公开(公告)号：US20210246017A1

公开(公告)日：2021-08-12

申请号：US17244469

申请日：2021-04-29

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L41/23 ,  H01L41/053

摘要： An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20210198100A1

公开(公告)日：2021-07-01

申请号：US17201661

申请日：2021-03-15

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L41/23 ,  H01L41/053

摘要： An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20210135648A1

公开(公告)日：2021-05-06

申请号：US16669499

申请日：2019-10-30

申请人： X-Celeprint Limited

发明人： António José Marques Trindade ,  Lei Liu ,  Ronald S. Cok

IPC分类号： H03H9/02 ,  H03H3/02

摘要： A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.

公开(公告)号：US20210061645A1

公开(公告)日：2021-03-04

申请号：US17098241

申请日：2020-11-13

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC分类号： B81B7/00 ,  H01L41/23 ,  B81C1/00 ,  H01L41/053

摘要： An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US20210002128A1

公开(公告)日：2021-01-07

申请号：US17027671

申请日：2020-09-21

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  Raja Fazan Gul ,  António José Marques Trindade

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L41/053 ,  H01L41/23

摘要： An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US10804880B2

公开(公告)日：2020-10-13

申请号：US16207804

申请日：2018-12-03

申请人： X-Celeprint Limited

发明人： Ronald S. Cok

IPC分类号： H03H9/64 ,  H03H9/54 ,  H03H9/05

摘要： A device structure comprises an acoustic wave transducer comprising a component. The component comprises a piezo-electric material. Component electrodes are disposed on the component and connection posts extend away from the component. Each of the connection posts is electrically connected to one of the component electrodes. The component has a center and a length greater than a width and, for at least one pair of the connection posts, a distance between the connection posts and the center is less than one quarter of the length.

公开(公告)号：US10748793B1

公开(公告)日：2020-08-18

申请号：US16274969

申请日：2019-02-13

申请人： X-Celeprint Limited

发明人： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC分类号： H01L21/67 ,  H01L25/075 ,  B65G47/90 ,  B41F16/00 ,  H01L33/62

摘要： A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200258761A1

公开(公告)日：2020-08-13

申请号：US16274969

申请日：2019-02-13

申请人： X-Celeprint Limited

发明人： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC分类号： H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

摘要： A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200176286A1

公开(公告)日：2020-06-04

申请号：US16207738

申请日：2018-12-03

申请人： X-Celeprint Limited

发明人： Robert R. Rotzoll ,  António José Marques Trindade ,  Raja Fazan Gul ,  Alexandre Chikhaoui ,  David Gomez ,  Ronald S. Cok

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/04 ,  H01L41/313 ,  H01L41/311 ,  H01L41/047 ,  H01L41/053 ,  H03H9/05 ,  B41F16/00 ,  B65G47/90

摘要： A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

公开(公告)号：US20200176285A1

公开(公告)日：2020-06-04

申请号：US16207690

申请日：2018-12-03

申请人： X-Celeprint Limited

发明人： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC分类号： H01L21/67 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/053 ,  H01L23/10 ,  H01L41/053 ,  H01L41/047 ,  H01L41/25 ,  H01L21/683

摘要： A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.