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公开(公告)号：US20080227302A1
公开(公告)日：2008-09-18
申请号：US11685029
申请日：2007-03-12
IPC分类号： H01L21/31
CPC分类号： H01L23/3121 , H01L23/295 , H01L23/3135 , H01L23/585 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49109 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： an integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at least a portion embedded in the bond coat layer. Moreover, the top coat layer includes a fibrous interface configured to provide security and strengthen the bond coat layer.
摘要翻译： 提供了具有纤维界面的集成电路（IC）封装。 该包装包括基材，粘合涂层和顶涂层。 基板被配置为包含IC部件和连接。 接合涂层被配置为封装IC部件。 顶涂层具有至少一部分嵌入粘合涂层中的部分。 此外，顶涂层包括被配置为提供安全性并加强粘合涂层的纤维界面。
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公开(公告)号：US20080129501A1
公开(公告)日：2008-06-05
申请号：US11565376
申请日：2006-11-30
IPC分类号： G08B13/00
CPC分类号： G08B13/128 , G06F21/86 , G06F2221/2143 , G08B13/06
摘要： A secure chassis comprises a plurality of walls, wherein each wall comprises an inner portion; an outer portion; and a tamper sensor disposed between the inner portion and the outer portion of each wall, the tamper sensor configured to detect unauthorized tamper events; wherein the plurality of walls are coupled together to form an enclosure to house one or more components.
摘要翻译： 安全底盘包括多个壁，其中每个壁包括内部部分; 外部; 以及设置在每个壁的内部和外部之间的篡改传感器，所述篡改传感器被配置为检测未经授权的篡改事件; 其中所述多个壁联接在一起以形成容纳一个或多个部件的外壳。
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公开(公告)号：US07189335B1
公开(公告)日：2007-03-13
申请号：US11280033
申请日：2005-11-16
CPC分类号： H01L21/4817 , C23C4/185 , H01L23/552 , H01L2924/16152
摘要： Stand-alone conformal coverings for electronic devices and methods of making and using such coverings.
摘要翻译： 用于电子设备的独立适形覆盖物和制造和使用这种覆盖物的方法。
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公开(公告)号：US5302265A
公开(公告)日：1994-04-12
申请号：US637718
申请日：1991-01-07
CPC分类号： C25D13/02
摘要： A method is taught for the electrophoretic deposition of metal oxide coatings upon a conductive fiber core.
摘要翻译： 教导了一种在导电纤维芯上电泳沉积金属氧化物涂层的方法。
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公开(公告)号：US07961885B2
公开(公告)日：2011-06-14
申请号：US11266792
申请日：2005-11-04
CPC分类号： G06F11/267 , G01R31/31705 , G01R31/318555 , G06F11/221 , G06F11/3656 , G06F21/55 , G06F21/85 , G06F2221/2151 , H04L9/065 , H04L9/0897
摘要： In one embodiment, a system comprises JTAG functionality that implements at least a portion of a JTAG protocol. The JTAG functionality supports a test data in (TDI) line, a test data out (TDO) line, a test rest (TR) line, a test mode state (TMS) line, and a test clock (TCLK) line. The system further comprises a debug interface to communicatively couple the system to a debug device external to the system. The debug interface comprises a transmit (TX) line, receive (RX) line, and a clock (CLK) line. The system transmits data output by the JTAG functionality on the TDI input on the RX line of the debug interface and receives data from the debug device on the TX line of the debug interface and provides the received data to the JTAG functionality on the TDO line, TR line and the TMS line.
摘要翻译： 在一个实施例中，系统包括实现JTAG协议的至少一部分的JTAG功能。 JTAG功能支持（TDI）线，测试数据输出（TDO）线，测试休息（TR）线，测试模式状态（TMS）线和测试时钟（TCLK）线）中的测试数据。 系统还包括调试接口，用于将系统通信地耦合到系统外部的调试设备。 调试接口包括发送（TX）线，接收（RX）线和时钟（CLK）线。 系统通过调试接口的RX线上的TDI输入发送JTAG功能输出的数据，并从调试接口的TX线上的调试设备接收数据，并将接收到的数据提供给TDO线上的JTAG功能， TR线和TMS线。
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公开(公告)号：US07509250B2
公开(公告)日：2009-03-24
申请号：US11266889
申请日：2005-11-04
IPC分类号： G06F9/455
CPC分类号： G01R31/318555 , H04L9/065
摘要： In one embodiment, a system comprises debug functionality, a debug interface communicatively coupled to the debug functionality, and a hardware key interface. Communication with the debug functionality over the debug interface is not permitted if an authorized hardware key is not communicatively coupled to the hardware key interface.
摘要翻译： 在一个实施例中，系统包括调试功能，通信地耦合到调试功能的调试接口和硬件密钥接口。 如果授权的硬件密钥不通信耦合到硬件密钥接口，则不允许通过调试接口与调试功能进行通信。
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公开(公告)号：US5306560A
公开(公告)日：1994-04-26
申请号：US637849
申请日：1991-01-07
CPC分类号： C04B35/62852 , C04B35/62847 , C04B35/62897 , C04B35/82 , C25D1/14 , C25D13/02 , C25D13/16 , H01B3/12 , C04B2235/3217 , C04B2235/3225 , C04B2235/3241 , C04B2235/3891 , C04B2235/441 , C04B2235/5216 , C04B2235/524 , C04B2235/5244 , C04B2235/5248 , Y10T428/294
摘要： Ceramic coated fibers may be produced by the electrophoretic deposition of metal oxide coatings on a conductive fiber core.
摘要翻译： 陶瓷涂层纤维可以通过在导电纤维芯上电泳沉积金属氧化物涂层来制备。
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公开(公告)号：US5302319A
公开(公告)日：1994-04-12
申请号：US637717
申请日：1991-01-07
CPC分类号： C04B35/6264 , C01B13/32 , C01F17/0025 , C04B35/62847 , C04B35/62852 , C04B35/62897 , C07F5/069 , D01F11/14 , D01F11/16 , C04B2235/3217 , C04B2235/3225 , C04B2235/3241 , C04B2235/441
摘要： A method is taught for the preparation of metal oxide sols particularly suited for the electrophoretic deposition of metal oxide coatings upon a fiber core.
摘要翻译： 教导了一种用于制备金属氧化物溶胶的方法，其特别适用于金属氧化物涂层在纤维芯上的电泳沉积。
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19.发明授权Deposition of ceramic coatings using sol-gel processing with application of a thermal gradient 失效使用溶胶 - 凝胶加工沉积陶瓷涂层并应用热梯度
公开(公告)号：US4921731A
公开(公告)日：1990-05-01
申请号：US45786
申请日：1987-04-28
CPC分类号： C04B41/87 , C03C17/23 , C03C25/107 , C04B41/009 , C04B41/5025 , C23C18/1208 , C23C18/1225 , C23C18/1254 , C23C18/1291 , C03C2217/21 , C03C2218/113
摘要： A method of ceramic coating a substrate by thermodeposition from a sol made by hydrolyzing and peptizing organometallic compounds in water. The sol contains colloidal particles having a size between about 0.0005 micron and about 10 microns and the deposited coatings have good packing characteristics as well as smoothness. Composite coatings are also deposited which contain reinforcing materials such as SiC embedded in the coated matrix. These coatings afford the substrate onto which they are coated excellent wear, anti-corrosion and insulating characteristics.
摘要翻译： 一种陶瓷涂覆方法，该方法是通过在水中水解和胶溶有机金属化合物制成的溶胶热沉积而沉积。 该溶胶含有尺寸在约0.0005微米至约10微米之间的胶体颗粒，并且沉积的涂层具有良好的填充特性以及平滑度。 还沉积复合涂层，其包含加强材料，例如嵌入涂覆基质中的SiC。 这些涂层为涂层提供了优异的耐磨性，耐腐蚀性和绝缘特性。
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公开(公告)号：US09007182B2
公开(公告)日：2015-04-14
申请号：US13397020
申请日：2012-02-15
CPC分类号： G06F21/86 , G06F21/57 , G06F21/73 , G06K19/07 , G06K19/073 , G06K19/07372 , H05K5/0208
摘要： A package includes a chassis, a plurality of components arranged within the chassis, a plurality of RFID devices, and at least one processing device. The RFID devices are arranged at a plurality of locations to form an array configured to authenticate compliance of the actual configuration of the package with a model configuration. The processing device is configured to communicate with the RFID devices, determine if the actual configuration of the package is in compliance with the model configuration based on communications with the RFID devices, and set an operational mode of one or more of the components of the package in response to determining if the actual configuration of the package is in compliance with the model configuration.
摘要翻译： 一种包装包括底盘，布置在底盘内的多个部件，多个RFID装置以及至少一个处理装置。 RFID设备被布置在多个位置处以形成被配置为使用模型配置来认证包的实际配置的一致性的阵列。 处理装置被配置为与RFID装置通信，基于与RFID装置的通信来确定包装的实际配置是否符合模型配置，并且设置包装的一个或多个部件的操作模式 响应于确定包的实际配置是否符合模型配置。
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