公开(公告)号：US20070298581A1

公开(公告)日：2007-12-27

申请号：US11550780

申请日：2006-10-18

Applicant: Yu-Fu Kang

Inventor： Yu-Fu Kang

IPC: H01L21/20

CPC classification number: B81C1/0015

Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.

Abstract translation: 一种制造悬架结构的方法，包括提供衬底，形成孔和填充衬底上的孔的牺牲层，在衬底和牺牲层上形成图案化的光致抗蚀剂层，曝光一部分衬底的图案化光刻胶层和 牺牲层，在衬底上形成结构层，图案化光致抗蚀剂层和牺牲层，执行剥离工艺以去除图案化的光致抗蚀剂层和光致抗蚀剂图案之上的结构层，以及执行干蚀刻工艺以去除 牺牲层为了使结构层和孔变成悬架结构和腔室。

公开(公告)号：US20150210541A1

公开(公告)日：2015-07-30

申请号：US14504953

申请日：2014-10-02

Applicant: Yu-Fu Kang ,  Chiung-Cheng Lo

Inventor： Yu-Fu Kang ,  Chiung-Cheng Lo

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00285 ,  B81B7/0038 ,  B81B7/02 ,  B81B2207/015 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0792

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

Abstract translation: MEMS芯片包括盖层和复合器件层。 盖层包括基底。 衬底具有第一区域和第二区域，其中第一区域包括多个第一沟槽，而第二区域具有多个第二沟槽。 第一区域具有第一蚀刻图案密度，第二区域具有第二蚀刻图案密度，其中第一蚀刻图案密度高于第二蚀刻图案密度以形成不同压力的室。

公开(公告)号：US07533564B2

公开(公告)日：2009-05-19

申请号：US11381129

申请日：2006-05-02

Applicant: Chin-Chang Pan ,  Yu-Fu Kang

Inventor： Chin-Chang Pan ,  Yu-Fu Kang

IPC: G01F1/68

CPC classification number: B01L7/52 ,  B01L3/50857 ,  B01L2300/06 ,  B01L2300/0829 ,  B01L2300/0858 ,  B01L2300/1827

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract translation: 微型样品加热装置具有基板，设置在基板的第一表面上的微加热装置，具有垂直侧壁并对应于位于基板的第二表面中的微加热装置的空腔，以及位于基板的第二表面上的隔离结构 衬底的第二表面。 隔离结构具有对应于空腔的开口，并且空腔和开口形成样品室。

公开(公告)号：US07395706B2

公开(公告)日：2008-07-08

申请号：US11426015

申请日：2006-06-23

Applicant: Chin-Chang Pan ,  Yu-Fu Kang

Inventor： Chin-Chang Pan ,  Yu-Fu Kang

IPC: G01F1/68

CPC classification number: G01N25/00

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract translation: 微型样品加热装置具有基板，设置在基板的第一表面上的微加热装置，具有倾斜侧壁并对应于位于基板的第二表面中的微加热装置的空腔，以及位于基板上的隔离结构 衬底的第二表面。 隔离结构具有对应于空腔的开口，并且空腔和开口形成样品室。

公开(公告)号：US07393784B2

公开(公告)日：2008-07-01

申请号：US11550780

申请日：2006-10-18

Applicant: Yu-Fu Kang

Inventor： Yu-Fu Kang

IPC: H01L21/44

CPC classification number: B81C1/0015

Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.

Abstract translation: 一种制造悬架结构的方法，包括提供衬底，形成孔和填充衬底上的孔的牺牲层，在衬底和牺牲层上形成图案化的光致抗蚀剂层，曝光一部分衬底的图案化光刻胶层和 牺牲层，在衬底上形成结构层，图案化光致抗蚀剂层和牺牲层，执行剥离工艺以去除图案化的光致抗蚀剂层和光致抗蚀剂图案之上的结构层，以及执行干蚀刻工艺以去除 牺牲层为了使结构层和孔变成悬架结构和腔室。

公开(公告)号：US20080138923A1

公开(公告)日：2008-06-12

申请号：US11736593

申请日：2007-04-18

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/62

CPC classification number: B81C1/0015

Abstract: A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front surface of the substrate. The second sacrificial layer has an opening exposing a part of the substrate and a part of the first sacrificial layer. A structural layer is formed covering the abovementioned sacrificial layers. Thereafter, a lift-off process is performed to remove the second sacrificial layer and define the pattern of the structural layer. A first etching process is performed on a back surface of the substrate utilizing the first sacrificial layer as an etching barrier and a through hole is formed under the first sacrificial layer. A second etching layer is performed to remove the first sacrificial layer and a suspended structure is thereby formed.

Abstract translation: 公开了一种形成悬挂结构的方法。 首先，提供基板。 图案化的第一牺牲层和图案化的第二牺牲层形成在衬底的前表面上。 第二牺牲层具有暴露基板的一部分和第一牺牲层的一部分的开口。 覆盖上述牺牲层的结构层被形成。 此后，执行剥离处理以去除第二牺牲层并限定结构层的图案。 利用第一牺牲层作为蚀刻阻挡层，在基板的背面上进行第一蚀刻工艺，并且在第一牺牲层下形成通孔。 执行第二蚀刻层以去除第一牺牲层，由此形成悬挂结构。

公开(公告)号：US20080135527A1

公开(公告)日：2008-06-12

申请号：US11736594

申请日：2007-04-18

Applicant: Yu-Fu Kang

Inventor： Yu-Fu Kang

IPC: H05B1/00 ,  C23C14/04

CPC classification number: H05B3/265 ,  C23C14/185

Abstract: A superalloy micro-heating apparatus includes a substrate, an isolation layer on a front surface of the substrate, a patterned heating resistor, and a contact electrode on the heating resistor. The material of the heating resistor includes superalloy material that has the advantages of corrosion-resistance, high-resistance, rapid-thermal increase, and high-temperature resistance. For these reasons, the superalloy micro-heating resistor has an improved reliability and yield.

Abstract translation: 超合金微加热装置包括基板，衬底前表面上的隔离层，图案化加热电阻器和加热电阻器上的接触电极。 加热电阻器的材料包括具有耐腐蚀性，高电阻，快速热增加和耐高温性的优点的超合金材料。 由于这些原因，超级合金微加热电阻器的可靠性和产率提高了。

公开(公告)号：US09206032B1

公开(公告)日：2015-12-08

申请号：US14637056

申请日：2015-03-03

Applicant: Yu-Fu Kang ,  Chiung-C. Lo

Inventor： Yu-Fu Kang ,  Chiung-C. Lo

IPC: B81B3/00

CPC classification number: B81B7/0058

Abstract: The present invention discloses a MEMS chip which includes a device wafer and a cap wafer. The device wafer includes a first substrate and a MEMS device. The MEMS device includes a movable structure. The cap wafer includes a second substrate, an elastic structure and a stopper. The stopper is connected to the second substrate by the elastic structure. The stopper constrains a movement of the movable structure, and when the movable structure contacts the stopper, the elastic structure provides a resilience force to the stopper.

Abstract translation: 本发明公开了一种包括器件晶片和盖晶片的MEMS芯片。 器件晶片包括第一衬底和MEMS器件。 MEMS器件包括可移动结构。 盖晶片包括第二基板，弹性结构和止动件。 止动件通过弹性结构连接到第二基板。 止动器限制可移动结构的移动，并且当可移动结构接触止动件时，弹性结构向止动件提供弹性力。

公开(公告)号：US07531457B2

公开(公告)日：2009-05-12

申请号：US11561902

申请日：2006-11-21

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/20

CPC classification number: B81C1/0015 ,  B81C2201/0108 ,  B81C2201/0132

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract translation: 一种制造悬挂结构的方法。 首先，提供包含通过热硬化的光致抗蚀剂层的基板。 随后，蚀刻硬化的光致抗蚀剂层，以使光致抗蚀剂层变成预定的边缘轮廓。 此后，在基板的一部分和光致抗蚀剂层的一部分上形成结构层。 接下来，进行干蚀刻处理以去除光致抗蚀剂层，并将结构层转变成悬浮结构。

公开(公告)号：US07465601B2

公开(公告)日：2008-12-16

申请号：US11736593

申请日：2007-04-18

Applicant: Yu-Fu Kang ,  Chen-Hsiung Yang

Inventor： Yu-Fu Kang ,  Chen-Hsiung Yang

IPC: H01L21/62

CPC classification number: B81C1/0015

Abstract: A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front surface of the substrate. The second sacrificial layer has an opening exposing a part of the substrate and a part of the first sacrificial layer. A structural layer is formed covering the abovementioned sacrificial layers. Thereafter, a lift-off process is performed to remove the second sacrificial layer and define the pattern of the structural layer. A first etching process is performed on a back surface of the substrate utilizing the first sacrificial layer as an etching barrier and a through hole is formed under the first sacrificial layer. A second etching layer is performed to remove the first sacrificial layer and a suspended structure is thereby formed.

Abstract translation: 公开了一种形成悬挂结构的方法。 首先，提供基板。 图案化的第一牺牲层和图案化的第二牺牲层形成在衬底的前表面上。 第二牺牲层具有暴露基板的一部分和第一牺牲层的一部分的开口。 形成覆盖上述牺牲层的结构层。 此后，执行剥离处理以去除第二牺牲层并限定结构层的图案。 利用第一牺牲层作为蚀刻阻挡层，在基板的背面上进行第一蚀刻工艺，并且在第一牺牲层下形成通孔。 执行第二蚀刻层以去除第一牺牲层，由此形成悬挂结构。