公开(公告)号：US10748793B1

公开(公告)日：2020-08-18

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90 ,  B41F16/00 ,  H01L33/62

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200258761A1

公开(公告)日：2020-08-13

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200176285A1

公开(公告)日：2020-06-04

申请号：US16207690

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/053 ,  H01L23/10 ,  H01L41/053 ,  H01L41/047 ,  H01L41/25 ,  H01L21/683

Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.

公开(公告)号：US10573544B1

公开(公告)日：2020-02-25

申请号：US16163559

申请日：2018-10-17

Applicant: X-Celeprint Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Alexander Meitl

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/66 ,  H01L21/683 ,  H01L25/075

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

公开(公告)号：US20200052176A1

公开(公告)日：2020-02-13

申请号：US16660776

申请日：2019-10-22

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, JR.

IPC: H01L33/62 ,  H01L33/48

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

公开(公告)号：US20200020676A1

公开(公告)日：2020-01-16

申请号：US16033159

申请日：2018-07-11

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower

IPC: H01L25/16 ,  G09G3/3225

Abstract: An exemplary active-matrix display comprises pixels disposed in a pixel array and pixel micro-controllers disposed in a controller array on a display substrate. Each of the pixels comprises micro-light-emitting elements that emit different color light. Each of the pixel micro-controllers is electrically connected to control the micro-light-emitting elements in each of two or more adjacent pixels in the pixel array. A spatial separation between pixels is greater than a spatial separation between the micro-light-emitting elements and is greater than a size of each of the micro-light-emitting elements. The micro-light-emitting elements in each of the pixels are disposed in a common pixel direction orthogonal to a pixel micro-controller center line an element distance substantially equal to or greater than one quarter of the extent of the pixel micro-controller in the common pixel direction from the center line. The pixel direction for each pixel controlled by a common pixel micro-controller is different.

公开(公告)号：US20190267363A1

公开(公告)日：2019-08-29

申请号：US15908336

申请日：2018-02-28

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Brook Raymond ,  Erich Radauscher

IPC: H01L25/16 ,  G02B27/01 ,  H01L33/62 ,  H01L25/075

Abstract: A transparent display comprises a display substrate having a display area and a bezel area adjacent to each of at least one corresponding side of the display area. The display substrate is at least partially transparent. Light-controlling elements are disposed in, on, or over the display substrate in the display area. Display wires are disposed in, on, or over the display substrate in the display area. The display wires are electrically connected to the light-controlling elements. Bezel wires are disposed in, on, or over the display substrate in the bezel area, the bezel wires electrically connected to respective ones of the display wires. A bezel transparency in the bezel area is greater than or equal to a display transparency in the display area.

公开(公告)号：US10332868B2

公开(公告)日：2019-06-25

申请号：US15876949

申请日：2018-01-22

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Brook Raymond ,  Christopher Andrew Bower

IPC: H01L27/16 ,  H01L27/07 ,  H01L27/13 ,  H01L33/00 ,  H01L33/62 ,  H01L25/16 ,  H01L25/075 ,  H01L25/13 ,  G09G3/32 ,  G09G3/20

Abstract: A micro-transfer printed high-resolution inorganic light-emitting diode (iLED) display includes a display substrate and a plurality of pixels disposed over the display substrate, each pixel including a pixel controller disposed or formed in or on a pixel substrate and controlling one or more iLEDs disposed or formed in or on respective iLED substrates. The one or more iLEDs are disposed above or below the pixel controller in a separate layer from the pixel controller. The display substrate, the iLED substrate(s), and the pixel substrate are all separate, independent and distinct, and the one or more iLEDs and pixel controller are each separate devices.

公开(公告)号：US20190143737A1

公开(公告)日：2019-05-16

申请号：US16186441

申请日：2018-11-09

Applicant: X-Celeprint Limited

Inventor： Mark Willner ,  Ronald S. Cok ,  Robert R. Rotzoll ,  Christopher Andrew Bower

IPC: B42D25/36 ,  H01L25/16 ,  F21V23/00 ,  F21V8/00 ,  B42D25/29 ,  B42D25/355

Abstract: A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

公开(公告)号：US10199546B2

公开(公告)日：2019-02-05

申请号：US15663437

申请日：2017-07-28

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Christopher Andrew Bower ,  Robert R. Rotzoll ,  Mark Willner

IPC: H01L33/50 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L23/00

Abstract: A micro-transfer color-filter device comprises a color filter, an electrical conductor disposed in contact with the color filter, and at least a portion of a color-filter tether attached to the color filter or structures formed in contact with the color filter. In certain embodiments, a color filter is a variable color filter electrically controlled through one or more electrodes and can be responsive to heat, electrical current, or an electrical field to modify its optical properties, such as color, transparency, absorption, or reflection. In certain embodiments, A color-filter device includes connection posts and can be provided in or on a source wafer suitable for micro-transfer printing. In some embodiments, a color-filter device is disposed on a device substrate and can include a control circuit for controlling the color filter. An array of micro-transfer color-filter devices can be disposed on a display substrate in order to form a display.