公开(公告)号：US09208937B2

公开(公告)日：2015-12-08

申请号：US13331786

申请日：2011-12-20

申请人： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

发明人： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh ,  Yu-Ching Kuo

IPC分类号： H01F27/02 ,  H01F27/06 ,  H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F27/255 ,  H01F17/04

CPC分类号： H01F27/255 ,  H01F17/045 ,  H01F2017/048

摘要： A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.

摘要翻译： 扼流圈包括完全由相同材料制成的单片式芯片，单片式芯片具有两块板和位于两块板之间的支柱，一个绕组空间位于两块板和支柱之间，其中支柱具有 沿着与柱的轴向基本垂直的方向的非圆形和非矩形横截面，柱的横截面具有在柱的横截面的中心彼此相交的第一轴和第二轴 并且基本上彼此垂直，所述第一轴线比所述第二轴线长，并且所述支柱的横截面与所述第一轴线和所述第二轴线基本对称。

公开(公告)号：US08339229B2

公开(公告)日：2012-12-25

申请号：US13176763

申请日：2011-07-06

申请人： Tsung-Chan Wu

发明人： Tsung-Chan Wu

IPC分类号： H01F27/29

CPC分类号： H05K7/026 ,  H01F3/08 ,  H01F5/00 ,  H01F17/043 ,  H01F27/02 ,  H01F27/24 ,  H01F27/2828 ,  H01F27/29 ,  H01F27/292 ,  H01F37/00 ,  H05K1/18

摘要： An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height.

摘要翻译： 电感器包括第一芯，导线，第二芯和第一引线框架。 在第一芯体的第一侧上形成有容纳空间，在第一芯体的第二侧形成有凹部，其中第一面与第二面相反。 第一个核心有一个高度。 导线布置在容纳空间中。 第二芯设置在第一芯的第一侧上并覆盖容纳空间。 第一引线框架具有嵌入在凹部中的嵌入部分。 嵌入部分具有第二高度。 在嵌入部分嵌入第一芯部的凹部中之后，嵌入部分和第一芯部的总高度小于第一高度和第二高度之和。

公开(公告)号：US20120205778A1

公开(公告)日：2012-08-16

申请号：US13111383

申请日：2011-05-19

申请人： Yuan-Tai LAI ,  Jeng-Gong DUH ,  Yu-Huei LEE ,  Ke-Horng CHEN ,  Kang SHENG ,  Tsung-Chan WU

发明人： Yuan-Tai LAI ,  Jeng-Gong DUH ,  Yu-Huei LEE ,  Ke-Horng CHEN ,  Kang SHENG ,  Tsung-Chan WU

IPC分类号： H01L29/02 ,  H01L21/50

CPC分类号： H01L23/5227 ,  H01L23/481 ,  H01L23/64 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/05147

摘要： The present invention relates to a package structure and method for manufacturing the same. The package structure can minimize the area of the circuit board used for packaging, by stacking a passive element directly on a chip. The disclosed package structure comprises: a circuit board having a first surface, where a plurality of first connecting pads being disposed thereon; a chip unit having an active surface, a non-active surface and a plurality of conductive vias, while a plurality of second connecting pads and a plurality of electric pads being disposed on the active surface, and a plurality of third connecting pads being disposed on the non-active surface; a plurality of solder balls electrically connected with the first connecting pads and the second connecting pads; and a passive element being electrically connected with the third connecting pads. The passive element and the chip unit both electrically connect to the chip unit.

摘要翻译： 本发明涉及一种封装结构及其制造方法。 通过将无源元件直接堆叠在芯片上，封装结构可以最小化用于封装的电路板的面积。 所公开的封装结构包括：具有第一表面的电路板，其上布置有多个第一连接焊盘; 具有活性表面的芯片单元，非活性表面和多个导电通孔，而多个第二连接焊盘和多个电焊盘设置在有源表面上，并且多个第三连接焊盘设置在 非活性表面; 与所述第一连接焊盘和所述第二连接焊盘电连接的多个焊料球; 以及与第三连接焊盘电连接的无源元件。 无源元件和芯片单元都电连接到芯片单元。

公开(公告)号：US20100219924A1

公开(公告)日：2010-09-02

申请号：US12709912

申请日：2010-02-22

申请人： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh

发明人： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh

IPC分类号： H01F27/02

CPC分类号： H01F17/045 ,  H01F2017/048

摘要： An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.

摘要翻译： 提供了包括芯，至少线和磁性材料的电子设备。 核心包括柱子，顶板和底板。 支柱设置在顶板和底板之间。 顶板的面积小于底板的面积。 在顶板，底板和支柱之间蜿蜒的空间。 电线缠绕在支柱上并位于绕组空间中。 磁性材料填充绕组空间以封装电线。 磁性材料包括树脂和金属粉末，其中磁粉的平均粒径小于20μm。

公开(公告)号：US20110048797A1

公开(公告)日：2011-03-03

申请号：US12860237

申请日：2010-08-20

申请人： Yi-Min Huang ,  Tsung-Chan Wu

发明人： Yi-Min Huang ,  Tsung-Chan Wu

IPC分类号： H01L23/49

CPC分类号： H05K1/181 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K2201/09781 ,  H05K2201/10568 ,  Y02P70/611 ,  H01L2924/00

摘要： A surface mounted electronic component is provided. The surface mounted electronic component includes a main body, a circuit element, a conductive electrode, and a virtual electrode. The circuit element is arranged in the main body. The conductive electrode is disposed on an outer surface of the main body, wherein the conductive electrode electrically is connected to the circuit element. The virtual electrode is disposed on the outer surface of the main body, wherein the virtual electrode lies near the conductive electrode. There is a distance between the virtual electrode and the conductive electrode.

摘要翻译： 提供了表面安装的电子部件。 表面安装的电子部件包括主体，电路元件，导电电极和虚拟电极。 电路元件布置在主体中。 导电电极设置在主体的外表面上，其中导电电极电连接到电路元件。 虚拟电极设置在主体的外表面上，虚拟电极位于导电电极附近。 虚拟电极和导电电极之间存在距离。