Single port memory with multiple memory operations per clock cycle

    公开(公告)号:US12190994B2

    公开(公告)日:2025-01-07

    申请号:US18090574

    申请日:2022-12-29

    Applicant: XILINX, INC.

    Abstract: An integrated circuitry (IC) device for a memory device includes driver circuitry, selection circuitry, clock generation circuitry, and self-time path circuitry. The driver circuitry generates a plurality of driver circuitry outputs. The selection circuitry selects one of the plurality of driver circuitry outputs based on a plurality of enable signals. The clock generation circuitry receives the selected one of the plurality of driver circuitry outputs from the selection circuitry, and generates a clock signal based on at least the selected one of the plurality of driver circuitry outputs from the selection circuitry. The self-time path circuitry of a memory receives the clock signal and generates a reset signal based on the clock signal. The plurality of driver circuitry outputs and the clock signal are based on the reset signal, and the self-time path circuitry corresponds to one or more columns of a memory bank.

    Method and apparatus for eliminating inter-link skew in high-speed serial data communications

    公开(公告)号:US12190077B2

    公开(公告)日:2025-01-07

    申请号:US17993464

    申请日:2022-11-23

    Applicant: XILINX, INC.

    Abstract: A communication system includes link circuits that receive serial data over one or more input serial links. The link circuits include a primary link circuit and a secondary link circuit. The secondary link circuit includes a de-serializer circuit configured to receive the serial data from the one or more input serial links and convert the serial data into parallel data, and an aligner circuit comprising a memory. The aligner circuit stops at least one of storing the parallel data in the memory and reading the memory based on a channel bonding signal generated based on a channel bonding symbol within the serial data. The aligner circuit outputs the channel bonding signal to a finite state machine (FSM) circuit of the primary link circuit. The aligner circuit outputs the parallel data based on receiving a read signal from the FSM circuit of the primary link circuit.

    HIGH-BANDWIDTH THREE-DIMENSIONAL (3D) DIE STACK

    公开(公告)号:US20250006694A1

    公开(公告)日:2025-01-02

    申请号:US18215685

    申请日:2023-06-28

    Applicant: XILINX, INC.

    Abstract: Examples herein describe techniques for producing a three-dimensional (3D) die stack. The techniques include stacking a first die on top of a second die. The first die is offset from the second die in at least one of an x-direction and a y-direction, and a first routing sub-region of the first die aligns with a second routing sub-region of the second die. The techniques further include stacking a third die on top of the second die. The third die is offset from the second die in at least one of the x-direction and the y-direction, and a third routing sub-region of the third die aligns with a fourth routing sub-region of the second die.

    BUILDING MULTI-DIE FPGAS USING CHIP-ON-WAFER TECHNOLOGY

    公开(公告)号:US20240429145A1

    公开(公告)日:2024-12-26

    申请号:US18214381

    申请日:2023-06-26

    Applicant: XILINX, INC.

    Abstract: Embodiments herein describe techniques to build multi-die field-programmable gate arrays (FPGAs) using chip-on-wafer (CoW) technology. In an embodiment, FPGA chiplets (i.e., dies) and an interposer substrate include respective hybrid bonding connectors. Metal layers of the interposer substrate are patterned to provide inter-die communications amongst the multiple dies via the hybrid bonding connectors, and the dies communicate with one another via the hybrid bonding connectors using a non-serialized protocol native to the FPGA. The dies may communicate with one another through edge-based hybrid bonding connectors (e.g., in a symmetrical fashion). The metal layers of the interposer substrate may also support intra-die communications (e.g., data, clocks, and/or controls) and/or provide power, clock(s), and/or configuration parameters to the dies via hybrid bonding connectors within central regions of the dies. The IC device may include more than 1000 tracks per millimeter (e.g., more than 1600, 2800, 3500, or greater).

    PERFORMANCE EVALUATOR FOR A HETEROGENOUS HARDWARE PLATFORM

    公开(公告)号:US20240419626A1

    公开(公告)日:2024-12-19

    申请号:US18336777

    申请日:2023-06-16

    Applicant: Xilinx, Inc.

    Abstract: Performance evaluation of a heterogeneous hardware platform includes implementing a traffic generator design in an integrated circuit. The traffic generator design includes traffic generator kernels including a traffic generator kernel implemented in a data processing array of the integrated circuit and a traffic generator kernel implemented in a programmable logic of the integrated circuit. The traffic generator design is executed in the integrated circuit. The traffic generator kernels implement data access patterns by, at least in part, generating dummy data. Performance data is generated from executing the traffic generator design in the integrated circuit. The performance data is output from the integrated circuit.

    HIGH-LEVEL SYNTHESIS OF DESIGNS USING LOOP-AWARE EXECUTION INFORMATION

    公开(公告)号:US20240411967A1

    公开(公告)日:2024-12-12

    申请号:US18333372

    申请日:2023-06-12

    Applicant: Xilinx, Inc.

    Abstract: High-level synthesis of designs using loop-aware execution information includes generating, using computer hardware, an intermediate representation (IR) of a design specified in a high-level programming language. The design is for an integrated circuit. Execution information analysis is performed on the IR of the design generating analysis results for functions of the design. The analysis results of the design are transformed by embedding the analysis results in a plurality of regions of the IR of the design. Selected regions of the plurality of regions are merged based on the analysis results, as embedded, for the selected regions. The IR of the design is scheduled using the analysis results subsequent to the merging.

    DAC-based transmit driver architecture with improved bandwidth

    公开(公告)号:US12160256B2

    公开(公告)日:2024-12-03

    申请号:US17559592

    申请日:2021-12-22

    Applicant: XILINX, INC.

    Abstract: A DAC-based transmit driver architecture with improved bandwidth and techniques for driving data using such an architecture. One example transmit driver circuit generally includes an output node and a plurality of digital-to-analog converter (DAC) slices. Each DAC slice has an output coupled to the output node of the transmit driver circuit and includes a bias transistor having a drain coupled to the output of the DAC slice and a multiplexer having a plurality of inputs and an output coupled to a source of the bias transistor.

    DRIVER CIRCUITRY WITH REDUCED INTERSYMBOL INTERFERENCE JITTER

    公开(公告)号:US20240396550A1

    公开(公告)日:2024-11-28

    申请号:US18200432

    申请日:2023-05-22

    Applicant: XILINX, INC.

    Abstract: Driver circuitry for memory controller circuitry includes level shifter circuitry, inverter circuitry, and output circuitry. The level shifter circuitry receives an input data signal and outputs a first level shifted data signal and a second level shifted data signal based on the input data signal. The inverter circuitry is connected to the level shifter circuitry, receives the first level shifted data signal and the second level shifted data signal, and outputs a first inverted data signal via a first output node and a second inverted data signal via a second output node. The inverter circuitry includes mitigation circuitry coupled to the first output node and the second output node and alters one or more of the first inverted data signal and the second inverted data signal. The output circuitry outputs an output data signal based on the first inverted data signal and the second inverted data signal.

    Scalable acceleration of reentrant compute operations

    公开(公告)号:US12147379B2

    公开(公告)日:2024-11-19

    申请号:US18089780

    申请日:2022-12-28

    Applicant: XILINX, INC.

    Abstract: Examples herein describe techniques for performing parallel processing using a plurality of processing elements (PEs) and a controller for data that has data dependencies. For example, a calculation may require an entire row or column to be summed, or to determine its mean. The PEs can be assigned different chunks of a data set (e.g., a tensor set, a column, or a row) for processing. The PEs can use one or more tokens to inform the controller when they are done with partial processing of their data chunks. The controller can then gather the partial results and determine an intermediate value for the data set. The controller can then distribute this intermediate value to the PEs which then re-process their respective data chunks using the intermediate value to generate final results.

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