摘要:
A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.
摘要:
A variable coupled inductor includes a first core, two conducting wires, a second core and a magnetic structure. The first core includes two first protruding portions, a second protruding portion and two grooves, wherein the second protruding portion is located between the two first protruding portions and each of the grooves is located between one of the first protruding portions and the second protruding portion. Each of the conducting wires is disposed in one of the grooves. The second core is disposed on the first core. A first gap is formed between each of the first protruding portions and the second core and a second gap is formed between the second protruding portion and the second core. The magnetic structure is disposed between the second protruding portion and the second core and distributed symmetrically with respect to a centerline of the second protruding portion.
摘要:
A surface mounted electronic component is provided. The surface mounted electronic component includes a main body, a circuit element, a conductive electrode, and a virtual electrode. The circuit element is arranged in the main body. The conductive electrode is disposed on an outer surface of the main body, wherein the conductive electrode electrically is connected to the circuit element. The virtual electrode is disposed on the outer surface of the main body, wherein the virtual electrode lies near the conductive electrode. There is a distance between the virtual electrode and the conductive electrode.
摘要:
A method for adjusting the inductance of a choke is provided by the present invention. The method includes with an unchanged structure and unchanged dimensions of the core of the choke, changing the kind of the magnetic materials composing the cores so as to adjust the magnetic permeability of the magnetic material. In addition, the present invention also provides a method for designing a choke, the method includes determining the structure of a first choke and a second choke, determining the dimensions of the cores of the chokes, and selecting magnetic materials composing the cores.
摘要:
An inductor includes a first core, a conducting wire, a second core and a first lead frame. There is an accommodating space formed on a first side of the first core and there is a recess portion formed on a second side of the first core, wherein the first side is opposite to the second side. The first core has a first height. The conducting wire is disposed in the accommodating space. The second core is disposed on the first side of the first core and covers the accommodating space. The first lead frame has an embedded portion embedded in the recess portion. The embedded portion has a second height. After embedding the embedded portion in the recess portion of the first core, a total height of the embedded portion and the first core is smaller than the sum of the first height and the second height.
摘要:
An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.
摘要:
A choke coil including a drum-core and at least one wire is provided. The drum-core includes a pillar, a first board and a second board. Two ends of the pillar are respectively connected to the first board and the second board. A material of the drum-core includes ferrous alloy. The wire has a winding portion wrapped around the pillar.
摘要:
A method for making an electronic package structure is provided which comprises: providing a substrate; providing an inductor module; assembling the inductor module and the substrate so that they define a space; injecting package glue into the space defined by the inductor module and the substrate so as to form a package layer.
摘要:
A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
摘要:
A method for making an electronic package structure is provided which comprises: providing a substrate; providing an inductor module; assembling the inductor module and the substrate so that they define a space; injecting package glue into the space defined by the inductor module and the substrate so as to form a package layer.