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公开(公告)号：US20160096728A1
公开(公告)日：2016-04-07
申请号：US14966562
申请日：2015-12-11
Applicant: Yu-Fu Kang , Chiung-Cheng Lo
Inventor： Yu-Fu Kang , Chiung-Cheng Lo
IPC: B81C1/00
CPC classification number: B81C1/00285 , B81B7/0038 , B81B7/02 , B81B2207/015 , B81C2201/013 , B81C2201/019 , B81C2203/0792
Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.
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2.发明授权Micro-electro-mechanical system (MEMS) device including an internal anchor area 有权微机电系统（MEMS）装置包括内部锚定区域公开(公告)号：US09562926B2
公开(公告)日：2017-02-07
申请号：US14708140
申请日：2015-05-08
Applicant: Chiung-Wen Lin , Chiung-Cheng Lo , Yu-Fu Kang
Inventor： Chiung-Wen Lin , Chiung-Cheng Lo , Yu-Fu Kang
IPC: G01P15/00 , G01P15/18 , G01P15/125 , G01P15/08
CPC classification number: G01P15/18 , G01P15/125 , G01P2015/082
Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.
Abstract translation: 本发明提供一种MEMS装置。 MEMS器件包括：衬底，校准块，弹簧，弹簧锚，第一电极锚和第二电极锚，第一固定电极和第二固定电极。 检测质量通过弹簧和弹簧锚连接到基板。 检测质量体包括内部的中空结构，弹簧锚固件，第一电极锚固件和第二电极锚固件位于中空结构中。 检测质量和第一固定电极形成第一电容器，并且检测质量块和第二固定电极形成第二电容器。 在第一电极锚固件，第二电极锚固件和弹簧锚固件之间，没有任何部分的证明质量和任何固定电极的任何部分。
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公开(公告)号：US20160169927A1
公开(公告)日：2016-06-16
申请号：US14708140
申请日：2015-05-08
Applicant: Chiung-Wen Lin , Chiung-Cheng Lo , Yu-Fu Kang
Inventor： Chiung-Wen Lin , Chiung-Cheng Lo , Yu-Fu Kang
IPC: G01P1/00
CPC classification number: G01P15/18 , G01P15/125 , G01P2015/082
Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.
Abstract translation: 本发明提供一种MEMS装置。 MEMS器件包括：衬底，校准块，弹簧，弹簧锚，第一电极锚和第二电极锚，第一固定电极和第二固定电极。 检测质量通过弹簧和弹簧锚连接到基板。 检测质量体包括内部的中空结构，弹簧锚固件，第一电极锚固件和第二电极锚固件位于中空结构中。 检测质量和第一固定电极形成第一电容器，并且检测质量块和第二固定电极形成第二电容器。 在第一电极锚固件，第二电极锚固件和弹簧锚固件之间，没有任何部分的证明质量和任何固定电极的任何部分。
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公开(公告)号：US20150259195A1
公开(公告)日：2015-09-17
申请号：US14643531
申请日：2015-03-10
Applicant: Chiung-Cheng Lo , Yu-Fu Kang , Ning-Yuan Wang , Chiung-Wen Lin
Inventor： Chiung-Cheng Lo , Yu-Fu Kang , Ning-Yuan Wang , Chiung-Wen Lin
CPC classification number: H01L25/00 , B81C1/00238 , B81C2203/0792 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
Abstract translation: 本发明提供了一种微电子机械系统（MEMS）模块，其包括堆叠在电子电路管芯上的MEMS管芯。 所述电子电路管芯包括衬底，所述衬底包括贯穿所述衬底的至少一个穿硅通孔（TSV）; 和至少一个电子电路。 电子电路包括电路区域和直接连接TSV的信号传输层。 至少一根导线连接在MEMS管芯的中间部分和TSV之间。 在MEMS管芯堆叠在其上并与电子电路管芯接合的接口位置处没有信号通信。
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公开(公告)号：US09362257B2
公开(公告)日：2016-06-07
申请号：US14643531
申请日：2015-03-10
Applicant: Chiung-Cheng Lo , Yu-Fu Kang , Ning-Yuan Wang , Chiung-Wen Lin
Inventor： Chiung-Cheng Lo , Yu-Fu Kang , Ning-Yuan Wang , Chiung-Wen Lin
CPC classification number: H01L25/00 , B81C1/00238 , B81C2203/0792 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.
Abstract translation: 本发明提供了一种微电子机械系统（MEMS）模块，其包括堆叠在电子电路管芯上的MEMS管芯。 所述电子电路管芯包括衬底，所述衬底包括贯穿所述衬底的至少一个穿硅通孔（TSV）; 和至少一个电子电路。 电子电路包括电路区域和直接连接TSV的信号传输层。 至少一根导线连接在MEMS管芯的中间部分和TSV之间。 在MEMS管芯堆叠在其上并与电子电路管芯接合的接口位置处没有信号通信。
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Patent Agency Ranking
公开(公告)号：US20150210541A1
公开(公告)日：2015-07-30
申请号：US14504953
申请日：2014-10-02
Applicant: Yu-Fu Kang , Chiung-Cheng Lo
Inventor： Yu-Fu Kang , Chiung-Cheng Lo
CPC classification number: B81C1/00285 , B81B7/0038 , B81B7/02 , B81B2207/015 , B81C2201/013 , B81C2201/019 , B81C2203/0792
Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.
Abstract translation: MEMS芯片包括盖层和复合器件层。 盖层包括基底。 衬底具有第一区域和第二区域，其中第一区域包括多个第一沟槽，而第二区域具有多个第二沟槽。 第一区域具有第一蚀刻图案密度，第二区域具有第二蚀刻图案密度，其中第一蚀刻图案密度高于第二蚀刻图案密度以形成不同压力的室。
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公开(公告)号：US20070298613A1
公开(公告)日：2007-12-27
申请号：US11461768
申请日：2006-08-01
Applicant: Yu-Fu Kang
Inventor： Yu-Fu Kang
IPC: H01L21/302
CPC classification number: B81C1/0015
Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a first photoresist pattern on the substrate, heating the first photoresist pattern to harden it as a sacrificial layer, forming a second photoresist pattern on the substrate and the sacrificial layer, the second photoresist pattern exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the second photoresist pattern, and the sacrificial layer, performing a lift off process to remove the second photoresist pattern and the structure layer above the second photoresist pattern, and performing a dry etching process to remove the sacrificial layer in order to make the structure layer become the suspension structure.
Abstract translation: 一种制造悬架结构的方法，包括提供基板，在基板上形成第一光致抗蚀剂图案，加热第一光致抗蚀剂图案以硬化其作为牺牲层，在基板和牺牲层上形成第二光致抗蚀剂图案，第二光致抗蚀剂 在衬底，第二光致抗蚀剂图案和牺牲层上形成结构层，执行剥离工艺以除去第二光致抗蚀剂图案和第二光致抗蚀剂图案之上的结构层的图案，暴露衬底和牺牲层的一部分 ，并且进行干蚀刻工艺以去除牺牲层，以使结构层变成悬浮结构。
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公开(公告)号：US20070298581A1
公开(公告)日：2007-12-27
申请号：US11550780
申请日：2006-10-18
Applicant: Yu-Fu Kang
Inventor： Yu-Fu Kang
IPC: H01L21/20
CPC classification number: B81C1/0015
Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a hole and a sacrificial layer filling the hole on the substrate, forming a patterned photoresist layer on the substrate and the sacrificial layer, the patterned photoresist layer exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the patterned photoresist layer, and the sacrificial layer, performing a lift off process to remove the patterned photoresist layer and the structure layer above the photoresist pattern, and performing a dry etch process to remove the sacrificial layer in order to make the structure layer and the hole become the suspension structure and the chamber.
Abstract translation: 一种制造悬架结构的方法，包括提供衬底，形成孔和填充衬底上的孔的牺牲层，在衬底和牺牲层上形成图案化的光致抗蚀剂层，曝光一部分衬底的图案化光刻胶层和 牺牲层，在衬底上形成结构层，图案化光致抗蚀剂层和牺牲层，执行剥离工艺以去除图案化的光致抗蚀剂层和光致抗蚀剂图案之上的结构层，以及执行干蚀刻工艺以去除 牺牲层为了使结构层和孔变成悬架结构和腔室。
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公开(公告)号：US20130266774A1
公开(公告)日：2013-10-10
申请号：US13491024
申请日：2012-06-07
Applicant: Pinyen Lin , Yu-Fu Kang
Inventor： Pinyen Lin , Yu-Fu Kang
CPC classification number: B81B7/0077 , B81B2201/047 , Y10T428/24752 , Y10T428/24777
Abstract: A package structure and a packaging method for manufacturing the package structure are provided. The package structure comprises a cover wafer, a device wafer and a bonding material. The cover wafer has an optical element, and a surface of the cover wafer is defined with a height difference that is greater than 20 micrometers. The bonding material has a width and continuously surrounds the optical device, and is disposed between the cover wafer and the device wafer, in which the width is between 10 micrometers and 150 micrometers. The bonding material hermetically bonds the cover wafer and the device wafer to make a leakage rate of the package structure less than 5e−8 atm-cc/sec.
Abstract translation: 提供了用于制造封装结构的封装结构和封装方法。 封装结构包括盖晶片，器件晶片和接合材料。 覆盖晶片具有光学元件，并且盖晶片的表面被限定为具有大于20微米的高度差。 接合材料具有宽度并且连续地围绕光学器件，并且设置在覆盖晶片和器件晶片之间，其中宽度在10微米到150微米之间。 接合材料密封盖玻片和器件晶片，以使封装结构的泄漏率小于5e-8atm-cc / sec。
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公开(公告)号：US07432208B2
公开(公告)日：2008-10-07
申请号：US11461768
申请日：2006-08-01
Applicant: Yu-Fu Kang
Inventor： Yu-Fu Kang
IPC: H01L21/302 , H01L21/461
CPC classification number: B81C1/0015
Abstract: A method of manufacturing a suspension structure including providing a substrate, forming a first photoresist pattern on the substrate, heating the first photoresist pattern to harden it as a sacrificial layer, forming a second photoresist pattern on the substrate and the sacrificial layer, the second photoresist pattern exposing a part of the substrate and the sacrificial layer, forming a structure layer on the substrate, the second photoresist pattern, and the sacrificial layer, performing a lift off process to remove the second photoresist pattern and the structure layer above the second photoresist pattern, and performing a dry etching process to remove the sacrificial layer in order to make the structure layer become the suspension structure.
Abstract translation: 一种制造悬架结构的方法，包括提供基板，在基板上形成第一光致抗蚀剂图案，加热第一光致抗蚀剂图案以硬化其作为牺牲层，在基板和牺牲层上形成第二光致抗蚀剂图案，第二光致抗蚀剂 在衬底，第二光致抗蚀剂图案和牺牲层上形成结构层，执行剥离工艺以除去第二光致抗蚀剂图案和第二光致抗蚀剂图案之上的结构层的图案，暴露衬底和牺牲层的一部分 ，并且进行干蚀刻工艺以去除牺牲层，以使结构层变成悬浮结构。
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