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30 条记录 (耗时 0.024 秒)

    Carrier transport material and electronic device
    11.
    发明申请
    Carrier transport material and electronic device 审中-公开
    载体运输材料和电子设备

    公开(公告)号：US20130320304A1

    公开(公告)日：2013-12-05

    申请号：US13481972

    申请日：2012-05-29

    申请人： Yi-Ming Chang ,  Rui Zhu

    发明人： Yi-Ming Chang ,  Rui Zhu

    IPC分类号： H01G9/028 ,  H01L51/46 ,  H01L51/54 ,  H01L51/30

    CPC分类号： C08K5/42 ,  C08G2261/124 ,  C08G2261/1424 ,  C08G2261/143 ,  C08G2261/312 ,  C08G2261/3142 ,  C08G2261/3223 ,  C08G2261/3228 ,  C08G2261/3246 ,  C08G2261/3327 ,  C08G2261/344 ,  C08G2261/51 ,  C08L65/00 ,  H01L51/0036 ,  H01L51/0043 ,  Y02E10/549

    摘要： A carrier transport material and an electronic device are provided. The carrier transport material includes a conjugated polyelectrolyte and a functional organic molecule. The conjugated polyelectrolyte includes a conjugated backbone and at least one alkyl side-chain, where a tail end of the alkyl side-chain has a first ionic group. The functional organic molecule includes a functional main-chain and a second ionic group located at a tail end of the functional organic molecule. Electrostatic attraction is formed between the first ionic group of the conjugated polyelectrolyte and the second ionic group of the functional organic molecule, and the carrier transport material presents an electrically neutral state.

    摘要翻译： 提供载体输送材料和电子装置。 载体传输材料包括共轭聚电解质和功能性有机分子。 共轭聚电解质包括共轭主链和至少一个烷基侧链，其中烷基侧链的尾端具有第一离子基团。 功能性有机分子包括功能性主链和位于功能性有机分子尾端的第二离子基团。 在共轭聚电解质的第一离子基团和功能性有机分子的第二离子基团之间形成静电吸引，并且载流子传输材料呈现电中性状态。

    CHIP PACKAGE AND METHOD FOR FORMING THE SAME
    12.
    发明申请
    CHIP PACKAGE AND METHOD FOR FORMING THE SAME 有权
    芯片包装及其形成方法

    公开(公告)号：US20130001621A1

    公开(公告)日：2013-01-03

    申请号：US13536628

    申请日：2012-06-28

    申请人： Chuan-Jin SHIU ,  Po-Shen LIN ,  Yi-Ming CHANG

    发明人： Chuan-Jin SHIU ,  Po-Shen LIN ,  Yi-Ming CHANG

    IPC分类号： H01L33/60

    CPC分类号： H01L27/14618 ,  H01L27/1463 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

    摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.

    摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 遮光层，其设置在所述基板的所述第二表面上并与所述导电层直接接触，其中所述遮光层具有大于约80％的遮光率并且具有暴露所述导电层的至少一个开口; 以及布置在所述遮光层的开口中以与所述导电层电接触的导电凸块，其中所述遮光层和所述导电凸起部分都基本上完全覆盖所述基板的第二表面。

    ELECTRONIC DEVICE CASING AND DISASSEMBLING METHOD THEREOF
    13.
    发明申请
    ELECTRONIC DEVICE CASING AND DISASSEMBLING METHOD THEREOF 审中-公开
    电子设备外壳及其拆卸方法

    公开(公告)号：US20120292099A1

    公开(公告)日：2012-11-22

    申请号：US13473618

    申请日：2012-05-17

    申请人： Yi-Ming Chang ,  Ping-Hsien Niu

    发明人： Yi-Ming Chang ,  Ping-Hsien Niu

    IPC分类号： H05K7/14 ,  B23P11/00

    CPC分类号： G06F1/1656 ,  Y10T29/49815

    摘要： The invention provides an electronic device casing, which includes a first shell, a second shell, at least one elastic element and at least one magnetic element. The first shell has a first engage portion. The second shell is disposed at a side of the first shell. The elastic element is disposed between the magnetic element and the second shell, and the magnetic element is pushed towards the first engage portion under an elastic force of the elastic element so as to prevent the second shell separating from the first shell. In addition, a disassembling method of the electronic device casing is also provided.

    摘要翻译： 本发明提供了一种电子设备外壳，其包括第一外壳，第二外壳，至少一个弹性元件和至少一个磁性元件。 第一壳体具有第一接合部分。 第二壳体设置在第一壳体的一侧。 弹性元件设置在磁性元件和第二壳体之间，并且在弹性元件的弹性力下将磁性元件推向第一接合部分，以防止第二壳体与第一壳体分离。 此外，还提供了电子设备外壳的拆卸方法。

    DESICCATING CONTAINER
    14.
    发明申请
    DESICCATING CONTAINER 有权
    设计集装箱

    公开(公告)号：US20120193246A1

    公开(公告)日：2012-08-02

    申请号：US13152688

    申请日：2011-06-03

    申请人： YI MING CHANG

    发明人： YI MING CHANG

    IPC分类号： B65D81/26

    CPC分类号： B65D81/266 ,  B65D43/162 ,  B65D51/245 ,  B65D77/0493 ,  B65D2543/00092 ,  B65D2543/00296 ,  B65D2543/00537 ,  B65D2543/00629 ,  B65D2543/00685 ,  B65D2543/00842

    摘要： A desiccating container is provided in the present invention. The desiccating container includes an outer can having a cap; a first inner can having an outer side and configured in the outer can, wherein there is a gap provided between the outer can and the first inner can; and a second inner can circularly configured in the outer side and in the gap, and dividing the gap into an inner gap and an outer gap, wherein the first inner can is one of an insert and a desiccating element, and the second inner can is the other one thereof.

    摘要翻译： 在本发明中提供了一种干燥容器。 干燥容器包括具有盖的外罐; 第一内罐具有外侧并构造在外罐中，其中在外罐和第一内罐之间设置有间隙; 以及第二内罐，其在外侧和间隙中圆形地配置，并且将所述间隙分成内部间隙和外部间隙，其中所述第一内部罐是插入件和干燥元件中的一个，并且所述第二内部罐 另一个。

    Illumination device and operating method thereof and electronic apparatus having the same
    15.
    发明授权
    Illumination device and operating method thereof and electronic apparatus having the same 有权
    照明装置及其操作方法以及具有该照明装置的电子设备

    公开(公告)号：US08109655B2

    公开(公告)日：2012-02-07

    申请号：US12472708

    申请日：2009-05-27

    申请人： Kuo-Lun Kao ,  Yi Ming Chang ,  Chung-Teng Wu

    发明人： Kuo-Lun Kao ,  Yi Ming Chang ,  Chung-Teng Wu

    IPC分类号： F21V21/26

    CPC分类号： F21V33/0056 ,  F21S8/028 ,  F21Y2115/10 ,  G06F1/1616 ,  G06F1/1656

    摘要： An electronic apparatus includes an input device and an illumination device. The illumination device includes a chassis, an illumination module and a positioning mechanism. The module is pivotally connected to the chassis to be rotatable between a closed and an open position. The positioning mechanism is use for respectively positioning the illumination module in the closed and the open position. An operating method of the illumination device includes the following steps. First, a push force is applied to the module in the closed position. Then the module rotates from the closed position to the open position. The module enters a light-on state as arrived in the open position for illuminating the input device. Next, another push force is applied to the module in the open position, so that the module rotates to the closed position. The module enters a light-off state as arrived in the closed position.

    摘要翻译： 电子设备包括输入设备和照明设备。 照明装置包括底盘，照明模块和定位机构。 模块可枢转地连接到底盘以在闭合位置和打开位置之间旋转。 定位机构用于将照明模块分别定位在关闭位置和打开位置。 照明装置的操作方法包括以下步骤。 首先，在关闭位置对模块施加推力。 然后模块从关闭位置旋转到打开位置。 模块进入到达打开位置的点亮状态，用于照亮输入设备。 接下来，在打开位置将另一个推力施加到模块，使得模块旋转到关闭位置。 模块进入关闭状态，到达关闭位置。

    Shock Absorber and Assembling Method of Electronic Device Using the Same
    16.
    发明申请
    Shock Absorber and Assembling Method of Electronic Device Using the Same 审中-公开
    使用其的电子装置的减震器和组装方法

    公开(公告)号：US20100213649A1

    公开(公告)日：2010-08-26

    申请号：US12472750

    申请日：2009-05-27

    申请人： Hong Wen Lee ,  Yi Ming Chang

    发明人： Hong Wen Lee ,  Yi Ming Chang

    IPC分类号： F16F3/04 ,  H05K13/00

    CPC分类号： F16F15/06 ,  G06F1/183 ,  H05K1/0215 ,  H05K2201/0311 ,  H05K2201/09072 ,  H05K2201/1031 ,  Y02P70/611 ,  Y10T29/49002

    摘要： A shock absorber and an assembling method of an electronic device using the same are provided. The shock absorber includes a first connecting portion, a second connecting portion and a number of elastic arms. The two connecting portions respectively connect to a housing and a circuit board of the electronic device. Two ends of each elastic arm are respectively connected to the two connecting portions to buffer the relative movement between the housing and the circuit board. The method includes the following steps. First, the shock absorber including the first connecting portion, the second connecting portion and the elastic arms is provided. Then the second connecting portion is connected to a surface of the circuit board surrounding a through hole of the circuit board. After connecting the second connecting portion, the housing is connected to the first connecting portion.

    摘要翻译： 提供了一种使用其的电子设备的减震器和组装方法。 减震器包括第一连接部分，第二连接部分和多个弹性臂。 两个连接部分分别连接到电子设备的壳体和电路板。 每个弹性臂的两端分别连接到两个连接部分，以缓冲壳体和电路板之间的相对移动。 该方法包括以下步骤。 首先，提供包括第一连接部分，第二连接部分和弹性臂的减震器。 然后，第二连接部分连接到电路板的围绕电路板的通孔的表面。 在连接第二连接部分之后，壳体连接到第一连接部分。

    Voltage regulator and method for regulating voltage
    18.
    发明授权
    Voltage regulator and method for regulating voltage 有权
    电压调节器和调节电压的方法

    公开(公告)号：US06977826B2

    公开(公告)日：2005-12-20

    申请号：US10632418

    申请日：2003-08-01

    申请人： Hsin-Kai Huang ,  Jin-Kae Jang ,  Yi-Ming Chang ,  Wen-Jong Tu

    发明人： Hsin-Kai Huang ,  Jin-Kae Jang ,  Yi-Ming Chang ,  Wen-Jong Tu

    IPC分类号： H02J7/00 ,  H02M3/335

    CPC分类号： H02J7/0065 ,  H02M3/33507

    摘要： A voltage regulator for use in a charging device of a portable electronic apparatus is disclosed. The voltage regulator includes a transformer having a primary winding and a secondary winding, a switch circuit being controlled via a control end thereof so as to result in a variable current on the primary winding, a rectification circuit electrically connected to the secondary winding, and proceeding a charging operation in response to an induced current, and a micro-controller electrically connected to the switch circuit and generating a pulse width modulation (PWM) signal to the control end in response to the charging operation. In addition, a method for operating a voltage regulator is also disclosed.

    摘要翻译： 公开了一种用于便携式电子设备的充电装置中的电压调节器。 电压调节器包括具有初级绕组和次级绕组的变压器，开关电路通过其控制端被控制，从而导致初级绕组上的可变电流，与次级绕组电连接的整流电路，并且继续 响应于感应电流的充电操作，以及电连接到开关电路的微控制器，并且响应于充电操作而向控制端产生脉宽调制（PWM）信号。 此外，还公开了一种用于操作电压调节器的方法。

    Chip package and method for forming the same
    19.
    发明授权
    Chip package and method for forming the same 有权
    芯片封装及其形成方法

    公开(公告)号：US08890191B2

    公开(公告)日：2014-11-18

    申请号：US13536628

    申请日：2012-06-28

    申请人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Yi-Ming Chang

    发明人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Yi-Ming Chang

    IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L27/146

    CPC分类号： H01L27/14618 ,  H01L27/1463 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

    摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.

    摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 遮光层，其设置在所述基板的所述第二表面上并与所述导电层直接接触，其中所述遮光层具有大于约80％的遮光率并且具有暴露所述导电层的至少一个开口; 以及布置在所述遮光层的开口中以与所述导电层电接触的导电凸块，其中所述遮光层和所述导电凸起部分都基本上完全覆盖所述基板的第二表面。