro Karoishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335 ,  H01C17/00

CPC classification number: B41J2/335 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3357 ,  B41J2/33585

Abstract: Adopted is a thermal head, including: a support substrate including a concave portion formed in a front surface thereof; an upper substrate, which is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed at a position corresponding to the concave portion; a heating resistor provided on a front surface of the upper substrate at a position straddling the convex portion; and a pair of electrodes provided on both sides of the heating resistor, in which at least one of the pair of electrodes include: a thin portion, which is connected to the heating resistor at a distal end surface of the convex portion in a region corresponding to the concave portion; and a thick portion, which is connected to the heating resistor and is formed thicker than the thin portion.

Abstract translation: 采用热敏头，包括：支撑基板，其包括形成在其前表面中的凹部; 上层基板，其以叠层状态接合到所述支撑基板的前表面，并且包括形成在与所述凹部对应的位置的凸部; 加热电阻器，其设置在跨越所述凸部的位置的所述上基板的前表面上; 以及一对电极，其设置在所述加热电阻器的两侧，所述一对电极中的至少一个包括：薄部，其在对应于所述凸起部的区域的所述凸部的远端表面处连接到所述加热电阻器 到凹部; 以及连接到加热电阻器并且形成为比薄部分厚的厚部分。

公开(公告)号：US20120144659A1

公开(公告)日：2012-06-14

申请号：US13397900

申请日：2012-02-16

Applicant: Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Noriyoshi SHOJI ,  Yoshinori SATO ,  Norimitsu SANBONGI

Inventor： Keitaro KOROISHI ,  Toshimitsu MOROOKA ,  Noriyoshi SHOJI ,  Yoshinori SATO ,  Norimitsu SANBONGI

IPC: H01C17/00

CPC classification number: H05B3/16 ,  B41J2/3357 ,  B41J2/33585 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49401 ,  Y10T29/49826

Abstract: A manufacturing method for a heating resistor element includes a concave portion forming step, a bonding step and a resistor forming step. The concave portion forming step includes forming a concave portion on at least one of bonded surfaces between an insulating substrate and a heat accumulating layer. The bonding step causes the bonded surfaces between the insulating substrate and the heat accumulating layer to adhere to each other to bond the insulating substrate and the heat accumulating layer. The resistor forming step includes forming a heating resistor at a position on the heat accumulating layer. The position is opposed to the concave portion. The concave portion forming step further includes processing an inner surface of the concave portion on a side of the insulating substrate to have surface roughness Ra of 0.2 μm or more.

Abstract translation: 一种加热电阻元件的制造方法包括凹部形成步骤，接合步骤和电阻器形成步骤。 凹部形成工序包括在绝缘基板和蓄热层的至少一个接合面上形成凹部。 接合步骤使得绝缘基板和蓄热层之间的接合表面彼此粘附以将绝缘基板和蓄热层结合。 电阻器形成步骤包括在蓄热层的位置形成发热电阻体。 位置与凹部相对。 所述凹部形成工序还包括对所述绝缘基板侧的所述凹部的内表面进行处理，使表面粗糙度Ra为0.2μm以上。

公开(公告)号：US20120050447A1

公开(公告)日：2012-03-01

申请号：US13136005

申请日：2011-07-20

Applicant: Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335 ,  H05K13/00

CPC classification number: B41J2/33585 ,  B41J2/3351 ,  B41J2/3354 ,  Y10T29/49002

Abstract: A thermal head includes a substrate main body having a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state. A heating resistor is formed on a surface of the upper substrate, and a pair of electrodes connected to both ends of the heating resistor, respectively, for supplying power to the heating resistor. The substrate main body includes a cavity portion in a region opposed to the heating resistor at a bonding portion between the support substrate and the upper substrate, and at least one of the electrodes includes a thin portion in a region opposed to the cavity portion, the thin portion being thinner than other regions of the electrodes.

Abstract translation: 热敏头包括具有平板状支撑基板和平板状上基板的基板主体，其以堆叠状态彼此接合。 在上基板的表面上分别形成有加热电阻体，以及分别与加热电阻体的两端连接的一对电极，用于向加热电阻体供电。 基板主体在支撑基板和上基板之间的接合部分处具有与加热电阻体相对的区域中的空腔部分，并且至少一个电极包括与空腔部分相对的区域中的薄部分， 薄部分比电极的其它区域薄。

公开(公告)号：US20110149008A1

公开(公告)日：2011-06-23

申请号：US12928260

申请日：2010-12-07

Applicant: Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Keitaro Koroishi ,  Toshimitsu Morooka ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335 ,  H05B1/00

CPC classification number: B41J2/33545 ,  B41J2/33585

Abstract: Provided is a thermal head capable of enhancing heat-insulating performance while maintaining mechanical strength of an upper substrate. A thermal head (1) includes: a substrate main body (13) including a flat plate-shaped support substrate and a flat plate-shaped upper substrate which are bonded to each other in a stacked state; and a rectangular heating resistor (15) formed on a surface of the flat plate-shaped upper substrate, in which: a bonding surface of the flat plate-shaped support substrate includes a concave portion (23) that forms a cavity portion (27) in a region opposed to the rectangular heating resistor (15); and the concave portion (23) includes a groove (25) formed in an inner wall thereof and recessed along a depth direction of the concave portion (23) within a range of a width of the rectangular heating resistor (15).

Abstract translation: 提供一种能够在保持上基板的机械强度的同时提高绝热性能的热敏头。 热敏头（1）包括：基板主体（13），其包括以堆叠状态彼此接合的平板状支撑基板和平板状上基板; 以及形成在所述平板状上基板的表面上的矩形发热电阻体（15），其中：所述平板状支撑基板的接合面包括形成空腔部（27）的凹部（23） 在与矩形发热电阻器（15）相对的区域中; 并且所述凹部（23）在所述矩形发热电阻体（15）的宽度的范围内，具有形成在所述凹部（23）的深度方向的内壁的凹部（25）。

公开(公告)号：US20110074902A1

公开(公告)日：2011-03-31

申请号：US12586990

申请日：2009-09-30

Applicant: Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Koroishi ,  Yoshinori Sato ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J25/304 ,  H05B3/02

CPC classification number: B41J2/33535 ,  B41J2/3355 ,  B41J2/33585 ,  B41J25/312

Abstract: To achieve improvements in heat generation efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3); a heat accumulating (5) bonded onto a surface of the supporting substrate (3); and a heating resistor (7) provided on the heat storage layer (5), wherein: a concave portion (2) is provided in a region, which is opposed to the heating resistor (7), of at least one of the surface of the supporting substrate (3) and a surface on a side of the supporting substrate (3) of the heat accumulating portion (5); and a center line of a hollow heat insulating layer (4) formed, by the concave portion (2), between the supporting substrate (3) and the heat storage layer (5) is shifted with respect to a center line (X) of the heating resistor (7).

Abstract translation: 为了实现对外部负载的发热效率和强度的提高，提供了一种热敏头（1），包括：支撑衬底（3）; 在所述支撑基板（3）的表面上结合的蓄热体（5）; 以及设置在所述蓄热层（5）上的加热电阻体（7），其特征在于，在与所述加热电阻体（7）相对的区域中设置有凹部（2），所述凹部 所述支撑基板（3）和所述蓄热部（5）的所述支撑基板（3）的一侧的表面。 并且由所述凹部（2）在所述支撑基板（3）和所述蓄热层（5）之间形成的中空绝热层（4）的中心线相对于所述支撑基板（3）和所述蓄热层（5）的中心线 加热电阻器（7）。

公开(公告)号：US20110063396A1

公开(公告)日：2011-03-17

申请号：US12807854

申请日：2010-09-15

Applicant: Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

Inventor： Toshimitsu Morooka ,  Keitaro Koroishi ,  Noriyoshi Shoji ,  Norimitsu Sanbongi

IPC: B41J2/335

CPC classification number: B41J2/3355 ,  B41J2/33585

Abstract: Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).

Abstract translation: 提供一种热敏头，其在对应于加热电阻器的位置处具有空腔部分，并且能够在确保空腔部分的强度的同时提高热效率，以及包括热敏头的打印机。 热敏头（1）包括：在其表面包括凹部（2）的支撑基板（3） 将上层基板（5）以堆叠状态接合到所述支撑基板（3）的表面; 以及设置在上基板（5）的表面的与凹部（2）对应的位置处的加热电阻器（7），其中，所述上基板的背面的至少一个区域的中心线平均粗糙度 上基板（5）被设定为小于5nm，该区域与凹部（2）相对。