公开(公告)号：US20200177149A1

公开(公告)日：2020-06-04

申请号：US16207774

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Raja Fazan Gul ,  Robert R. Rotzoll ,  Alexandre Chikhaoui ,  David Gomez ,  Ronald S. Cok

IPC: H03H3/08 ,  H03H3/02 ,  H03H9/64 ,  H03H9/05 ,  H03H9/54

Abstract: A method of making a micro-module structure comprises providing a substrate, the substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

公开(公告)号：US20200176286A1

公开(公告)日：2020-06-04

申请号：US16207738

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： Robert R. Rotzoll ,  António José Marques Trindade ,  Raja Fazan Gul ,  Alexandre Chikhaoui ,  David Gomez ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/04 ,  H01L41/313 ,  H01L41/311 ,  H01L41/047 ,  H01L41/053 ,  H03H9/05 ,  B41F16/00 ,  B65G47/90

Abstract: A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

公开(公告)号：US20230261149A1

公开(公告)日：2023-08-17

申请号：US17672396

申请日：2022-02-15

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Alexandre Chikhaoui ,  Ronald S. Cok ,  Robert R. Rotzoll ,  Raja Fazan Gul ,  Lei Liu

IPC: H01L33/48 ,  H01L25/075

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L2933/0033

Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.

公开(公告)号：US12237443B2

公开(公告)日：2025-02-25

申请号：US17672396

申请日：2022-02-15

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Alexandre Chikhaoui ,  Ronald S. Cok ,  Robert R. Rotzoll ,  Raja Fazan Gul ,  Lei Liu

IPC: H01L33/48 ,  H01L25/075

Abstract: A micro-device structure includes an insulating layer and a micro-device disposed on the insulating layer. A pocket is formed in the micro-device that extends from a surface of the micro-device opposite the insulating layer through the micro-device to the insulating layer. A micro-component is disposed in the pocket and is non-native to the micro-device and the insulating layer. The micro-component can emit or receive light through the insulating layer and can be connected to and controlled by a micro-circuit disposed in the micro-device.

公开(公告)号：US20230363092A1

公开(公告)日：2023-11-09

申请号：US18143879

申请日：2023-05-05

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Alexandre Chikhaoui ,  Ronald S. Cok

IPC: H05K1/14 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/145 ,  H05K3/306 ,  H05K1/189 ,  H05K1/113 ,  H05K2201/10106

Abstract: A flexible electronic structure includes a flexible substrate comprising an electrically conductive top substrate layer and an opposing electrically conductive bottom substrate layer and a component. The component can include a component substrate non-native to the flexible substrate having a component substrate top side and an opposing component substrate bottom side, a planar component top electrode disposed on the component substrate top side and electrically connected to the electrically conductive top substrate layer thereby defining a planar electrical contact, and a planar component bottom electrode disposed on the component substrate bottom side and electrically connected to the electrically conductive bottom substrate layer thereby defining a planar electrical contact. The component can be disposed between the electrically conductive top substrate layer and the electrically conductive bottom substrate layer.

公开(公告)号：US20200176671A1

公开(公告)日：2020-06-04

申请号：US16297427

申请日：2019-03-08

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  António José Marques Trindade ,  Raja Fazan Gul ,  Robert R. Rotzoll ,  Alexandre Chikhaoui

IPC: H01L41/313 ,  H03H3/02 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/54 ,  H03H9/64 ,  H03H9/17 ,  H03H9/25 ,  H01L41/047 ,  H01L41/29 ,  H01L41/053 ,  H01L41/23 ,  B41F16/00 ,  B65G47/90

Abstract: A cavity structure comprises a cavity substrate comprising a substrate surface, one or more cavity walls extending from the substrate surface, a cap disposed on the one or more cavity walls, and at least a portion of a module tether physically attached to the cavity substrate. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume, for example enclosing a vacuum, air, an added gas, or a liquid. The cavity structure can be a micro-transfer printable structure provided on a cavity structure source wafer. A plurality of cavity structures can be disposed on a destination substrate, for example by transfer printing, dry contact printing, or micro-transfer printing.